Mechanical Drawings
B Mechanical Drawings
The mechanical drawings included in this appendix refer to the thermal mechanical enabling components for the
Note: | Intel reserves the right to make changes and modifications to the design as necessary. | |
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| Drawing Description | Figure Number |
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| “2U CEK Heatsink (Sheet 1 of 4)” | Figure |
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| “2U CEK Heatsink (Sheet 2 of 4)” | Figure |
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| “2U CEK Heatsink (Sheet 3 of 4)” | Figure |
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| “2U CEK Heatsink (Sheet 4 of 4)” | Figure |
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| “CEK Spring (Sheet 1 of 3)” | Figure |
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| “CEK Spring (Sheet 2 of 3)” | Figure |
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| “CEK Spring (Sheet 3 of 3)” | Figure |
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| “Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components | Figure |
| (Sheet 1 of 6)” |
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| “Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components | Figure |
| (Sheet 2 of 6)” |
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| “Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components | Figure |
| (Sheet 3 of 6)” |
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| “Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components | Figure |
| (Sheet 4 of 6)” |
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| “Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components | Figure |
| (Sheet 5 of 6)” |
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| “Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components | Figure |
| (Sheet 6 of 6)” |
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| “1U CEK Heatsink (Sheet 1 of 4)” | Figure |
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| “1U CEK Heatsink (Sheet 2 of 4)” | Figure |
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| “1U CEK Heatsink (Sheet 3 of 4)” | Figure |
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| “1U CEK Heatsink (Sheet 4 of 4)” | Figure |
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| “Active CEK Thermal Solution Volumetric (Sheet 1 of 3)” | Figure |
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| “Active CEK Thermal Solution Volumetric (Sheet 2 of 3)” | Figure |
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| “Active CEK Thermal Solution Volumetric (Sheet 3 of 3)” | Figure |
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| “1U Alternative Heatsink (1 of 4)” | Figure |
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| “1U Alternative Heatsink (2 of 4)” | Figure |
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| “1U Alternative Heatsink (3 of 4)” | Figure |
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| “1U Alternative Heatsink (4 of 4)” | Figure |
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