Parameter Maximum Unit | Intel 5400 Series instruction

Thermal/Mechanical Reference Design

Figure 2-13. Thermal Profile for Quad-Core Intel® Xeon® Processor X5482 Series

Thermal Profile (2U)

	75
	70
	65
	60
[C]
Tcase	55
Tcase
	50										Thermal Profile
											Thermal Profile
	45										Y = 0.187*x + 35
	40
	35
	0	10	20	30	40	50	60	70	80	90	100	110	120	130	140	150
								Pow er [W]

Table 2-4and Table 2-5describe the thermal performance target for the Quad-Core Intel® Xeon® Processor 5400 Series cooling solution enabled by Intel.

Table 2-4. Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5400 Series

	Parameter	Maximum	Unit		Notes

	Altitude	Sea-level	m		Heatsink designed at 0 meters

	TLA	40	°C
	TDP	120	W

		2U+ CEK, Thermal Profile A

	TCASE_MAX_A	63	°C
	Airflow	27	CFM		Airflow through the heatsink fins
		45.9	m3 / hr
	Pressure Drop	0.182	Inches of H2O
		45.3	Pa

	ψCA	0.187	°C/W		Mean + 3σ
		1U CEK, Thermal Profile B

	TCASE_MAX_B	70	°C
	Airflow	15	CFM		Airflow through the heatsink fins
		25.5	m3 / hr
	Pressure Drop	0.331	Inches of H2O
		82.4	Pa

	ψCA	0.246	°C/W		Mean + 3σ
Quad-Core Intel® Xeon® Processor 5400 Series TMDG					31

Image 31

Contents

Thermal/Mechanical Design Guidelines Quad-Core Intel Xeon Processor 5400 Series Quad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Initial release of the document Reference Revision Description Date Number Quad-Core Intel Xeon Processor 5400 Series Tmdg Scope ObjectiveReferences Terms and Descriptions Sheet 1 Definition of TermsTerm Description TDP Terms and Descriptions Sheet 2 Introduction Parameter Minimum Maximum Unit Mechanical RequirementsProcessor Mechanical Parameters Processor Mechanical Parameters Table Quad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Thermal Control Circuit and TDP Processor Thermal Parameters and Features Digital Thermal Sensor Multiple Core Special Considerations Platform Environmental Control Interface PeciMultiple Digital Thermal Sensor Operation Processor Input Processor Output Thermal Monitor for Multiple Core ProductsPROCHOT#, THERMTRIP#, and FORCEPR# Heatpipe Orientation for Multiple Core Processors Feature Dimension Processor Core Geometric Center Dimensions Equation 2-1.y = ax + b Thermal Profile Equation 2-2.TCONTROL= -TOFFSET Tcontrol Definition Tcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design 2U+ CEK, Thermal Profile a Parameter Maximum Unit1U CEK, Thermal Profile B Sea-Level Fan Fail Guidelines1U Alternative Heatsink Fan Speed Control Characterizing Cooling Solution Performance Requirements Condition FSC Scheme Processor Thermal Characterization Parameter RelationshipsFan Speed Control, Tcontrol and DTS Relationship Equation 2-3.ΨCA= Tcase TLA / TDP Equation 2-4.ΨCA= ΨCS + ΨSA Example Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/W Chassis Thermal Design ConsiderationsChassis Thermal Design Capabilities and Improvements Equation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W Thermal/Mechanical Reference Design Considerations Heatsink SolutionsHeatsink Design Considerations Summary Thermal Interface Material Geometric Envelope Assembly Drawing Structural Considerations of CEK 17 U+ CEK Heatsink Thermal Performance Thermal Solution Performance Characteristics Equation 2-8.y = 0.187*X + Thermal Profile Adherence Equation 2-9.y = 0.246*X + =0.187* X +40 Equation 2-10.y = 0.246*X + 1UCEKReference Solution Heatsink with Captive Screws and Standoffs Components Overview 22. Isometric View of the 2U+ CEK Heatsink Processor Minimum Maximum Units CEK Heatsink Thermal Mechanical CharacteristicsRecommended Thermal Grease Dispense Weight Thermal Interface Material TIM 24. CEK Spring Isometric View CEK Spring Thermal/Mechanical Reference Design Fan Specifications Boxed 4-wire PWM/DTS Heatsink Solution Fan Power SupplyDescription Min Typ Max Unit Steady Startup Systems Considerations Associated with the Active CEK Boxed Processor Contents Thermal/Mechanical Reference Design Figure A-1. Isometric View of the 1U Alternative Heatsink Component Overview Thermal Profile Adherence Thermal Solution Performance CharactericsEquation A-1. y = 0.331*x + = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Drawing Description Table B-1. Mechanical Drawing List Figure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Test Preparation OverviewHeatsink Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Table C-1. Typical Test Equipment Test Procedure ExamplesTime-Zero, Room Temperature Preload Measurement Typical Test Equipment Preload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Reference Heatsink Thermal Verification Environmental Reliability TestingStructural Reliability Testing Intel Verification Criteria for the Reference Designs Post-Test Pass Criteria 2.2 Recommended Test SequenceTable E-1 Use Conditions Environment Material and Recycling Requirements Recommended BIOS/Processor/Memory Test Procedures Quality and Reliability Requirements Supplier Information Intel Enabled Suppliers For 1U Additional Suppliers 2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg