
Specifications
1-22 TDS5000B Series Specifications and PerformanceVerificationTable1- 9: Mechanical specifications (Cont.)Characteristic Description
Construction material Chassis parts constructed of aluminum alloy; front-panel
constructed of plastic laminate; circuit boards constructed
of glass laminate; outer shell molded and textured from a
polycarbonate/ABS blend
Table1- 10: Environmental specificationsCharacteristic Description
Temperature
Operating +5°Cto+45°C(+41°Fto+113°F)
+15°Cto+45°C〈+59°Fto+113 °F)with integrated
printer,Option 1P, installed
Nonoperating --2 0 °Cto+60°C(--4°F to +140 °F)
Humidity
Operating 20% to 80% relative humidity with a maximum wet bulb
temperature of +29 °C (84.2 °F) at or below +45 °C
(113 °F),noncondensing
Upperlimit derated to 30% relative humidity at +45 °C
(113°F)
Nonoperating With no diskette in floppy disk drive
5% to 90% relative humidity with a maximum wet bulb
temperature of +29 °C (84.2 °F) at or below +60 °C
(+140 °F),noncondensing
Upperlimit derated to 20% relative humidity at +60 °C
(+140°F)
Altitude
Operating 10,000 ft (3,048 m)
Nonoperating 40,000ft (12, 190 m)
Random vibration
Operating 0.1 gRMimesS from 5 Hz to 500 Hz, 10 minutes on each
axis
Nonoperating 2.0gRMS from 5 Hz to 500 Hz, 10 m inutes on each axis
Shock, nonoperating 30 g (11 ms half-sine wave) or less