Intel
manual
Intel IXP43X Product Line of Network Processors, Hardware Design Guidelines
PCI Interface Block Diagram
Signal Type Definitions
Reset Configuration Straps
Reset Timing
Component Placement
Power
Soft Fusible Features Sheet 2
Common Mode Choke
Page 1
Intel
®
IXP43X Product Line of Network Processors
Hardware Design Guidelines
April 2007
Document Number:
316844;
Revision:
001US
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Page 2
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Contents
Hardware Design Guidelines
Intel IXP43X Product Line of Network Processors
HDG
Intel IXP43X Product Line of Network Processors
April
Contents
Figures
Tables
Document Number 316844 Revision 001US
Date Revision Description
§ §
001 Initial release
HDG
Chapter Name Description
Content Overview
Acronyms
Related Documentation
List of Acronyms and Abbreviations Sheet 1
Term Explanation
List of Acronyms and Abbreviations Sheet 2
Overview
HDG
Intel IXP435 Network Processor Block Diagram
Typical Applications
System Memory Map
System Architecture Description
Intel IXP43X Product
Signal Type Definitions
Soft Fusible Features
Soft Fusible Features Sheet 1
Symbol Description
USB Host Each USB can be Enable separately
Soft Fusible Features Sheet 2
DDRII/I Sdram Interface
Ethernet
DDRII/I Sdram Interface Pin Description Sheet 1
Signal Interface
Type
Name Device-Pin Connection Terminatio Description Field
DDRII/I Sdram Interface Pin Description Sheet 2
DDRII/I Sdram Initialization
Expansion Bus
Expansion Bus Signal Recommendations Sheet 1
Type Pull Name Recommendations Field Down
Expansion Bus Signal Recommendations Sheet 2
Reset Configuration Straps
Boot/Reset Strapping Configuration Sheet 1
Name Type Pull Recommendations Field Down
Boot/Reset Strapping Configuration Sheet 2
3 8-Bit Device Interface
Setting Intel XScale Processor Operation Speed
Intel XScale Processor Cfg0 Cfg1 Cfgenn Actual Core Speed
MHz
4 16-Bit Device Interface
16-Bit Device Interface
Flash Interface
Flash Interface Example
Uart Interface
Uart Signal Recommendations
Uart Interface Example
MII Interface
MII NPE a Signal Recommendations
Signal Interface MII
MII NPE C Signal Recommendations Sheet 1
MAC Management Signal Recommendations NPE a and NPE C
MII NPE C Signal Recommendations Sheet 2
Device Connection, MII
MII Interface Example
Gpio Interface
USB Interface
Gpio Signal Recommendations
Design Notes
Name Type Pull Description Field Down
USB Host Signal Recommendations
Common Mode Choke
Host Device
Utopia Level 2/MIIA
Utopia Level 2 Interface
Type Pull Name Description Field Down
UTPOPDATA75
UTPOPDATA4
UTPOPADDR40
Utpopfci
Utpipfci
Clav
Utpipsoc
ETHARXDATA30 Etharxclk
UTPIPDATA6
UTPIPDATA5
UTPIPDATA7
UTPIPADDR40
Device Connection
HSS Interface
HSSTXDATA0
High-Speed, Serial Interface
HSSTXCLK0
HSSRXDATA0
HSS Interface Example
SSP Interface
Synchronous Serial Peripheral Port Interface
Serial Flash and SSP Port SPI Interface Example
PCI Interface
PCI Controller Sheet 1
PCI Controller Sheet 2
PCI Interface Block Diagram
Pciintan
Pciclkin
PCI Option Interface
Connect signal to same pin between PCI Parity Two devices
PCI Host/Option Interface Pin Description Sheet 1
Type Option Description Name Device-Pin Connection Field
Signal PCIREQN0 to one PCIREQN30 inputs to the Host
On the Option device, these signals are not
PCI Host/Option Interface Pin Description Sheet 2
Type Option Name Device-Pin Connection Description Field
PCI Host/Option Interface Pin Description Sheet 3
Jtag Interface
Clock Signals
Clock Signals
Input System Clock
Clock Oscillator
Recommendations for Crystal Selection
Power Supply
Power
Nominal Name Voltage Description
Reset Timing
Power Sequence
Decoupling Capacitance Recommendations
VCC Decoupling
§ §
PCB Overview
Component Placement
General Recommendations
Component Selection
Stack-Up Selection
Component Placement on a PCB
Controlled-impedance traces Low-impedance power distribution
Layer Stackup
General Layout Guidelines
General Layout and Routing Guide
General Component Spacing
Signal Changing Reference Planes
Good Design Practice for VIA Hole Placement
Pad-to-Pad Clearance of Passive Components to a PGA or BGA
Clock Signal Considerations
USB V2.0 Considerations
MII Signal Considerations
Crosstalk
EMI Design Considerations
Power and Ground Plane
Trace Impedance
§ §
Topology
Electrical Interface
@33 MHz
Tcyc = 30 nSec Tval = 11 nSec Tprop = 10 nSec
PCI Address/Data Routing Guidelines
Clock Distribution
Parameter Routing Guidelines
PCI Clock Routing Guidelines
Trace Length Limits
Routing Guidelines
Signal Loading
Introduction
Ddrii / Ddri Sdram
Group Signal Name Description
DDRII/I Signal Groups
Drasn / Ddrrasn
Dcasn / Ddrcasn
DDR Sdram
Supported Ddrii 32-bit Sdram Configurations
Supported Ddri 32-bit Sdram Configurations
Supported Ddri 16-bit Sdram Configurations
Sizea
DDRII/DDRI Rcomp and Slew Resistances Pin Requirements
Supported Ddrii 16-bit Sdram Configurations
Address Size Leaf Select Total
Technology Arrangement Banks
Ddrii OCD Pin Requirements
DDR-II Symbol Parameter Units Min Max
DDR Clock Timings
DDR Sdram Write Timings
Symbol Parameter Minimum Nominal Maximum Units
DDRII-400 MHz Interface -- Signal Timings
Symbol Parameter Minimum Nom Maximum Units
DDR II/I Sdram Interface -- Signal Timings
Timing Relationships
Printed Circuit Board Layer Stackup
Group Signal Name Length mil
Signal Package Lengths Sheet 1
Timing Relationships
Signal Package Lengths Sheet 2
Clock Group
Signal Package Lengths Sheet 3
Parameter Definition
Data and Control Groups
DCB70/DDRCB70, DDQ310 / DDRDQ310
Ddrii Data and Control Signal Group Routing Guidelines
Signal Group Members
Ddrii Command Signal Group Routing Guidelines
§ §
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