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Intel 5400 Series manual Figure B-5. CEK Spring Sheet 1

Models: 5400 Series

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Dimension Preload Test Configuration Assembly Drawing Test Procedure Examples Structural Reliability Testing Safety Fan Power Supply Heatsink Solutions Intel Enabled Suppliers

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Mechanical Drawings

Figure B-5. CEK Spring (Sheet 1 of 3)

62	Quad-Core Intel® Xeon® Processor 5400 Series TMDG

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Intel 5400 Series manual Figure B-5. CEK Spring Sheet 1

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Contents

Quad-Core Intel Xeon Processor 5400 Series Thermal/Mechanical Design Guidelines Quad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Reference Revision Description Date Number Initial release of the document Quad-Core Intel Xeon Processor 5400 Series Tmdg References ObjectiveScope Term Description Definition of TermsTerms and Descriptions Sheet 1 Terms and Descriptions Sheet 2 TDP Introduction Processor Mechanical Parameters Table Mechanical RequirementsProcessor Mechanical Parameters Parameter Minimum Maximum Unit Quad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Processor Thermal Parameters and Features Thermal Control Circuit and TDP Digital Thermal Sensor Multiple Digital Thermal Sensor Operation Platform Environmental Control Interface PeciMultiple Core Special Considerations Heatpipe Orientation for Multiple Core Processors Thermal Monitor for Multiple Core ProductsPROCHOT#, THERMTRIP#, and FORCEPR# Processor Input Processor Output Processor Core Geometric Center Dimensions Feature Dimension Thermal Profile Equation 2-1.y = ax + b Tcontrol Definition Equation 2-2.TCONTROL= -TOFFSET Tcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design 1U CEK, Thermal Profile B Parameter Maximum Unit2U+ CEK, Thermal Profile a 1U Alternative Heatsink Fan Fail GuidelinesSea-Level Characterizing Cooling Solution Performance Requirements Fan Speed Control Equation 2-3.ΨCA= Tcase TLA / TDP Processor Thermal Characterization Parameter RelationshipsFan Speed Control, Tcontrol and DTS Relationship Condition FSC Scheme Example Equation 2-4.ΨCA= ΨCS + ΨSA Equation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W Chassis Thermal Design ConsiderationsChassis Thermal Design Capabilities and Improvements Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/W Heatsink Design Considerations Heatsink SolutionsThermal/Mechanical Reference Design Considerations Thermal Interface Material Summary Assembly Drawing Geometric Envelope Structural Considerations of CEK Thermal Solution Performance Characteristics 17 U+ CEK Heatsink Thermal Performance Thermal Profile Adherence Equation 2-8.y = 0.187*X + =0.187* X +40 Equation 2-9.y = 0.246*X + 1UCEKReference Solution Equation 2-10.y = 0.246*X + Components Overview Heatsink with Captive Screws and Standoffs 22. Isometric View of the 2U+ CEK Heatsink Thermal Interface Material TIM CEK Heatsink Thermal Mechanical CharacteristicsRecommended Thermal Grease Dispense Weight Processor Minimum Maximum Units CEK Spring 24. CEK Spring Isometric View Thermal/Mechanical Reference Design Description Min Typ Max Unit Steady Startup Fan Power SupplyFan Specifications Boxed 4-wire PWM/DTS Heatsink Solution Boxed Processor Contents Systems Considerations Associated with the Active CEK Thermal/Mechanical Reference Design Component Overview Figure A-1. Isometric View of the 1U Alternative Heatsink Equation A-1. y = 0.331*x + Thermal Solution Performance CharactericsThermal Profile Adherence = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Table B-1. Mechanical Drawing List Drawing Description Figure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Heatsink Preparation OverviewTest Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Typical Test Equipment Test Procedure ExamplesTime-Zero, Room Temperature Preload Measurement Table C-1. Typical Test Equipment Preload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Intel Verification Criteria for the Reference Designs Environmental Reliability TestingStructural Reliability Testing Reference Heatsink Thermal Verification Table E-1 Use Conditions Environment 2.2 Recommended Test SequencePost-Test Pass Criteria Recommended BIOS/Processor/Memory Test Procedures Material and Recycling Requirements Quality and Reliability Requirements Intel Enabled Suppliers Supplier Information Additional Suppliers For 1U 2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg

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