Thermal/Mechanical Reference Design
2.1.2Quad-Core Intel® Xeon® Processor 5400 Series Package
The Quad-Core Intel® Xeon® Processor 5400 Series is packaged using the flip-chip land grid array (FC-LGA) package technology. Please refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for detailed mechanical specifications. The Quad-Core Intel® Xeon® Processor 5400 Series mechanical drawing shown in Figure 2-1, Figure 2-2, and Figure 2-3provide the mechanical information for the Quad-Core Intel® Xeon® Processor 5400 Series. The drawing is superseded with the drawing in the processor datasheet should there be any conflicts. Integrated package/ socket stackup height information is provided in the LGA771 Socket Mechanical Design Guide.
14 | Quad-Core Intel® Xeon® Processor 5400 Series TMDG |
