NEC SP B-Series manual Processor, Random Access Memory, System Specifications

This section describes system specifications.

Processor

Microprocessor ⎯ 350-MHz, 400-MHz, or 450-MHz Pentium II processor or 500-MHz Pentium III processor

Clock Rate

350 MHz internally, 100 MHz FSB

400 MHz internally, 100 MHz FSB

450 MHz internally, 100 MHz FSB

500 MHz internally, 100 MHz FSB

Processor Support

T32-bit addressing

64-bit data

Primary Cache ⎯ 32 KB of internal write-back cache on processor

Secondary Cache ⎯ 512 KB of pipeline burst cache

Processor Mounting

Processor subsystem is inserted into slot 1 on the system board.

A 242-pin edge connector is implemented on the processor board for system board installation.

Retention Mechanism (RM) is inserted over slot 1 to act as an insertion

Tguide and prevent movement of processor after subsystem mounting.

For thermal protection, a heatsink is supported by a Heat Sink Support (HSS) which is attached to the system board.

Random Access Memory

Standard Random Access Memory (RAM) ⎯ 32 MB to 384 MB of 100-MHz SDRAM installed in industry-standard DIMM sockets on system board

Total Memory ⎯ support for up to 384 MB of high-speed PC100 SDRAM

DIMM type ⎯ gold-plated, dual in-line modules (DIMMs)

Expansion ⎯ expandable using the following modules:

4-Mbit by 64 (32-MB DIMM)

T8-Mbit by 64 (64-MB DIMM)

16-Mbit by 64 (128-MB DIMM)

A-2 System Specifications