Intel IXP43X manual Layer Stackup

Page 59

Hardware Design Guidelines—Intel®IXP43X Product Line of Network Processors

Figure 17. 8-Layer Stackup

		4.5 mil
Component (Top) Side		5 mil
		5 mil
Data	L1	7 mil
	L1
Data	L2	17.8 mil
	L2
Data
Data	L3
	L3
	L4	7 mil	62 mil
	L4
		5 mil
	L5	4.5 mil
	L5
Data	L6
	L6
Data	L7
	L7
Solder (Bottom) Side	L8

Legend

SIGNAL

GND

POWER

B2244-02

Figure 18. 6-Layer Stackup

		4.5 mil
Component (Top) Side		7 mil
Component (Top) Side
	L1	~40 mil
		~40 mil
	L2	7 mil
		7 mil
	L3	62 mil
		4.5 mil
	L4
	L5
Solder (Bottom) Side	L6

Legend

SIGNAL

GND

POWER

B2275-02

•Fast and slow transmission line networks must be considered

•PCB-board velocities

•Board FR4 ~ 4.3

•Target impedance of 50 Ω ± 10%

•Trace width: 5 mils

•Signal Layers (1/2 oz. Copper)

•Power Layer (1 oz. Copper)

•Ground (GND) Layer (1 oz. Copper)

§§

	Intel® IXP43X Product Line of Network Processors
April 2007	HDG
Document Number: 316844; Revision: 001US	59

Image 59

Contents Hardware Design Guidelines Intel IXP43X Product Line of Network ProcessorsApril Intel IXP43X Product Line of Network ProcessorsHDG Contents Figures Tables Document Number 316844 Revision 001US 001 Initial release § §Date Revision Description HDG Chapter Name Description Content OverviewTerm Explanation Related DocumentationAcronyms List of Acronyms and Abbreviations Sheet 1List of Acronyms and Abbreviations Sheet 2 OverviewHDG Intel IXP435 Network Processor Block Diagram Typical Applications System Memory Map System Architecture DescriptionIntel IXP43X Product Symbol Description Soft Fusible FeaturesSignal Type Definitions Soft Fusible Features Sheet 1Ethernet Soft Fusible Features Sheet 2USB Host Each USB can be Enable separately DDRII/I Sdram InterfaceName Device-Pin Connection Terminatio Description Field Signal InterfaceDDRII/I Sdram Interface Pin Description Sheet 1 TypeDDRII/I Sdram Interface Pin Description Sheet 2 DDRII/I Sdram InitializationType Pull Name Recommendations Field Down Expansion Bus Signal Recommendations Sheet 1Expansion Bus Name Type Pull Recommendations Field Down Reset Configuration StrapsExpansion Bus Signal Recommendations Sheet 2 Boot/Reset Strapping Configuration Sheet 1Boot/Reset Strapping Configuration Sheet 2 MHz Setting Intel XScale Processor Operation Speed3 8-Bit Device Interface Intel XScale Processor Cfg0 Cfg1 Cfgenn Actual Core Speed4 16-Bit Device Interface 16-Bit Device Interface Flash InterfaceFlash Interface Example Uart InterfaceUart Signal Recommendations Uart Interface Example MII InterfaceMII NPE C Signal Recommendations Sheet 1 Signal Interface MIIMII NPE a Signal Recommendations Device Connection, MII MII NPE C Signal Recommendations Sheet 2MAC Management Signal Recommendations NPE a and NPE C MII Interface Example Gpio InterfaceDesign Notes Gpio Signal RecommendationsUSB Interface Name Type Pull Description Field Down USB Host Signal RecommendationsCommon Mode Choke Host Device Type Pull Name Description Field Down Utopia Level 2 InterfaceUtopia Level 2/MIIA Utpopfci UTPOPDATA4UTPOPDATA75 UTPOPADDR40ETHARXDATA30 Etharxclk ClavUtpipfci UtpipsocUTPIPADDR40 UTPIPDATA5UTPIPDATA6 UTPIPDATA7Device Connection HSS InterfaceHSSRXDATA0 High-Speed, Serial InterfaceHSSTXDATA0 HSSTXCLK0HSS Interface Example SSP InterfaceSynchronous Serial Peripheral Port Interface Serial Flash and SSP Port SPI Interface Example PCI InterfacePCI Controller Sheet 1 Pciclkin PCI Interface Block DiagramPCI Controller Sheet 2 PciintanType Option Description Name Device-Pin Connection Field Connect signal to same pin between PCI Parity Two devicesPCI Option Interface PCI Host/Option Interface Pin Description Sheet 1Type Option Name Device-Pin Connection Description Field On the Option device, these signals are notSignal PCIREQN0 to one PCIREQN30 inputs to the Host PCI Host/Option Interface Pin Description Sheet 2PCI Host/Option Interface Pin Description Sheet 3 Jtag InterfaceClock Oscillator Clock SignalsClock Signals Input System ClockRecommendations for Crystal Selection Nominal Name Voltage Description PowerPower Supply VCC Decoupling Power SequenceReset Timing Decoupling Capacitance Recommendations§ § Component Selection Component PlacementPCB Overview General RecommendationsStack-Up Selection Component Placement on a PCBControlled-impedance traces Low-impedance power distribution Layer Stackup General Layout Guidelines General Layout and Routing GuideGeneral Component Spacing Signal Changing Reference PlanesGood Design Practice for VIA Hole Placement Pad-to-Pad Clearance of Passive Components to a PGA or BGA Clock Signal ConsiderationsCrosstalk MII Signal ConsiderationsUSB V2.0 Considerations Trace Impedance Power and Ground PlaneEMI Design Considerations § § Tcyc = 30 nSec Tval = 11 nSec Tprop = 10 nSec Electrical InterfaceTopology @33 MHzParameter Routing Guidelines Clock DistributionPCI Address/Data Routing Guidelines PCI Clock Routing Guidelines Trace Length LimitsRouting Guidelines Signal LoadingIntroduction Ddrii / Ddri SdramDcasn / Ddrcasn DDRII/I Signal GroupsGroup Signal Name Description Drasn / DdrrasnDDR Sdram Sizea Supported Ddri 32-bit Sdram ConfigurationsSupported Ddrii 32-bit Sdram Configurations Supported Ddri 16-bit Sdram ConfigurationsTechnology Arrangement Banks Supported Ddrii 16-bit Sdram ConfigurationsDDRII/DDRI Rcomp and Slew Resistances Pin Requirements Address Size Leaf Select TotalDDR Clock Timings DDR-II Symbol Parameter Units Min MaxDdrii OCD Pin Requirements DDR Sdram Write Timings Symbol Parameter Minimum Nominal Maximum Units DDRII-400 MHz Interface -- Signal TimingsPrinted Circuit Board Layer Stackup DDR II/I Sdram Interface -- Signal TimingsSymbol Parameter Minimum Nom Maximum Units Timing RelationshipsTiming Relationships Signal Package Lengths Sheet 1Group Signal Name Length mil Signal Package Lengths Sheet 2 Clock Group Signal Package Lengths Sheet 3Parameter Definition Data and Control GroupsDCB70/DDRCB70, DDQ310 / DDRDQ310 Ddrii Data and Control Signal Group Routing GuidelinesSignal Group Members Ddrii Command Signal Group Routing Guidelines§ §