Intel GD82559ER Timing Parameters, Measurement and Test Conditions, C L K, Tri-State O U T P U T

Models: GD82559ER

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GD82559ER — Networking Silicon

10.4.2Timing Parameters

10.4.2.1Measurement and Test Conditions

Figure 27, Figure 28, and Table 24 define the conditions under which timing measurements are done. The component test guarantees that all timings are met with minimum clock slew rate (slowest edge) and voltage swing. The design must guarantee that minimum timings are also met with maximum clock slew rate (fastest edge) and voltage swing. In addition, the design must guarantee proper input operation for input voltage swings and slew rates that exceed the specified test conditions.

C L K

O U T P U T D E L A Y

Tri-State

O U T P U T

V_th

V_test

V_tl

T_val

V_step

V_test V_test

T_on

T_off

Figure 27. Output Timing Measurement Conditions

C L K

V_th

I N P U T

V_test

V_tl

V_test

T_su

T_h

inputs

valid

V_th

V_tl

V_test V_max

Figure 28. Input Timing Measurement Conditions

Table 24. Measure and Test Condition Parameters

Symbol

PCI Level

Units

Notes

 

 

 

 

Vth

0.6VCC

V

 

Vtl

0.2VCC

V

 

Vtest

0.4VCC

V

 

78

Datasheet

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Image 84
Intel GD82559ER Timing Parameters, Measurement and Test Conditions, Output Timing Measurement Conditions, C L K, I N P U T