2U Heatsink Alternative CEK Copper Fin | Intel 5400 Series specification

Enabled Suppliers Information

Table F-2. Additional Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series Intel Reference Solution (Sheet 1 of 2)

	Assembly	Component	Description	Development	Supplier Contact Info
	Assembly	Component	Description	Suppliers	Supplier Contact Info
				Suppliers

	2U Heatsink	Alternative CEK	Copper Fin,	Aavid	David Huang
		Heatsink	Copper Base	Thermalloy	huang@aavid.com
				CNDA#2525071	603-223-1724
				CNDA#2525071
					Frank Hsue
					frank.hsu@aavid.com.tw
					886-2-26989888 x306

			Copper Fin,	ADDA	Jungpin Chen
			Copper Base	Corporation	jungpin@adda.com.tw
				CNDA#AP1249	886-2-82212252x232
			- and -	CNDA#AP1249
			- and -
			Aluminum

			Copper Fin,	Asia Vital Components	Steve Huang (APAC)
			Copper Base	(AVC)	+86-755-3366-8888 x66888
				CNDA# AP5281	+86-138-252-45215
			- and -		steve@avc.com.cn
			- and -
			Aluminum		Huabin Chen (China Only)
			Aluminum		+886-755-3366-8888 x66871
					+886-755-3366-8888 x66871
					huabin@avc.com.cn

			Copper Fin,	Auras	Ian Shih
			Copper Base	CNDA#5779699	liverpool@auras.com.tw
					+886-937-183-194
			- and -
			Aluminum

			Copper Fin,	CCI (Chaun-Choung	Monica Chih
			Copper Base	Technology Co. Ltd.)	monica_chih@ccic.com.tw
				CNDA#8747572	8862-29952666 EXT 292
			- and -		Harry Lin
					Harry Lin
			Aluminum		714-739-5797
			Aluminum		ackinc@aol.com
					ackinc@aol.com

			Aluminum	CoolJag (Chia Cherne	Alice Yang
				Industry Co., Ltd.)	+886-4-7323090
					alice@cooljag.com
					Kenny Kwang
					510-824-0888
					kenny@cooljagusa.com

			Copper Fin,	CoolerMaster	Helena Wen
			Copper Base	CNDA#7425225	helena_wen@collermaster.com.tw
					+886-2-3234-0050x235

			Copper Fin,	Taisol Electronics	Jane Yui
			Copper Base	CNDA #3434254	jane.yui@taisol.com.tw
			- and -		+886-2-2656-2658 x113
			- and -
			Aluminum

			Copper Fin,	Thermaltake	Vera Lee
			Copper Base	CNDA#7429482	vera@thermaltake.com
					+886-2-2662-6501-255

Quad-Core Intel® Xeon® Processor 5400 Series TMDG

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Intel 5400 Series manual 2U Heatsink Alternative CEK Copper Fin

Contents

Thermal/Mechanical Design Guidelines Quad-Core Intel Xeon Processor 5400 Series Quad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Initial release of the document Reference Revision Description Date Number Quad-Core Intel Xeon Processor 5400 Series Tmdg Scope ObjectiveReferences Terms and Descriptions Sheet 1 Definition of TermsTerm Description TDP Terms and Descriptions Sheet 2 Introduction Processor Mechanical Parameters Mechanical RequirementsProcessor Mechanical Parameters Table Parameter Minimum Maximum Unit Quad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Thermal Control Circuit and TDP Processor Thermal Parameters and Features Digital Thermal Sensor Multiple Core Special Considerations Platform Environmental Control Interface PeciMultiple Digital Thermal Sensor Operation PROCHOT#, THERMTRIP#, and FORCEPR# Thermal Monitor for Multiple Core ProductsHeatpipe Orientation for Multiple Core Processors Processor Input Processor Output Feature Dimension Processor Core Geometric Center Dimensions Equation 2-1.y = ax + b Thermal Profile Equation 2-2.TCONTROL= -TOFFSET Tcontrol Definition Tcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design 2U+ CEK, Thermal Profile a Parameter Maximum Unit1U CEK, Thermal Profile B Sea-Level Fan Fail Guidelines1U Alternative Heatsink Fan Speed Control Characterizing Cooling Solution Performance Requirements Fan Speed Control, Tcontrol and DTS Relationship Processor Thermal Characterization Parameter RelationshipsEquation 2-3.ΨCA= Tcase TLA / TDP Condition FSC Scheme Equation 2-4.ΨCA= ΨCS + ΨSA Example Chassis Thermal Design Capabilities and Improvements Chassis Thermal Design ConsiderationsEquation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/W Thermal/Mechanical Reference Design Considerations Heatsink SolutionsHeatsink Design Considerations Summary Thermal Interface Material Geometric Envelope Assembly Drawing Structural Considerations of CEK 17 U+ CEK Heatsink Thermal Performance Thermal Solution Performance Characteristics Equation 2-8.y = 0.187*X + Thermal Profile Adherence Equation 2-9.y = 0.246*X + =0.187* X +40 Equation 2-10.y = 0.246*X + 1UCEKReference Solution Heatsink with Captive Screws and Standoffs Components Overview 22. Isometric View of the 2U+ CEK Heatsink Recommended Thermal Grease Dispense Weight CEK Heatsink Thermal Mechanical CharacteristicsThermal Interface Material TIM Processor Minimum Maximum Units 24. CEK Spring Isometric View CEK Spring Thermal/Mechanical Reference Design Fan Specifications Boxed 4-wire PWM/DTS Heatsink Solution Fan Power SupplyDescription Min Typ Max Unit Steady Startup Systems Considerations Associated with the Active CEK Boxed Processor Contents Thermal/Mechanical Reference Design Figure A-1. Isometric View of the 1U Alternative Heatsink Component Overview Thermal Profile Adherence Thermal Solution Performance CharactericsEquation A-1. y = 0.331*x + = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Drawing Description Table B-1. Mechanical Drawing List Figure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Test Preparation OverviewHeatsink Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Time-Zero, Room Temperature Preload Measurement Test Procedure ExamplesTypical Test Equipment Table C-1. Typical Test Equipment Preload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Structural Reliability Testing Environmental Reliability TestingIntel Verification Criteria for the Reference Designs Reference Heatsink Thermal Verification Post-Test Pass Criteria 2.2 Recommended Test SequenceTable E-1 Use Conditions Environment Material and Recycling Requirements Recommended BIOS/Processor/Memory Test Procedures Quality and Reliability Requirements Supplier Information Intel Enabled Suppliers For 1U Additional Suppliers 2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg