Integrator’s Reference Manual

QUALCOMM Incorporated does not accept any responsibility for regulatory compliance of the OEM product. It is the responsibility of the OEM manufacturer to ensure that all regulatory requirements (e.g., FAA, Hazardous Location) have been met for the specific application.

Federal Communications Commission (FCC)

The GSP-1620 modem configured with the QUALCOMM- supplied antenna and RF cabling is compliant and approved in accordance with the FCC Code of Federal Rules (CFR) 47 parts:

•Part 1 Para 1.1310 Radio Frequency Radiation Exposure Limits

•Part 15 Radio Frequency Devices

•Part 25 Satellite Communications

European R&TTE Directive 1999/5/EC

The GSP-1620 modem configured with the QUALCOMM- supplied antenna and RF cabling is compliant and approved in accordance with the essential requirements of the European Community, under European Directive 1999/5/EC On Radio Equipment & Telecommunications Terminal Equipment (R&TTE Directive).

The supporting technical standards used to demonstrate compliance are:

•EN 300 831 Electromagnetic Compatibility

•EN 301 441 (TBR 041) Essential Terminal Requirements

B-2

80-99208-1 Rev. D

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Qualcomm GSP-1620 specifications Federal Communications Commission FCC, European R&TTE Directive 1999/5/EC
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GSP-1620 specifications

Qualcomm GSP-1620 is a powerful, cutting-edge SoC (System on Chip) that is tailored for the demands of modern mobile and embedded applications. Designed to deliver high performance, energy efficiency, and advanced connectivity, the GSP-1620 stands out in the competitive landscape of processor solutions.

One of the main features of the GSP-1620 is its multi-core architecture, which facilitates simultaneous processing of multiple tasks. This architecture ensures enhanced multitasking capabilities, allowing devices to run complex applications smoothly without compromising performance. The GSP-1620 integrates Qualcomm's latest Kryo CPU technology, which optimizes performance while maintaining lower power consumption.

The GSP-1620 excels in graphics performance, powered by Adreno GPU technology. This integration enables rich visual experiences, making it ideal for gaming, augmented reality, and immersive multimedia applications. The GPU's capabilities allow for high frame rates and stunning graphics, ensuring that users enjoy a premium visual experience.

In terms of connectivity, the GSP-1620 supports advanced wireless technologies, including 5G, Wi-Fi 6, and Bluetooth 5. With these capabilities, users can expect ultra-fast data speeds, low latency, and improved networking performance. The integration of Qualcomm’s Snapdragon X55 modem enhances the SoC's capability to deliver seamless connectivity in various environments, whether indoors or outdoors.

Moreover, the GSP-1620 features cutting-edge AI and machine learning capabilities, enabled by Qualcomm’s Hexagon DSP technology. This allows for efficient processing of AI tasks, supporting functionalities such as voice recognition, image processing, and real-time translation. It makes the GSP-1620 suitable for applications in smart devices, automotive solutions, and industrial IoT.

Security is a priority in the design of the GSP-1620. The SoC incorporates hardware-based security features that protect sensitive data and applications, ensuring robust defense against cyber threats. This is vital for applications requiring high levels of security, such as mobile payments and confidential communications.

Lastly, the GSP-1620 is designed with scalability in mind. Its modular architecture allows manufacturers to customize the chipset according to specific needs, making it a versatile solution for a broad range of devices, from smartphones and tablets to wearables and embedded systems.

In summary, Qualcomm GSP-1620 combines high-performance processing, advanced graphics capabilities, sophisticated connectivity options, AI support, and robust security features. With these characteristics, it sets a new standard for mobile and embedded platforms, driving innovation in a variety of industries.
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