Intel 5400 Series Component Overview, Figure A-1. Isometric View of the 1U Alternative Heatsink

1U Alternative Heatsink Thermal/Mechanical Design

A1U Alternative Heatsink Thermal/Mechanical Design

Intel has also developed an 1U alternative reference heatsink design for the volumetrically constrained form factor and targeted for the rack-optimized and ultra dense SKUs. This alternative heatsink design meets the thermal profile specifications of the Quad-Core Intel® Xeon® Processor E5400 Series and offers the advantages of weight reduction and cost savings in using this alternative 1U heatsink.

This section describes the alternative heatsink thermal performance and adherence to Quad-Core Intel® Xeon® Processor E5400 Series thermal profile specifications.

A.1 Component Overview

The alternative 1U reference heatsink is an extruded aluminum heatsink and shares the same volumetric footprint as the 1U CEK heatsink. It reuses Intel 1U CEK Captive standoff/screws, Thermal Interface Material (TIM) and Spring.

Figure A-1shows the isometric view of the 1U alternative heatsink.

Figure A-1. Isometric View of the 1U Alternative Heatsink

Note: Refer to Appendix B for more detailed mechanical drawings of the heatsink.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 53