Intel 5400 Series manual Tcontrol and Thermal Profile Interaction

Thermal/Mechanical Reference Design

Figure 2-9depicts the interaction between the Thermal Profile and TCONTROL.

Figure 2-9. TCONTROL and Thermal Profile Interaction

If the DTS temperature is less than TCONTROL, then the case temperature is permitted to exceed the Thermal Profile, but the DTS temperature must remain at or below

TCONTROL. The thermal solution for the processor must be able to keep the processor’s TCASE at or below the Thermal Profile when operating between the TCONTROL and TCASE_MAX at TDP under heavy workload conditions.

Refer to Section 2.4.1 for the implementation of the TCONTROL value in support of fan speed control (FSC) design to achieve better acoustic performance.

2.2.7Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5400 Series

2.2.7.1Dual Thermal Profile Concept for the Quad-Core Intel® Xeon® Processor X5400 Series

The Quad-Core Intel® Xeon® Processor X5400 Series is designed to go into various form factors, including the volumetrically constrained 1U and custom blade form factors. Due to certain limitations of such form factors (i.e. airflow, thermal solution height), it is very challenging to meet the thermal requirements of the processor. To mitigate these form factor constraints, Intel has developed a dual Thermal Profile specification, shown in Figure 2-10.

26 Quad-Core Intel® Xeon® Processor 5400 Series TMDG