Thermal Solution Performance Characterics | Intel 5400 Series

1U Alternative Heatsink Thermal/Mechanical Design

A.2 Thermal Solution Performance Characterics

Figure A-2shows the performance of the 1U alternative heatsink. This figure shows the thermal performance and the pressure drop through fins of the heatsink versus the airflow provided. The best-fit equations for these curves are also provided to make it easier for users to determine the desired value without any error associated with reading the graph.

Figure A-2. 1U Alternative Heatsink Thermal Performance

Table A-1. 1U Alternative Heatsink Thermal Mechanical Characteristics

	Size	Height	Weight	Target Airflow	Mean Ψca	Standard	Pressure
		Height	Weight	Target Airflow		Standard	Drop
				Through Fins		Deviation Ψca	Drop
				Through Fins		Deviation Ψca

		(mm) [in.]	(kg) [lbs]	(m3/hr) [CFM]	(°C/W)	(°C/W)	(Pa) [in
							H2O]
	1U	27.00	0.24 [0.53]	25.5 [15]	0.305	0.0087	85 [0.34]
		[1.06]

A.3 Thermal Profile Adherence

The 1U alternative thermal solution is designed to meet the Thermal Profile for the Quad-Core Intel® Xeon® Processor E5400 Series in volumetrically constrained form factors. From Table A-1the three-sigma (mean+3sigma) performance of the thermal solution is computed to be 0.331 °C/W and the processor local ambient temperature (TLA) for this thermal solution is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as:

Equation A-1. y = 0.331*x + 40

where,

y = Processor TCASE value (°C)

54	Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Image 54

Contents

Quad-Core Intel Xeon Processor 5400 Series Thermal/Mechanical Design Guidelines Quad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Reference Revision Description Date Number Initial release of the document Quad-Core Intel Xeon Processor 5400 Series Tmdg Objective ScopeReferences Definition of Terms Terms and Descriptions Sheet 1Term Description Terms and Descriptions Sheet 2 TDP Introduction Processor Mechanical Parameters Table Mechanical RequirementsProcessor Mechanical Parameters Parameter Minimum Maximum Unit Quad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Processor Thermal Parameters and Features Thermal Control Circuit and TDP Digital Thermal Sensor Platform Environmental Control Interface Peci Multiple Core Special ConsiderationsMultiple Digital Thermal Sensor Operation Heatpipe Orientation for Multiple Core Processors Thermal Monitor for Multiple Core ProductsPROCHOT#, THERMTRIP#, and FORCEPR# Processor Input Processor Output Processor Core Geometric Center Dimensions Feature Dimension Thermal Profile Equation 2-1.y = ax + b Tcontrol Definition Equation 2-2.TCONTROL= -TOFFSET Tcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Parameter Maximum Unit 2U+ CEK, Thermal Profile a1U CEK, Thermal Profile B Fan Fail Guidelines Sea-Level1U Alternative Heatsink Characterizing Cooling Solution Performance Requirements Fan Speed Control Equation 2-3.ΨCA= Tcase TLA / TDP Processor Thermal Characterization Parameter RelationshipsFan Speed Control, Tcontrol and DTS Relationship Condition FSC Scheme Example Equation 2-4.ΨCA= ΨCS + ΨSA Equation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W Chassis Thermal Design ConsiderationsChassis Thermal Design Capabilities and Improvements Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/W Heatsink Solutions Thermal/Mechanical Reference Design ConsiderationsHeatsink Design Considerations Thermal Interface Material Summary Assembly Drawing Geometric Envelope Structural Considerations of CEK Thermal Solution Performance Characteristics 17 U+ CEK Heatsink Thermal Performance Thermal Profile Adherence Equation 2-8.y = 0.187*X + =0.187* X +40 Equation 2-9.y = 0.246*X + 1UCEKReference Solution Equation 2-10.y = 0.246*X + Components Overview Heatsink with Captive Screws and Standoffs 22. Isometric View of the 2U+ CEK Heatsink Thermal Interface Material TIM CEK Heatsink Thermal Mechanical CharacteristicsRecommended Thermal Grease Dispense Weight Processor Minimum Maximum Units CEK Spring 24. CEK Spring Isometric View Thermal/Mechanical Reference Design Fan Power Supply Fan Specifications Boxed 4-wire PWM/DTS Heatsink SolutionDescription Min Typ Max Unit Steady Startup Boxed Processor Contents Systems Considerations Associated with the Active CEK Thermal/Mechanical Reference Design Component Overview Figure A-1. Isometric View of the 1U Alternative Heatsink Thermal Solution Performance Characterics Thermal Profile AdherenceEquation A-1. y = 0.331*x + = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Table B-1. Mechanical Drawing List Drawing Description Figure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Overview Test PreparationHeatsink Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Typical Test Equipment Test Procedure ExamplesTime-Zero, Room Temperature Preload Measurement Table C-1. Typical Test Equipment Preload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Intel Verification Criteria for the Reference Designs Environmental Reliability TestingStructural Reliability Testing Reference Heatsink Thermal Verification 2.2 Recommended Test Sequence Post-Test Pass CriteriaTable E-1 Use Conditions Environment Recommended BIOS/Processor/Memory Test Procedures Material and Recycling Requirements Quality and Reliability Requirements Intel Enabled Suppliers Supplier Information Additional Suppliers For 1U 2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg