Intel D15343-003 manual Package Mechanical Information

Intel® 82854 Graphics Memory Controller Hub (GMCH)

9.2Package Mechanical Information

Figure 13 through Figure 15 provide detail on the package information and dimensions of the Intel® 82854 GMCH. The Intel® 82854 GMCH comes in a Micro-FCBGA package, which is similar to the mobile processors. The package consists of a silicon die mounted face down on an organic substrate populated with solder balls on the bottom side. Capacitors may be placed in the area surrounding the die. Because the die-side capacitors are electrically conductive, and only slightly shorter than the die height, care should be taken to avoid contacting the capacitors with electrically conductive materials. Doing so may short the capacitors and possibly damage the device or render it inactive.

The use of an insulating material between the capacitors and any thermal solution should be considered to prevent capacitor shorting. An exclusion, or keepout area, surrounds the die and capacitors, and identifies the contact area for the package. Care should be taken to avoid contact with the package inside this area.

Figure 13. Intel® 82854 GMCH Micro-FCBGA Package Dimensions (Top View)

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