Intel 5400 Series manual Contents

Contents

1	Introduction		..............................................................................................................	9
	1.1	Objective		9
	1.2	Scope		9
	1.3	References		9
	1.4	Definition of Terms		10
2	Thermal/Mechanical Reference Design			13
	2.1	Mechanical Requirements		13
		2.1.1	Processor Mechanical Parameters	13
		2.1.2	Quad-Core Intel® Xeon® Processor 5400 Series Package	14
		2.1.3	Quad-Core Intel® Xeon® Processor 5400 Series Considerations	18
	2.2 Processor Thermal Parameters and Features			19
		2.2.1	Thermal Control Circuit and TDP	19
		2.2.2	Digital Thermal Sensor	20
		2.2.3	Platform Environmental Control Interface (PECI)	21
		2.2.4	Multiple Core Special Considerations	21
		2.2.5	Thermal Profile	24
		2.2.6	TCONTROL Definition	25
		2.2.7	Thermal Profile Concepts for the Quad-Core Intel® Xeon®
			Processor 5400 Series	26
		2.2.8	Performance Targets	28
	2.3	Fan Fail Guidelines		32
	2.4 Characterizing Cooling Solution Performance Requirements			33
		2.4.1	Fan Speed Control	33
		2.4.2	Processor Thermal Characterization Parameter Relationships	34
		2.4.3	Chassis Thermal Design Considerations	36
	2.5 Thermal/Mechanical Reference Design Considerations			37
		2.5.1	Heatsink Solutions	37
		2.5.2	Thermal Interface Material	38
		2.5.3	Summary	38
		2.5.4	Assembly Overview of the Intel Reference Thermal Mechanical Design	39
		2.5.5	Thermal Solution Performance Characteristics	41
		2.5.6	Thermal Profile Adherence	42
		2.5.7	Components Overview	45
		2.5.8	Boxed Active Thermal Solution for the Quad-Core Intel®
			Xeon® Processor 5400 Series Thermal Profile	49
A	1U Alternative Heatsink Thermal/Mechanical Design			53
	A.1	Component Overview		53
	A.2 Thermal Solution Performance Characterics			54
	A.3	Thermal Profile Adherence		54
B	Mechanical Drawings			57
C	Heatsink Clip Load Methodology			83
	C.1	Overview		83
	C.2	Test Preparation		83
		C.2.1	Heatsink Preparation	83
		C.2.2	Typical Test Equipment	86
		C.2.3	Test Procedure Examples	86
		C.2.4	Time-Zero, Room Temperature Preload Measurement	86
		C.2.5	Preload Degradation under Bake Conditions	87

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 3