![](/images/new-backgrounds/1113905/113905109x1.webp)
1U Alternative Heatsink Thermal/Mechanical Design
x = Processor power value (W)
Figure A-3 below shows the comparison of this reference thermal solution’s Thermal Profile to the Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile specification. The 1U alternative solution meets the Thermal Profile with 0.5°C margin at the upper end (TDP). By designing to Thermal Profile, it is ensured that no measurable performance loss due to TCC activation is observed under the given environmental conditions.
Figure A-3. 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5400 Series Thermal Profile
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| TCASE_M AX | @ TDP |
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| Thermal Profile |
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| Y = 0.298 * X + 43.2 |
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| 1U Alternative Heatsink |
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| Y = 0.331 * X + 40 |
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| 0 | 5 | 10 | 15 | 20 | 25 | 30 | 35 | 40 | 50 | 60 | 65 | 70 | 75 | 80 | ||
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