Fan Speed Control | Intel 5400 Series specs

Thermal/Mechanical Reference Design

2.4Characterizing Cooling Solution Performance Requirements

2.4.1Fan Speed Control

Fan speed control (FSC) techniques to reduce system level acoustic noise are a common practice in server designs. The fan speed is one of the parameters that determine the amount of airflow provided to the thermal solution. Additionally, airflow is proportional to a thermal solution’s performance, which consequently determines the

TCASE of the processor at a given power level. Since the TCASE of a processor is an important parameter in the long-term reliability of a processor, the FSC implemented in

a system directly correlates to the processor’s ability to meet the Thermal Profile and hence the long-term reliability requirements. For this purpose, the parameter called

TCONTROL as explained in Section 2.2.6, is to be used in FSC designs to ensure that the long-term reliability of the processor is met while keeping the system level acoustic

noise down. Figure 2-14depicts the relationship between TCONTROL and FSC methodology.

Figure 2-14. TCONTROL and Fan Speed Control

Once the TCONTROL value is determined as explained earlier, the DTS temperature reading from the processor can be compared to this TCONTROL value. A fan speed control scheme can be implemented as described in Table 2-6without compromising

the long-term reliability of the processor.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG

33

Image 33

Intel 5400 Series manual Characterizing Cooling Solution Performance Requirements, Fan Speed Control

Contents

Thermal/Mechanical Design Guidelines Quad-Core Intel Xeon Processor 5400 Series Quad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Initial release of the document Reference Revision Description Date Number Quad-Core Intel Xeon Processor 5400 Series Tmdg Objective ScopeReferences Definition of Terms Terms and Descriptions Sheet 1Term Description TDP Terms and Descriptions Sheet 2 Introduction Processor Mechanical Parameters Mechanical RequirementsProcessor Mechanical Parameters Table Parameter Minimum Maximum Unit Quad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Thermal Control Circuit and TDP Processor Thermal Parameters and Features Digital Thermal Sensor Platform Environmental Control Interface Peci Multiple Core Special ConsiderationsMultiple Digital Thermal Sensor Operation PROCHOT#, THERMTRIP#, and FORCEPR# Thermal Monitor for Multiple Core ProductsHeatpipe Orientation for Multiple Core Processors Processor Input Processor Output Feature Dimension Processor Core Geometric Center Dimensions Equation 2-1.y = ax + b Thermal Profile Equation 2-2.TCONTROL= -TOFFSET Tcontrol Definition Tcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Parameter Maximum Unit 2U+ CEK, Thermal Profile a1U CEK, Thermal Profile B Fan Fail Guidelines Sea-Level1U Alternative Heatsink Fan Speed Control Characterizing Cooling Solution Performance Requirements Fan Speed Control, Tcontrol and DTS Relationship Processor Thermal Characterization Parameter RelationshipsEquation 2-3.ΨCA= Tcase TLA / TDP Condition FSC Scheme Equation 2-4.ΨCA= ΨCS + ΨSA Example Chassis Thermal Design Capabilities and Improvements Chassis Thermal Design ConsiderationsEquation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/W Heatsink Solutions Thermal/Mechanical Reference Design ConsiderationsHeatsink Design Considerations Summary Thermal Interface Material Geometric Envelope Assembly Drawing Structural Considerations of CEK 17 U+ CEK Heatsink Thermal Performance Thermal Solution Performance Characteristics Equation 2-8.y = 0.187*X + Thermal Profile Adherence Equation 2-9.y = 0.246*X + =0.187* X +40 Equation 2-10.y = 0.246*X + 1UCEKReference Solution Heatsink with Captive Screws and Standoffs Components Overview 22. Isometric View of the 2U+ CEK Heatsink Recommended Thermal Grease Dispense Weight CEK Heatsink Thermal Mechanical CharacteristicsThermal Interface Material TIM Processor Minimum Maximum Units 24. CEK Spring Isometric View CEK Spring Thermal/Mechanical Reference Design Fan Power Supply Fan Specifications Boxed 4-wire PWM/DTS Heatsink SolutionDescription Min Typ Max Unit Steady Startup Systems Considerations Associated with the Active CEK Boxed Processor Contents Thermal/Mechanical Reference Design Figure A-1. Isometric View of the 1U Alternative Heatsink Component Overview Thermal Solution Performance Characterics Thermal Profile AdherenceEquation A-1. y = 0.331*x + = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Drawing Description Table B-1. Mechanical Drawing List Figure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Overview Test PreparationHeatsink Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Time-Zero, Room Temperature Preload Measurement Test Procedure ExamplesTypical Test Equipment Table C-1. Typical Test Equipment Preload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Structural Reliability Testing Environmental Reliability TestingIntel Verification Criteria for the Reference Designs Reference Heatsink Thermal Verification 2.2 Recommended Test Sequence Post-Test Pass CriteriaTable E-1 Use Conditions Environment Material and Recycling Requirements Recommended BIOS/Processor/Memory Test Procedures Quality and Reliability Requirements Supplier Information Intel Enabled Suppliers For 1U Additional Suppliers 2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg