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Thermal/Mechanical Reference Design
2.2.5Thermal Profile
The thermal profile is a line that defines the relationship between a processor’s case temperature and its power consumption as shown in Figure
Equation 2-1.y = ax + b
Where: |
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y | = | Processor case temperature, TCASE (°C) |
x | = | Processor power consumption (W) |
a=
b= Processor local ambient temperature, TLA (°C)
Figure 2-7. Thermal Profile Diagram
The high end point of the Thermal Profile represents the processor’s TDP and the associated maximum case temperature (TCASE_MAX) and the lower end point represents the local ambient temperature at P = 0W. The slope of the Thermal Profile line represents the
In order to satisfy the Thermal Profile specification, a thermal solution must be at or below the Thermal Profile line for the given processor when its DTS temperature is
greater than TCONTROL (refer to Section 2.2.6). The Thermal Profile allows the customers to make a
resistance and the processor local ambient temperature that best suits their platform implementation (refer to Section 2.4.3). There can be multiple combinations of thermal solution
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