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Dimension
Preload Test Configuration
Assembly Drawing
Test Procedure Examples
Structural Reliability Testing
Safety
Fan Power Supply
Heatsink Solutions
Intel Enabled Suppliers
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Mechanical Drawings
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Quad-Core
Intel® Xeon® Processor 5400 Series TMDG
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Contents
Quad-Core Intel Xeon Processor 5400 Series
Thermal/Mechanical Design Guidelines
Quad-Core Intel Xeon Processor 5400 Series Tmdg
Contents
Figures
Preload Test Configuration
Tables
Reference Revision Description Date Number
Initial release of the document
Quad-Core Intel Xeon Processor 5400 Series Tmdg
Scope
Objective
References
Terms and Descriptions Sheet 1
Definition of Terms
Term Description
Terms and Descriptions Sheet 2
TDP
Introduction
Processor Mechanical Parameters Table
Mechanical Requirements
Processor Mechanical Parameters
Parameter Minimum Maximum Unit
Quad-Core Intel Xeon Processor 5400 Series Package
Thermal/Mechanical Reference Design
Thermal/Mechanical Reference Design
Thermal/Mechanical Reference Design
Quad-Core Intel Xeon Processor 5400 Series Considerations
Processor Thermal Parameters and Features
Thermal Control Circuit and TDP
Digital Thermal Sensor
Multiple Core Special Considerations
Platform Environmental Control Interface Peci
Multiple Digital Thermal Sensor Operation
Heatpipe Orientation for Multiple Core Processors
Thermal Monitor for Multiple Core Products
PROCHOT#, THERMTRIP#, and FORCEPR#
Processor Input Processor Output
Processor Core Geometric Center Dimensions
Feature Dimension
Thermal Profile
Equation 2-1.y = ax + b
Tcontrol Definition
Equation 2-2.TCONTROL= -TOFFSET
Tcontrol and Thermal Profile Interaction
Thermal Profile B
Performance Targets
Thermal/Mechanical Reference Design
Thermal/Mechanical Reference Design
2U+ CEK, Thermal Profile a
Parameter Maximum Unit
1U CEK, Thermal Profile B
Sea-Level
Fan Fail Guidelines
1U Alternative Heatsink
Characterizing Cooling Solution Performance Requirements
Fan Speed Control
Equation 2-3.ΨCA= Tcase TLA / TDP
Processor Thermal Characterization Parameter Relationships
Fan Speed Control, Tcontrol and DTS Relationship
Condition FSC Scheme
Example
Equation 2-4.ΨCA= ΨCS + ΨSA
Equation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W
Chassis Thermal Design Considerations
Chassis Thermal Design Capabilities and Improvements
Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/W
Thermal/Mechanical Reference Design Considerations
Heatsink Solutions
Heatsink Design Considerations
Thermal Interface Material
Summary
Assembly Drawing
Geometric Envelope
Structural Considerations of CEK
Thermal Solution Performance Characteristics
17 U+ CEK Heatsink Thermal Performance
Thermal Profile Adherence
Equation 2-8.y = 0.187*X +
=0.187* X +40
Equation 2-9.y = 0.246*X +
1UCEKReference Solution
Equation 2-10.y = 0.246*X +
Components Overview
Heatsink with Captive Screws and Standoffs
22. Isometric View of the 2U+ CEK Heatsink
Thermal Interface Material TIM
CEK Heatsink Thermal Mechanical Characteristics
Recommended Thermal Grease Dispense Weight
Processor Minimum Maximum Units
CEK Spring
24. CEK Spring Isometric View
Thermal/Mechanical Reference Design
Fan Specifications Boxed 4-wire PWM/DTS Heatsink Solution
Fan Power Supply
Description Min Typ Max Unit Steady Startup
Boxed Processor Contents
Systems Considerations Associated with the Active CEK
Thermal/Mechanical Reference Design
Component Overview
Figure A-1. Isometric View of the 1U Alternative Heatsink
Thermal Profile Adherence
Thermal Solution Performance Characterics
Equation A-1. y = 0.331*x +
= Processor power value W
1U Alternative Heatsink Thermal/Mechanical Design
Table B-1. Mechanical Drawing List
Drawing Description
Figure B-1 2U CEK Heatsink Sheet 1
Figure B-2 2U CEK Heatsink Sheet 2
Figure B-3 U CEK Heatsink Sheet 3
Figure B-4 2U CEK Heatsink Sheet 4
Figure B-5. CEK Spring Sheet 1
Figure B-6. CEK Spring Sheet 2
Figure B-7. CEK Spring Sheet 3
Mechanical Drawings
Mechanical Drawings
Mechanical Drawings
Mechanical Drawings
Mechanical Drawings
Mechanical Drawings
Figure B-14 U CEK Heatsink Sheet 1
Figure B-15 U CEK Heatsink Sheet 2
Figure B-16 U CEK Heatsink Sheet 3
Figure B-17 U CEK Heatsink Sheet 4
Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1
Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2
Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3
Figure B-21 U Alternative Heatsink 1
Figure B-22 U Alternative Heatsink 2
Figure B-23 U Alternative Heatsink 3
Figure B-24 U Alternative Heatsink 4
Mechanical Drawings
Test Preparation
Overview
Heatsink Preparation
Alternate Heatsink Sample Preparation
Figure C-3. Preload Test Configuration
Typical Test Equipment
Test Procedure Examples
Time-Zero, Room Temperature Preload Measurement
Table C-1. Typical Test Equipment
Preload Degradation under Bake Conditions
Heatsink Clip Load Methodology
Safety Requirements
Safety Requirements
Intel Verification Criteria for the Reference Designs
Environmental Reliability Testing
Structural Reliability Testing
Reference Heatsink Thermal Verification
Post-Test Pass Criteria
2.2 Recommended Test Sequence
Table E-1 Use Conditions Environment
Recommended BIOS/Processor/Memory Test Procedures
Material and Recycling Requirements
Quality and Reliability Requirements
Intel Enabled Suppliers
Supplier Information
Additional Suppliers
For 1U
2U Heatsink Alternative CEK Copper Fin
Alternative CEK Copper Fin
Enabled Suppliers Information
100 Quad-Core Intel Xeon Processor 5400 Series Tmdg
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