Quality and Reliability Requirements
3.No signs of physical damage on baseboard surface due to impact of heatsink.
4.No visible physical damage to the processor package.
5.Successful BIOS/Processor/memory test of
6.Thermal compliance testing to demonstrate that the case temperature specification can be met.
E.1.2.4 Recommended BIOS/Processor/Memory Test Procedures
This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered.
Testing setup should include the following components, properly assembled and/or connected:
•Appropriate system baseboard.
•Processor and memory.
•All enabling components, including socket and thermal solution parts.
The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors. Intel PC Diags is an example of software that can be utilized for this test.
E.1.3 Material and Recycling Requirements
Material shall be resistant to fungal growth. Examples of
Material used shall not have deformation or degradation in a temperature life test.
Any plastic component exceeding 25 grams should be recyclable per the European Blue Angel recycling standards.
The following definitions apply to the use of the terms
RoHS compliant: Lead and other materials banned in RoHS Directive are either (1) below all applicable substance thresholds as proposed by the EU or (2) an approved/ pending exemption applies.
Note: RoHS implementation details are not fully defined and may change.
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