Intel IXP43X manual DDRII-400 MHz Interface -- Signal Timings

Page 78

Intel® IXP43X Product Line of Network Processors—Hardware Design Guidelines

Figure 31. DDR - Write Preamble/Postamble Duration

DQS

TVB6

DQS

TVA6

Table 30.

DDRII-400 MHz Interface -- Signal Timings

 

 

 

 

 

 

 

 

 

 

 

 

Symbol

 

Parameter

Minimum

Nominal

Maximum

Units

Notes

 

 

 

 

 

 

 

 

TVB1

 

DQ, CB and DM write output valid time before DQS.

521

 

 

ps

1

TVA1

 

DQ, CB and DM write output valid time after DQS.

521

 

 

ps

1

TVB3

 

Address and Command write output valid before CK

1771

 

 

ps

1, 4

 

rising edge.

 

 

TVA3

 

Address and Command write output valid after CK rising

1771

 

 

ps

1, 4

 

edge.

 

 

TVB4

 

DQ, CB and DM read input valid time before DQS rising

323

 

 

ps

2

 

or falling edges.

 

 

TVA4

 

DQ, CB and DM read input valid time after DQS rising or

323

 

 

ps

2

 

falling edges.

 

 

TVB5

 

CS_N[1:0] control valid before CK rising edge.

1771

 

 

ps

4

TVA5

 

CS_N[1:0] control valid after CK rising edge.

1771

 

 

ps

4

TVB6

 

DQS write preamble duration.

 

3750

 

ps

3

TVA6

 

DQS write postamble duration.

 

2500

 

ps

3

TV7

 

DQ, CB, and DM pulse width (tDIPW)

 

1750

 

ps

1

Notes:

 

 

 

 

 

 

 

 

1.

See Figure 29, “DDR SDRAM Write Timings” on page 77

 

 

 

 

 

2.

See Figure 30, “DDR SDRAM Read Timings” on page 77. The specified minimum requirements for the “Data to strobe

 

read setup” and “Data from strobe read hold” are determined with the DQS delay programmed for 90 degree phase

 

shift.

 

 

 

 

 

 

3.

See Figure 31, “DDR - Write Preamble/Postamble Duration” on page 78

 

 

 

 

4.

Address/Command pin group; RAS_N, CAS_N, WE_N, MA[13:0], BA[1:0]

 

 

 

 

5.

Designed to JEDEC specification; it is recommended that IBIS models should be used to verify signal integrity on

 

individual designs

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Intel® IXP43X Product Line of Network Processors

 

