Thermal/Mechanical Reference Design

Figure 2-18. 1U CEK Heatsink Thermal Performance

2.5.6Thermal Profile Adherence

The 2U+ CEK Intel reference thermal solution is designed to meet the Thermal Profile A for the Quad-Core Intel® Xeon® Processor 5400 Series. From Table 2-4, the three- sigma (mean+3sigma) performance of the thermal solution is computed to be 0.187 °C/W and the processor local ambient temperature (TLA) for this thermal solution is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as:

Equation 2-8.y = 0.187*X + 40

where,

y = Processor TCASE value (°C) x = Processor power value (W)

Figure 2-19below shows the comparison of this reference thermal solution’s Thermal Profile to the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile A specification. The 2U+ CEK solution meets the Thermal Profile A with a 0.6°C margin at the upper end (TDP). By designing to Thermal Profile A, it is ensured that no measurable performance loss due to TCC activation is observed under the given environmental conditions.

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Quad-Core Intel® Xeon® Processor 5400 Series TMDG

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Intel 5400 Series manual Thermal Profile Adherence, Equation 2-8.y = 0.187*X +