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Dimension
Preload Test Configuration
Assembly Drawing
Test Procedure Examples
Structural Reliability Testing
Safety
Fan Power Supply
Heatsink Solutions
Intel Enabled Suppliers
Page 65
Image 65
Mechanical Drawings
Figure
B-8.
Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 1 of 6)
Quad-Core
Intel® Xeon® Processor 5400 Series TMDG
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Contents
Thermal/Mechanical Design Guidelines
Quad-Core Intel Xeon Processor 5400 Series
Quad-Core Intel Xeon Processor 5400 Series Tmdg
Contents
Figures
Preload Test Configuration
Tables
Initial release of the document
Reference Revision Description Date Number
Quad-Core Intel Xeon Processor 5400 Series Tmdg
References
Objective
Scope
Term Description
Definition of Terms
Terms and Descriptions Sheet 1
TDP
Terms and Descriptions Sheet 2
Introduction
Processor Mechanical Parameters
Mechanical Requirements
Processor Mechanical Parameters Table
Parameter Minimum Maximum Unit
Quad-Core Intel Xeon Processor 5400 Series Package
Thermal/Mechanical Reference Design
Thermal/Mechanical Reference Design
Thermal/Mechanical Reference Design
Quad-Core Intel Xeon Processor 5400 Series Considerations
Thermal Control Circuit and TDP
Processor Thermal Parameters and Features
Digital Thermal Sensor
Multiple Digital Thermal Sensor Operation
Platform Environmental Control Interface Peci
Multiple Core Special Considerations
PROCHOT#, THERMTRIP#, and FORCEPR#
Thermal Monitor for Multiple Core Products
Heatpipe Orientation for Multiple Core Processors
Processor Input Processor Output
Feature Dimension
Processor Core Geometric Center Dimensions
Equation 2-1.y = ax + b
Thermal Profile
Equation 2-2.TCONTROL= -TOFFSET
Tcontrol Definition
Tcontrol and Thermal Profile Interaction
Thermal Profile B
Performance Targets
Thermal/Mechanical Reference Design
Thermal/Mechanical Reference Design
1U CEK, Thermal Profile B
Parameter Maximum Unit
2U+ CEK, Thermal Profile a
1U Alternative Heatsink
Fan Fail Guidelines
Sea-Level
Fan Speed Control
Characterizing Cooling Solution Performance Requirements
Fan Speed Control, Tcontrol and DTS Relationship
Processor Thermal Characterization Parameter Relationships
Equation 2-3.ΨCA= Tcase TLA / TDP
Condition FSC Scheme
Equation 2-4.ΨCA= ΨCS + ΨSA
Example
Chassis Thermal Design Capabilities and Improvements
Chassis Thermal Design Considerations
Equation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W
Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/W
Heatsink Design Considerations
Heatsink Solutions
Thermal/Mechanical Reference Design Considerations
Summary
Thermal Interface Material
Geometric Envelope
Assembly Drawing
Structural Considerations of CEK
17 U+ CEK Heatsink Thermal Performance
Thermal Solution Performance Characteristics
Equation 2-8.y = 0.187*X +
Thermal Profile Adherence
Equation 2-9.y = 0.246*X +
=0.187* X +40
Equation 2-10.y = 0.246*X +
1UCEKReference Solution
Heatsink with Captive Screws and Standoffs
Components Overview
22. Isometric View of the 2U+ CEK Heatsink
Recommended Thermal Grease Dispense Weight
CEK Heatsink Thermal Mechanical Characteristics
Thermal Interface Material TIM
Processor Minimum Maximum Units
24. CEK Spring Isometric View
CEK Spring
Thermal/Mechanical Reference Design
Description Min Typ Max Unit Steady Startup
Fan Power Supply
Fan Specifications Boxed 4-wire PWM/DTS Heatsink Solution
Systems Considerations Associated with the Active CEK
Boxed Processor Contents
Thermal/Mechanical Reference Design
Figure A-1. Isometric View of the 1U Alternative Heatsink
Component Overview
Equation A-1. y = 0.331*x +
Thermal Solution Performance Characterics
Thermal Profile Adherence
= Processor power value W
1U Alternative Heatsink Thermal/Mechanical Design
Drawing Description
Table B-1. Mechanical Drawing List
Figure B-1 2U CEK Heatsink Sheet 1
Figure B-2 2U CEK Heatsink Sheet 2
Figure B-3 U CEK Heatsink Sheet 3
Figure B-4 2U CEK Heatsink Sheet 4
Figure B-5. CEK Spring Sheet 1
Figure B-6. CEK Spring Sheet 2
Figure B-7. CEK Spring Sheet 3
Mechanical Drawings
Mechanical Drawings
Mechanical Drawings
Mechanical Drawings
Mechanical Drawings
Mechanical Drawings
Figure B-14 U CEK Heatsink Sheet 1
Figure B-15 U CEK Heatsink Sheet 2
Figure B-16 U CEK Heatsink Sheet 3
Figure B-17 U CEK Heatsink Sheet 4
Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1
Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2
Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3
Figure B-21 U Alternative Heatsink 1
Figure B-22 U Alternative Heatsink 2
Figure B-23 U Alternative Heatsink 3
Figure B-24 U Alternative Heatsink 4
Mechanical Drawings
Heatsink Preparation
Overview
Test Preparation
Alternate Heatsink Sample Preparation
Figure C-3. Preload Test Configuration
Time-Zero, Room Temperature Preload Measurement
Test Procedure Examples
Typical Test Equipment
Table C-1. Typical Test Equipment
Preload Degradation under Bake Conditions
Heatsink Clip Load Methodology
Safety Requirements
Safety Requirements
Structural Reliability Testing
Environmental Reliability Testing
Intel Verification Criteria for the Reference Designs
Reference Heatsink Thermal Verification
Table E-1 Use Conditions Environment
2.2 Recommended Test Sequence
Post-Test Pass Criteria
Material and Recycling Requirements
Recommended BIOS/Processor/Memory Test Procedures
Quality and Reliability Requirements
Supplier Information
Intel Enabled Suppliers
For 1U
Additional Suppliers
2U Heatsink Alternative CEK Copper Fin
Alternative CEK Copper Fin
Enabled Suppliers Information
100 Quad-Core Intel Xeon Processor 5400 Series Tmdg
