Integrator’s Reference Manual

Note

Globalstar frequencies are attenuated by wet snow. When mounting the

antenna in a snowy location, you must make provisions to prevent snow

 

 

buildup on the antenna. Wet ice/snow must be restricted to a maximum

 

thickness of 20 centimeters (8 inches) by suitably mounting the

 

antenna. See Mounting and Sealing Antennas on Poles on page 7-29.

Securing Antenna Cables

When connecting the antenna cables, the recommended torque for the SMA connectors is 0.79 to 1.13 N⋅m (7 to 10 in⋅lb).

Mounting and Sealing Antennas on Flat Surfaces

You can mount the modem antenna (DRA) on a flat surface with six M4 screws. Depending on whether the surface is smooth or rough, different methods are recommended for sealing out moisture and dirt from the antenna’s SMA connectors, which are not sealing connectors.

If the surface is smooth, flat, and solid, you can use an O-ring to protect the antenna’s connectors. The O-ring should be 2.050 inches in diameter by 0.103 inch wide, to fit within the groove on the bottom of the antenna. Silicone or ethylene- propylene is the preferred material.

A recommended source is:

Parker Seal Group

18321 Jamboree Rd.

Irvine, CA 92612-1073 Tel: 800/272-7537 Fax: 949/851-2127

Parker part number: 2-137 E515-80

Description: O-ring, ethylene-propylene, 2.050 inches diameter by 0.103 inch thick, 80 durometer

If you are mounting the antenna on rough surfaces, surfaces which have already suffered significant environmental damage (pitting, peeling paint, etc.), or surfaces that are not sufficiently flat, it is recommended that you do not use an O-ring. O-rings need smooth, flat surfaces to work.

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Qualcomm GSP-1620 specifications Securing Antenna Cables, Mounting and Sealing Antennas on Flat Surfaces
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GSP-1620 specifications

Qualcomm GSP-1620 is a powerful, cutting-edge SoC (System on Chip) that is tailored for the demands of modern mobile and embedded applications. Designed to deliver high performance, energy efficiency, and advanced connectivity, the GSP-1620 stands out in the competitive landscape of processor solutions.

One of the main features of the GSP-1620 is its multi-core architecture, which facilitates simultaneous processing of multiple tasks. This architecture ensures enhanced multitasking capabilities, allowing devices to run complex applications smoothly without compromising performance. The GSP-1620 integrates Qualcomm's latest Kryo CPU technology, which optimizes performance while maintaining lower power consumption.

The GSP-1620 excels in graphics performance, powered by Adreno GPU technology. This integration enables rich visual experiences, making it ideal for gaming, augmented reality, and immersive multimedia applications. The GPU's capabilities allow for high frame rates and stunning graphics, ensuring that users enjoy a premium visual experience.

In terms of connectivity, the GSP-1620 supports advanced wireless technologies, including 5G, Wi-Fi 6, and Bluetooth 5. With these capabilities, users can expect ultra-fast data speeds, low latency, and improved networking performance. The integration of Qualcomm’s Snapdragon X55 modem enhances the SoC's capability to deliver seamless connectivity in various environments, whether indoors or outdoors.

Moreover, the GSP-1620 features cutting-edge AI and machine learning capabilities, enabled by Qualcomm’s Hexagon DSP technology. This allows for efficient processing of AI tasks, supporting functionalities such as voice recognition, image processing, and real-time translation. It makes the GSP-1620 suitable for applications in smart devices, automotive solutions, and industrial IoT.

Security is a priority in the design of the GSP-1620. The SoC incorporates hardware-based security features that protect sensitive data and applications, ensuring robust defense against cyber threats. This is vital for applications requiring high levels of security, such as mobile payments and confidential communications.

Lastly, the GSP-1620 is designed with scalability in mind. Its modular architecture allows manufacturers to customize the chipset according to specific needs, making it a versatile solution for a broad range of devices, from smartphones and tablets to wearables and embedded systems.

In summary, Qualcomm GSP-1620 combines high-performance processing, advanced graphics capabilities, sophisticated connectivity options, AI support, and robust security features. With these characteristics, it sets a new standard for mobile and embedded platforms, driving innovation in a variety of industries.
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