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manual Quad-Core Intel Xeon Processor 5400 Series Tmdg
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5400 Series
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Dimension
Preload Test Configuration
Assembly Drawing
Test Procedure Examples
Structural Reliability Testing
Safety
Fan Power Supply
Heatsink Solutions
Intel Enabled Suppliers
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Quad-Core
Intel® Xeon® Processor 5400 Series TMDG
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Contents
Quad-Core Intel Xeon Processor 5400 Series
Thermal/Mechanical Design Guidelines
Quad-Core Intel Xeon Processor 5400 Series Tmdg
Contents
Figures
Preload Test Configuration
Tables
Reference Revision Description Date Number
Initial release of the document
Quad-Core Intel Xeon Processor 5400 Series Tmdg
References
Objective
Scope
Term Description
Definition of Terms
Terms and Descriptions Sheet 1
Terms and Descriptions Sheet 2
TDP
Introduction
Mechanical Requirements
Processor Mechanical Parameters
Processor Mechanical Parameters Table
Parameter Minimum Maximum Unit
Quad-Core Intel Xeon Processor 5400 Series Package
Thermal/Mechanical Reference Design
Thermal/Mechanical Reference Design
Thermal/Mechanical Reference Design
Quad-Core Intel Xeon Processor 5400 Series Considerations
Processor Thermal Parameters and Features
Thermal Control Circuit and TDP
Digital Thermal Sensor
Multiple Digital Thermal Sensor Operation
Platform Environmental Control Interface Peci
Multiple Core Special Considerations
Thermal Monitor for Multiple Core Products
PROCHOT#, THERMTRIP#, and FORCEPR#
Heatpipe Orientation for Multiple Core Processors
Processor Input Processor Output
Processor Core Geometric Center Dimensions
Feature Dimension
Thermal Profile
Equation 2-1.y = ax + b
Tcontrol Definition
Equation 2-2.TCONTROL= -TOFFSET
Tcontrol and Thermal Profile Interaction
Thermal Profile B
Performance Targets
Thermal/Mechanical Reference Design
Thermal/Mechanical Reference Design
1U CEK, Thermal Profile B
Parameter Maximum Unit
2U+ CEK, Thermal Profile a
1U Alternative Heatsink
Fan Fail Guidelines
Sea-Level
Characterizing Cooling Solution Performance Requirements
Fan Speed Control
Processor Thermal Characterization Parameter Relationships
Fan Speed Control, Tcontrol and DTS Relationship
Equation 2-3.ΨCA= Tcase TLA / TDP
Condition FSC Scheme
Example
Equation 2-4.ΨCA= ΨCS + ΨSA
Chassis Thermal Design Considerations
Chassis Thermal Design Capabilities and Improvements
Equation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W
Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/W
Heatsink Design Considerations
Heatsink Solutions
Thermal/Mechanical Reference Design Considerations
Thermal Interface Material
Summary
Assembly Drawing
Geometric Envelope
Structural Considerations of CEK
Thermal Solution Performance Characteristics
17 U+ CEK Heatsink Thermal Performance
Thermal Profile Adherence
Equation 2-8.y = 0.187*X +
=0.187* X +40
Equation 2-9.y = 0.246*X +
1UCEKReference Solution
Equation 2-10.y = 0.246*X +
Components Overview
Heatsink with Captive Screws and Standoffs
22. Isometric View of the 2U+ CEK Heatsink
CEK Heatsink Thermal Mechanical Characteristics
Recommended Thermal Grease Dispense Weight
Thermal Interface Material TIM
Processor Minimum Maximum Units
CEK Spring
24. CEK Spring Isometric View
Thermal/Mechanical Reference Design
Description Min Typ Max Unit Steady Startup
Fan Power Supply
Fan Specifications Boxed 4-wire PWM/DTS Heatsink Solution
Boxed Processor Contents
Systems Considerations Associated with the Active CEK
Thermal/Mechanical Reference Design
Component Overview
Figure A-1. Isometric View of the 1U Alternative Heatsink
Equation A-1. y = 0.331*x +
Thermal Solution Performance Characterics
Thermal Profile Adherence
= Processor power value W
1U Alternative Heatsink Thermal/Mechanical Design
Table B-1. Mechanical Drawing List
Drawing Description
Figure B-1 2U CEK Heatsink Sheet 1
Figure B-2 2U CEK Heatsink Sheet 2
Figure B-3 U CEK Heatsink Sheet 3
Figure B-4 2U CEK Heatsink Sheet 4
Figure B-5. CEK Spring Sheet 1
Figure B-6. CEK Spring Sheet 2
Figure B-7. CEK Spring Sheet 3
Mechanical Drawings
Mechanical Drawings
Mechanical Drawings
Mechanical Drawings
Mechanical Drawings
Mechanical Drawings
Figure B-14 U CEK Heatsink Sheet 1
Figure B-15 U CEK Heatsink Sheet 2
Figure B-16 U CEK Heatsink Sheet 3
Figure B-17 U CEK Heatsink Sheet 4
Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1
Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2
Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3
Figure B-21 U Alternative Heatsink 1
Figure B-22 U Alternative Heatsink 2
Figure B-23 U Alternative Heatsink 3
Figure B-24 U Alternative Heatsink 4
Mechanical Drawings
Heatsink Preparation
Overview
Test Preparation
Alternate Heatsink Sample Preparation
Figure C-3. Preload Test Configuration
Test Procedure Examples
Time-Zero, Room Temperature Preload Measurement
Typical Test Equipment
Table C-1. Typical Test Equipment
Preload Degradation under Bake Conditions
Heatsink Clip Load Methodology
Safety Requirements
Safety Requirements
Environmental Reliability Testing
Structural Reliability Testing
Intel Verification Criteria for the Reference Designs
Reference Heatsink Thermal Verification
Table E-1 Use Conditions Environment
2.2 Recommended Test Sequence
Post-Test Pass Criteria
Recommended BIOS/Processor/Memory Test Procedures
Material and Recycling Requirements
Quality and Reliability Requirements
Intel Enabled Suppliers
Supplier Information
Additional Suppliers
For 1U
2U Heatsink Alternative CEK Copper Fin
Alternative CEK Copper Fin
Enabled Suppliers Information
100 Quad-Core Intel Xeon Processor 5400 Series Tmdg
