Terms and Descriptions Sheet 2, Tdp | Intel 5400 Series instruction

Introduction

Table 1-2.	Terms and Descriptions (Sheet 2 of 2)

	TCONTROL	A processor unique value for use in fan speed control mechanisms. TCONTROL is a
		temperature specification based on a temperature reading from the processor’s Digital
		Thermal Sensor. TCONTROL can be described as a trigger point for fan speed control
		implementation. TCONTROL = -TOFFSET.
	TOFFSET	An offset value from the TCC activation temperature value programmed into each
		processor during manufacturing and can be obtained by reading the
		IA_32_TEMPERATURE_TARGET MSR. This is a static and a unique value. Refer to the
		RS - Wolfdale Processor Family BIOS Writers Guide (BWG) for further details.

	TDP	Thermal Design Power: Thermal solution should be designed to dissipate this target
		power level. TDP is not the maximum power that the processor can dissipate.

	Thermal Monitor	A feature on the processor that can keep the processor’s die temperature within factory
		specifications under normal operating conditions.

	Thermal Profile	Line that defines case temperature specification of a processor at a given power level.

	TIM	Thermal Interface Material: The thermally conductive compound between the heatsink
		and the processor case. This material fills the air gaps and voids, and enhances the
		transfer of the heat from the processor case to the heatsink.

	TLA	The measured ambient temperature locally surrounding the processor. The ambient
		temperature should be measured just upstream of a passive heatsink or at the fan inlet
		for an active heatsink.

	TSA	The system ambient air temperature external to a system chassis. This temperature is
		usually measured at the chassis air inlets.

UA unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals 3.50 in, etc.

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Quad-Core Intel® Xeon® Processor 5400 Series TMDG

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Intel 5400 Series manual Terms and Descriptions Sheet 2, Tdp

Contents

Thermal/Mechanical Design Guidelines Quad-Core Intel Xeon Processor 5400 Series Quad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Initial release of the document Reference Revision Description Date Number Quad-Core Intel Xeon Processor 5400 Series Tmdg References ObjectiveScope Term Description Definition of TermsTerms and Descriptions Sheet 1 TDP Terms and Descriptions Sheet 2 Introduction Parameter Minimum Maximum Unit Mechanical RequirementsProcessor Mechanical Parameters Processor Mechanical Parameters Table Quad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Thermal Control Circuit and TDP Processor Thermal Parameters and Features Digital Thermal Sensor Multiple Digital Thermal Sensor Operation Platform Environmental Control Interface PeciMultiple Core Special Considerations Processor Input Processor Output Thermal Monitor for Multiple Core ProductsPROCHOT#, THERMTRIP#, and FORCEPR# Heatpipe Orientation for Multiple Core Processors Feature Dimension Processor Core Geometric Center Dimensions Equation 2-1.y = ax + b Thermal Profile Equation 2-2.TCONTROL= -TOFFSET Tcontrol Definition Tcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design 1U CEK, Thermal Profile B Parameter Maximum Unit2U+ CEK, Thermal Profile a 1U Alternative Heatsink Fan Fail GuidelinesSea-Level Fan Speed Control Characterizing Cooling Solution Performance Requirements Condition FSC Scheme Processor Thermal Characterization Parameter RelationshipsFan Speed Control, Tcontrol and DTS Relationship Equation 2-3.ΨCA= Tcase TLA / TDP Equation 2-4.ΨCA= ΨCS + ΨSA Example Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/W Chassis Thermal Design ConsiderationsChassis Thermal Design Capabilities and Improvements Equation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W Heatsink Design Considerations Heatsink SolutionsThermal/Mechanical Reference Design Considerations Summary Thermal Interface Material Geometric Envelope Assembly Drawing Structural Considerations of CEK 17 U+ CEK Heatsink Thermal Performance Thermal Solution Performance Characteristics Equation 2-8.y = 0.187*X + Thermal Profile Adherence Equation 2-9.y = 0.246*X + =0.187* X +40 Equation 2-10.y = 0.246*X + 1UCEKReference Solution Heatsink with Captive Screws and Standoffs Components Overview 22. Isometric View of the 2U+ CEK Heatsink Processor Minimum Maximum Units CEK Heatsink Thermal Mechanical CharacteristicsRecommended Thermal Grease Dispense Weight Thermal Interface Material TIM 24. CEK Spring Isometric View CEK Spring Thermal/Mechanical Reference Design Description Min Typ Max Unit Steady Startup Fan Power SupplyFan Specifications Boxed 4-wire PWM/DTS Heatsink Solution Systems Considerations Associated with the Active CEK Boxed Processor Contents Thermal/Mechanical Reference Design Figure A-1. Isometric View of the 1U Alternative Heatsink Component Overview Equation A-1. y = 0.331*x + Thermal Solution Performance CharactericsThermal Profile Adherence = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Drawing Description Table B-1. Mechanical Drawing List Figure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Heatsink Preparation OverviewTest Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Table C-1. Typical Test Equipment Test Procedure ExamplesTime-Zero, Room Temperature Preload Measurement Typical Test Equipment Preload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Reference Heatsink Thermal Verification Environmental Reliability TestingStructural Reliability Testing Intel Verification Criteria for the Reference Designs Table E-1 Use Conditions Environment 2.2 Recommended Test SequencePost-Test Pass Criteria Material and Recycling Requirements Recommended BIOS/Processor/Memory Test Procedures Quality and Reliability Requirements Supplier Information Intel Enabled Suppliers For 1U Additional Suppliers 2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg