Intel 5400 Series manual Definition of Terms, Terms and Descriptions Sheet 1, Term Description

		Introduction
Table 1-1. Reference Documents (Sheet 2 of 2)
	Document	Comment
	Clovertown_Harpertown_Wolfdale-DP Processor Enabled Components	Available electronically
	CEK Thermal Models (in Flotherm* and Icepak*)
	Clovertown_Harpertown_Wolfdale-DP Processor Package Thermal	Available electronically
	Models (in Flotherm and Icepak)
	RS - Wolfdale Processor Family BIOS Writers Guide (BWG)	See Note following table.
	Thin Electronics Bay Specification (A Server System Infrastructure (SSI)	www.ssiforum.com
	Specification for Rack Optimized Servers

Note: Contact your Intel field sales representative for the latest revision and order number of this document.

1.4Definition of Terms

Table 1-2.	Terms and Descriptions (Sheet 1 of 2)
	Term	Description
	Bypass	Bypass is the area between a passive heatsink and any object that can act to form a
		duct. For this example, it can be expressed as a dimension away from the outside
		dimension of the fins to the nearest surface.
	DTS	Digital Thermal Sensor replaces the Tdiode in previous products and uses the same
		sensor as the PROCHOT# sensor to indicate the on-die temperature. The temperature
		value represents the number of degrees below the TCC activation temperature.
	MSR	The processor provides a variety of model specific registers that are used to control and
		report on processor performance. Virtually all MSRs handle system related functions and
		are not accessible to an application program.
	FMB	Flexible Motherboard Guideline: an estimate of the maximum value of a processor
		specification over certain time periods. System designers should meet the FMB values to
		ensure their systems are compatible with future processor releases.
	FSC	Fan Speed Control
	IHS	Integrated Heat Spreader: a component of the processor package used to enhance the
		thermal performance of the package. Component thermal solutions interface with the
		processor at the IHS surface.
	LGA771 Socket	The Quad-Core Intel® Xeon® Processor 5400 Series interfaces to the baseboard
		through this surface mount, 771 Land socket. See the LGA771 Socket Mechanical
		Design Guide for details regarding this socket.
	PMAX	The maximum power dissipated by a semiconductor component.
	PECI	A proprietary one-wire bus interface that provides a communication channel between
		Intel processor and chipset components to external thermal monitoring devices, for use
		in fan speed control. PECI communicates readings from the processors Digital Thermal
		Sensor. PECI replaces the thermal diode available in previous processors.
	ΨCA	Case-to-ambient thermal characterization parameter (psi). A measure of thermal
		solution performance using total package power. Defined as (TCASE – TLA) / Total
		Package Power. Heat source should always be specified for Ψ measurements.
	ΨCS	Case-to-sink thermal characterization parameter. A measure of thermal interface
		material performance using total package power. Defined as (TCASE – TS) / Total
		Package Power.
	ΨSA	Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
		performance using total package power. Defined as (TS – TLA) / Total Package Power.
	TCASE	The case temperature of the processor, measured at the geometric center of the topside
		of the IHS.
	TCASE_MAX	The maximum case temperature as specified in a component specification.
	TCC	Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature
		by using clock modulation and/or operating frequency and input voltage adjustment
		when the die temperature is very near its operating limits.

10 Quad-Core Intel® Xeon® Processor 5400 Series TMDG