Intel IXP43X Input System Clock, Clock Signals, Clock Oscillator, Name Type Description Field

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Hardware Design Guidelines—Intel®IXP43X Product Line of Network Processors

3.12.1Signal Interface

Table 19.

Synchronous Serial Peripheral Port Interface

 

 

 

 

Name

Type

Pull

 

Up/

Recommendations

Field

 

Down

 

 

 

 

 

 

 

 

 

 

 

Test mode select.

JTG_TMS

I

Yes

When the JTAG interface is not being used, the signal must be pulled high using a 10-kΩ

 

 

 

resistor.

 

 

 

 

 

 

 

Test Input data.

JTG_TDI

I

Yes

Ω

 

 

 

When the JTAG interface is not being used, the signal must be pulled high using a 10-k

 

 

 

resistor.

 

 

 

 

JTG_TDO

O

O

Test Output data.

 

 

 

 

 

 

 

Test Reset.

JTG_TRST_N

I

Yes

Ω

 

 

 

When the JTAG interface is not being used, the signal must be pulled low using a 10-k

 

 

 

resistor.

 

 

 

 

 

 

 

Test Clock.

JTG_TCK

I

Yes

Ω

 

 

 

When the JTAG interface is not being used, the signal must be pulled high using a 10-k

 

 

 

resistor.

 

 

 

 

3.13Input System Clock

The IXP43X network processors require a 33.33-MHz reference clock to generate all internal clocks required including core clock and the various buses running internally within the system.

3.13.1Clock Signals

Table 20.

Clock Signals

 

 

 

 

 

 

 

Name

Type

Description

 

Field

 

 

 

 

 

 

 

 

OSC_IN

I

Source must be a clock input of 33.33-MHz.

 

Use a series termination resistor, 10 Ω to 33 Ω at the source.

 

 

 

 

 

 

 

 

OSC_OUT

O

No connect

 

 

 

 

3.13.2Clock Oscillator

While using an external clock oscillator to supply the 33.33-MHz reference system clock, connect the clock oscillator output to the OSC_IN pin through a series termination of 33 Ω as shown in Figure 14. The series termination helps to smooth the rise and fall edges of the clock and eliminate ringing. Leave the OSC_OUT pin unconnected.

 

