Intel 5400 Series manual 1UCEKReference Solution, Equation 2-10.y = 0.246*X +

Thermal/Mechanical Reference Design

Figure 2-20. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile B

	70	TCASE_MAX_B@ TDP
	65
	60
						Thermal Profile B
C)						Y= 0.221 * X+ 43.5
													1UCEKReference Solution
Temperature(	55
															Y=0.246 * X+ 40
	50
	45
	40																				120
	0	5	10	15	20	25	30	35	40	45	50	55	60	65	70	75	80	90	100	110
													Power (W)								TDP

The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile specification for the Quad-Core Intel® Xeon® Processor E5400 Series. From Table 2-7the three-sigma (mean+3sigma) performance of the thermal solution is computed to be 0.246 °C/W and the processor local ambient temperature (TLA) for this thermal solution is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as:

Equation 2-10.y = 0.246*X + 40

where,

y = Processor TCASE value (°C) x = Processor power value (W)

Figure 2-21below shows the comparison of this reference thermal solution’s Thermal Profile to the Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile specification. The 1U CEK solution meets the Thermal Profile with 7.3°C margin at the upper end (TDP). By designing to Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile, it is ensured that no measurable performance loss due to TCC activation is observed under the given environmental conditions.

44 Quad-Core Intel® Xeon® Processor 5400 Series TMDG