HDG

April 2007

78

Document Number: 316844; Revision: 001US

Image 78
Contents Intel IXP43X Product Line of Network Processors Hardware Design GuidelinesIntel IXP43X Product Line of Network Processors HDGApril Contents Figures Tables Document Number 316844 Revision 001US § § Date Revision Description001 Initial release HDG Content Overview Chapter Name DescriptionList of Acronyms and Abbreviations Sheet 1 Related DocumentationAcronyms Term ExplanationOverview List of Acronyms and Abbreviations Sheet 2HDG Intel IXP435 Network Processor Block Diagram Typical Applications System Architecture Description System Memory MapIntel IXP43X Product Soft Fusible Features Sheet 1 Soft Fusible FeaturesSignal Type Definitions Symbol DescriptionDDRII/I Sdram Interface Soft Fusible Features Sheet 2USB Host Each USB can be Enable separately EthernetType Signal InterfaceDDRII/I Sdram Interface Pin Description Sheet 1 Name Device-Pin Connection Terminatio Description FieldDDRII/I Sdram Initialization DDRII/I Sdram Interface Pin Description Sheet 2Expansion Bus Signal Recommendations Sheet 1 Expansion BusType Pull Name Recommendations Field Down Boot/Reset Strapping Configuration Sheet 1 Reset Configuration StrapsExpansion Bus Signal Recommendations Sheet 2 Name Type Pull Recommendations Field DownBoot/Reset Strapping Configuration Sheet 2 Intel XScale Processor Cfg0 Cfg1 Cfgenn Actual Core Speed Setting Intel XScale Processor Operation Speed3 8-Bit Device Interface MHz4 16-Bit Device Interface Flash Interface 16-Bit Device InterfaceUart Interface Flash Interface ExampleUart Signal Recommendations MII Interface Uart Interface ExampleSignal Interface MII MII NPE a Signal RecommendationsMII NPE C Signal Recommendations Sheet 1 MII NPE C Signal Recommendations Sheet 2 MAC Management Signal Recommendations NPE a and NPE CDevice Connection, MII Gpio Interface MII Interface ExampleGpio Signal Recommendations USB InterfaceDesign Notes USB Host Signal Recommendations Name Type Pull Description Field DownCommon Mode Choke Host Device Utopia Level 2 Interface Utopia Level 2/MIIAType Pull Name Description Field Down UTPOPADDR40 UTPOPDATA4UTPOPDATA75 UtpopfciUtpipsoc ClavUtpipfci ETHARXDATA30 EtharxclkUTPIPDATA7 UTPIPDATA5UTPIPDATA6 UTPIPADDR40HSS Interface Device ConnectionHSSTXCLK0 High-Speed, Serial InterfaceHSSTXDATA0 HSSRXDATA0SSP Interface HSS Interface ExampleSynchronous Serial Peripheral Port Interface PCI Interface Serial Flash and SSP Port SPI Interface ExamplePCI Controller Sheet 1 Pciintan PCI Interface Block DiagramPCI Controller Sheet 2 PciclkinPCI Host/Option Interface Pin Description Sheet 1 Connect signal to same pin between PCI Parity Two devicesPCI Option Interface Type Option Description Name Device-Pin Connection FieldPCI Host/Option Interface Pin Description Sheet 2 On the Option device, these signals are notSignal PCIREQN0 to one PCIREQN30 inputs to the Host Type Option Name Device-Pin Connection Description FieldJtag Interface PCI Host/Option Interface Pin Description Sheet 3Input System Clock Clock SignalsClock Signals Clock OscillatorRecommendations for Crystal Selection Power Power SupplyNominal Name Voltage Description Decoupling Capacitance Recommendations Power SequenceReset Timing VCC Decoupling§ § General Recommendations Component PlacementPCB Overview Component SelectionComponent Placement on a PCB Stack-Up SelectionControlled-impedance traces Low-impedance power distribution Layer Stackup General Layout and Routing Guide General Layout GuidelinesSignal Changing Reference Planes General Component SpacingGood Design Practice for VIA Hole Placement Clock Signal Considerations Pad-to-Pad Clearance of Passive Components to a PGA or BGAMII Signal Considerations USB V2.0 ConsiderationsCrosstalk Power and Ground Plane EMI Design ConsiderationsTrace Impedance § § @33 MHz Electrical InterfaceTopology Tcyc = 30 nSec Tval = 11 nSec Tprop = 10 nSecClock Distribution PCI Address/Data Routing GuidelinesParameter Routing Guidelines Trace Length Limits PCI Clock Routing GuidelinesSignal Loading Routing GuidelinesDdrii / Ddri Sdram IntroductionDrasn / Ddrrasn DDRII/I Signal GroupsGroup Signal Name Description Dcasn / DdrcasnDDR Sdram Supported Ddri 16-bit Sdram Configurations Supported Ddri 32-bit Sdram ConfigurationsSupported Ddrii 32-bit Sdram Configurations SizeaAddress Size Leaf Select Total Supported Ddrii 16-bit Sdram ConfigurationsDDRII/DDRI Rcomp and Slew Resistances Pin Requirements Technology Arrangement BanksDDR-II Symbol Parameter Units Min Max Ddrii OCD Pin RequirementsDDR Clock Timings DDR Sdram Write Timings DDRII-400 MHz Interface -- Signal Timings Symbol Parameter Minimum Nominal Maximum UnitsTiming Relationships DDR II/I Sdram Interface -- Signal TimingsSymbol Parameter Minimum Nom Maximum Units Printed Circuit Board Layer StackupSignal Package Lengths Sheet 1 Group Signal Name Length milTiming Relationships Signal Package Lengths Sheet 2 Signal Package Lengths Sheet 3 Clock GroupData and Control Groups Parameter DefinitionDdrii Data and Control Signal Group Routing Guidelines DCB70/DDRCB70, DDQ310 / DDRDQ310Ddrii Command Signal Group Routing Guidelines Signal Group Members§ §