Tektronix 494AP Stancdischarge, Can Damage, Semiconductor Many Componentsused, Thisinstrument

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o							Secdon5 -	4g4Al494ApService Vot. 1
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o				ADJUSTMENT
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o	fntroduction						1. Handle static-sensitivecomponentsor
	l{ the lnstrument
t							circuit
	requarements		performanceis not withinspecified				face. assembliesat or on a static-freesur_
o		for a	particular characteristic,			determine	Work station areas shouldcontaina
	the cause,repairif necessary,						static-free bench cover or work plane			such
o			then use the appropriate
	adiustmentprocedureto retuln the instrumentoperation						as conductivepolyethylenesheetingand a
	to .performancespecification. After any adjustment,						grounding wrist strap.		The work plane
o	verify performance				the perfor_		shouldbe connected
	manceCheck.		by repeatingthat part;f				to earthground.
o							2. All test equipment, accessories,and
	Allow the instrum€nt						soldering tools should		be connected to
o			to warm up for at least one
	hour, in an ambienttemperatureof *20" C to +30oC						earthground.
o	FI:*	m.akingany adjustments.Waveformiilustrations					3. Minimizehandlingby keepingthe com_
	tn tne adrustmentprocedureare typicaland may differ						ponents in their original containers until
o	from	one instrument to another: These waveforms					ready for use. Minimizethe removaland
o	should not b€ construedas being repres€ntative						installationof semiconductors
						of
	speciftcationtolerances.						cuit boards.		from theircir_
a							4. Hold the lC devicesby their body rather
o							thanthe terminals.
a							5. Use containers made of conductive
							material or filled with conductivemateriat
o		STANCDISCHARGE					for storageand transportation.Avoidusing
o
			CAN DAMAGE				ordinaryplasticcontainers.Any static sen_
		SEMICONDUCTOR		MANY
			COMPONENTSUSED				sitivepart or assembly(circultboard)that is
o		IN THISINSTRUMENT.					to be returnedto Tektronix,lnc., shouldbe
		Many semiconductor					packaged in its original containeror one
O			components, esDe-				with anti-staticpackagingmaterial.
		ciallyMOStypes,can be damagedOystitic
O		discharge. Damage may not be catas-
		trophic and,	therefore, not	immediately
o		appare-nt.lt usuallyappearsas a degrada-					Equipment Required
		ilon or the semiconductorcharacteristics.
o
		Devices-lhatare particularly susceptible					Table 5-1 lists additionaltest equipm€ntand test
o		are: MOS,	CMOS, JFETa,	and	high		fixtures recommended		adjustmentprocedure.
		impedanceoperationalamplifiers(FETinp-ut					for the
							Test equipmentlist€d in Table 5-1 togetherwith those
o		stag€s.) The damagedparts may operate					listedin Table4-1 in Section4, performanceCheckare
o		wttntnacceptedlimits over a short period,					requiredfor the adjustmentprocedure.The characteris_
		but their reliabilitywiil have been severely					tics specifiedare the minimumrequiredfor the checks.
o		impaired.- Damage can be		significanily			Substitute equipment must	meet or exceed these
		reducedby observingthe followingp.ecau-					charact€ristics.
a		tions.
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o										5-1
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