Intel® IXP43X Product Line of Network Processors

April 2007

HDG

Document Number: 316844; Revision: 001US

51

Image 51
Contents Hardware Design Guidelines Intel IXP43X Product Line of Network ProcessorsIntel IXP43X Product Line of Network Processors HDGApril Contents Figures Tables Document Number 316844 Revision 001US § § Date Revision Description001 Initial release HDG Chapter Name Description Content OverviewTerm Explanation Related DocumentationAcronyms List of Acronyms and Abbreviations Sheet 1List of Acronyms and Abbreviations Sheet 2 OverviewHDG Intel IXP435 Network Processor Block Diagram Typical Applications System Memory Map System Architecture DescriptionIntel IXP43X Product Symbol Description Soft Fusible FeaturesSignal Type Definitions Soft Fusible Features Sheet 1Ethernet Soft Fusible Features Sheet 2USB Host Each USB can be Enable separately DDRII/I Sdram InterfaceName Device-Pin Connection Terminatio Description Field Signal InterfaceDDRII/I Sdram Interface Pin Description Sheet 1 TypeDDRII/I Sdram Interface Pin Description Sheet 2 DDRII/I Sdram InitializationExpansion Bus Signal Recommendations Sheet 1 Expansion BusType Pull Name Recommendations Field Down Name Type Pull Recommendations Field Down Reset Configuration StrapsExpansion Bus Signal Recommendations Sheet 2 Boot/Reset Strapping Configuration Sheet 1Boot/Reset Strapping Configuration Sheet 2 MHz Setting Intel XScale Processor Operation Speed3 8-Bit Device Interface Intel XScale Processor Cfg0 Cfg1 Cfgenn Actual Core Speed4 16-Bit Device Interface 16-Bit Device Interface Flash InterfaceFlash Interface Example Uart InterfaceUart Signal Recommendations Uart Interface Example MII InterfaceSignal Interface MII MII NPE a Signal RecommendationsMII NPE C Signal Recommendations Sheet 1 MII NPE C Signal Recommendations Sheet 2 MAC Management Signal Recommendations NPE a and NPE CDevice Connection, MII MII Interface Example Gpio InterfaceGpio Signal Recommendations USB InterfaceDesign Notes Name Type Pull Description Field Down USB Host Signal RecommendationsCommon Mode Choke Host Device Utopia Level 2 Interface Utopia Level 2/MIIAType Pull Name Description Field Down Utpopfci UTPOPDATA4UTPOPDATA75 UTPOPADDR40ETHARXDATA30 Etharxclk ClavUtpipfci UtpipsocUTPIPADDR40 UTPIPDATA5UTPIPDATA6 UTPIPDATA7Device Connection HSS InterfaceHSSRXDATA0 High-Speed, Serial InterfaceHSSTXDATA0 HSSTXCLK0HSS Interface Example SSP InterfaceSynchronous Serial Peripheral Port Interface Serial Flash and SSP Port SPI Interface Example PCI InterfacePCI Controller Sheet 1 Pciclkin PCI Interface Block DiagramPCI Controller Sheet 2 PciintanType Option Description Name Device-Pin Connection Field Connect signal to same pin between PCI Parity Two devicesPCI Option Interface PCI Host/Option Interface Pin Description Sheet 1Type Option Name Device-Pin Connection Description Field On the Option device, these signals are notSignal PCIREQN0 to one PCIREQN30 inputs to the Host PCI Host/Option Interface Pin Description Sheet 2PCI Host/Option Interface Pin Description Sheet 3 Jtag InterfaceClock Oscillator Clock SignalsClock Signals Input System ClockRecommendations for Crystal Selection Power Power SupplyNominal Name Voltage Description VCC Decoupling Power SequenceReset Timing Decoupling Capacitance Recommendations§ § Component Selection Component PlacementPCB Overview General RecommendationsStack-Up Selection Component Placement on a PCBControlled-impedance traces Low-impedance power distribution Layer Stackup General Layout Guidelines General Layout and Routing GuideGeneral Component Spacing Signal Changing Reference PlanesGood Design Practice for VIA Hole Placement Pad-to-Pad Clearance of Passive Components to a PGA or BGA Clock Signal ConsiderationsMII Signal Considerations USB V2.0 ConsiderationsCrosstalk Power and Ground Plane EMI Design ConsiderationsTrace Impedance § § Tcyc = 30 nSec Tval = 11 nSec Tprop = 10 nSec Electrical InterfaceTopology @33 MHzClock Distribution PCI Address/Data Routing GuidelinesParameter Routing Guidelines PCI Clock Routing Guidelines Trace Length LimitsRouting Guidelines Signal LoadingIntroduction Ddrii / Ddri SdramDcasn / Ddrcasn DDRII/I Signal GroupsGroup Signal Name Description Drasn / DdrrasnDDR Sdram Sizea Supported Ddri 32-bit Sdram ConfigurationsSupported Ddrii 32-bit Sdram Configurations Supported Ddri 16-bit Sdram ConfigurationsTechnology Arrangement Banks Supported Ddrii 16-bit Sdram ConfigurationsDDRII/DDRI Rcomp and Slew Resistances Pin Requirements Address Size Leaf Select TotalDDR-II Symbol Parameter Units Min Max Ddrii OCD Pin RequirementsDDR Clock Timings DDR Sdram Write Timings Symbol Parameter Minimum Nominal Maximum Units DDRII-400 MHz Interface -- Signal TimingsPrinted Circuit Board Layer Stackup DDR II/I Sdram Interface -- Signal TimingsSymbol Parameter Minimum Nom Maximum Units Timing RelationshipsSignal Package Lengths Sheet 1 Group Signal Name Length milTiming Relationships Signal Package Lengths Sheet 2 Clock Group Signal Package Lengths Sheet 3Parameter Definition Data and Control GroupsDCB70/DDRCB70, DDQ310 / DDRDQ310 Ddrii Data and Control Signal Group Routing GuidelinesSignal Group Members Ddrii Command Signal Group Routing Guidelines§ §