Intel IXP43X manual Trace Length Limits, PCI Clock Routing Guidelines

Page 69

Hardware Design Guidelines—Intel®IXP43X Product Line of Network Processors

Figure 24. PCI Clock Topology

 

 

 

PCI Devices

 

A

B

 

 

Rs

 

 

33 MHz

Clock

 

 

Driver

 

 

 

A

B

 

 

Rs

 

 

 

 

 

Intel®

 

A

B

IXP43X

 

Product Line

 

Rs

 

of Network

 

 

 

Processors

 

 

 

B4114 -004

Table 23.

PCI Clock Routing Guidelines

 

 

 

 

 

Parameter

Routing Guidelines

 

 

 

 

Signal Group

PCI Clock

 

 

 

 

Topology

Point-to-Point

 

 

 

 

Reference Plane

Ground

 

 

 

 

Characteristic Trace Impedance

55 Ω ±10%

 

 

 

 

Nominal Trace Width

5 mils

 

 

 

 

Nominal Trace Separation

10 mils

 

 

 

 

Spacing to Other Groups

20 mils

 

 

 

 

Trace length A

Maximum 300 mils

 

 

 

 

Trace length B

There is no limit as long as the trace length is maintained for

 

each clock and that maximum clock skew is not violated.

 

 

 

 

 

 

Resistor Rs

22 Ω ±10%

 

 

 

 

Maximum VIAS

6

 

 

 

6.3.1Trace Length Limits

Maximum trace lengths can be calculated for specific speeds at which the bus is intended to run. The limitations of the maximum trace length can be calculated with the equations shown in Section 6.2. Solve for TPROP and use it to calculate the maximum trace length. This is a straight-forward calculation, but very critical to meet timing. It is recommended to keep the trace lengths as short as possible and not to exceed TPROP.

Note: For acceptable signal integrity at up to 33 MHz, it is very important to design the PCB board with controller impedance in the range of 55 Ω ±10%.

 

Intel® IXP43X Product Line of Network Processors

April 2007

HDG

Document Number: 316844; Revision: 001US

69

Image 69
Contents Hardware Design Guidelines Intel IXP43X Product Line of Network ProcessorsIntel IXP43X Product Line of Network Processors HDGApril Contents Figures Tables Document Number 316844 Revision 001US § § Date Revision Description001 Initial release HDG Chapter Name Description Content OverviewAcronyms Related DocumentationList of Acronyms and Abbreviations Sheet 1 Term ExplanationList of Acronyms and Abbreviations Sheet 2 OverviewHDG Intel IXP435 Network Processor Block Diagram Typical Applications System Memory Map System Architecture DescriptionIntel IXP43X Product Signal Type Definitions Soft Fusible FeaturesSoft Fusible Features Sheet 1 Symbol DescriptionUSB Host Each USB can be Enable separately Soft Fusible Features Sheet 2DDRII/I Sdram Interface EthernetDDRII/I Sdram Interface Pin Description Sheet 1 Signal InterfaceType Name Device-Pin Connection Terminatio Description FieldDDRII/I Sdram Interface Pin Description Sheet 2 DDRII/I Sdram InitializationExpansion Bus Signal Recommendations Sheet 1 Expansion BusType Pull Name Recommendations Field Down Expansion Bus Signal Recommendations Sheet 2 Reset Configuration StrapsBoot/Reset Strapping Configuration Sheet 1 Name Type Pull Recommendations Field DownBoot/Reset Strapping Configuration Sheet 2 3 8-Bit Device Interface Setting Intel XScale Processor Operation SpeedIntel XScale Processor Cfg0 Cfg1 Cfgenn Actual Core Speed MHz4 16-Bit Device Interface 16-Bit Device Interface Flash InterfaceFlash Interface Example Uart InterfaceUart Signal Recommendations Uart Interface Example MII InterfaceSignal Interface MII MII NPE a Signal RecommendationsMII NPE C Signal Recommendations Sheet 1 MII NPE C Signal Recommendations Sheet 2 MAC Management Signal Recommendations NPE a and NPE CDevice Connection, MII MII Interface Example Gpio InterfaceGpio Signal Recommendations USB InterfaceDesign Notes Name Type Pull Description Field Down USB Host Signal RecommendationsCommon Mode Choke Host Device Utopia Level 2 Interface Utopia Level 2/MIIAType Pull Name Description Field Down UTPOPDATA75 UTPOPDATA4UTPOPADDR40 UtpopfciUtpipfci ClavUtpipsoc ETHARXDATA30 EtharxclkUTPIPDATA6 UTPIPDATA5UTPIPDATA7 UTPIPADDR40Device Connection HSS InterfaceHSSTXDATA0 High-Speed, Serial InterfaceHSSTXCLK0 HSSRXDATA0HSS Interface Example SSP InterfaceSynchronous Serial Peripheral Port Interface Serial Flash and SSP Port SPI Interface Example PCI InterfacePCI Controller Sheet 1 PCI Controller Sheet 2 PCI Interface Block DiagramPciintan PciclkinPCI Option Interface Connect signal to same pin between PCI Parity Two devicesPCI Host/Option Interface Pin Description Sheet 1 Type Option Description Name Device-Pin Connection FieldSignal PCIREQN0 to one PCIREQN30 inputs to the Host On the Option device, these signals are notPCI Host/Option Interface Pin Description Sheet 2 Type Option Name Device-Pin Connection Description FieldPCI Host/Option Interface Pin Description Sheet 3 Jtag InterfaceClock Signals Clock SignalsInput System Clock Clock OscillatorRecommendations for Crystal Selection Power Power SupplyNominal Name Voltage Description Reset Timing Power SequenceDecoupling Capacitance Recommendations VCC Decoupling§ § PCB Overview Component PlacementGeneral Recommendations Component SelectionStack-Up Selection Component Placement on a PCBControlled-impedance traces Low-impedance power distribution Layer Stackup General Layout Guidelines General Layout and Routing GuideGeneral Component Spacing Signal Changing Reference PlanesGood Design Practice for VIA Hole Placement Pad-to-Pad Clearance of Passive Components to a PGA or BGA Clock Signal ConsiderationsMII Signal Considerations USB V2.0 ConsiderationsCrosstalk Power and Ground Plane EMI Design ConsiderationsTrace Impedance § § Topology Electrical Interface@33 MHz Tcyc = 30 nSec Tval = 11 nSec Tprop = 10 nSecClock Distribution PCI Address/Data Routing GuidelinesParameter Routing Guidelines PCI Clock Routing Guidelines Trace Length LimitsRouting Guidelines Signal LoadingIntroduction Ddrii / Ddri SdramGroup Signal Name Description DDRII/I Signal GroupsDrasn / Ddrrasn Dcasn / DdrcasnDDR Sdram Supported Ddrii 32-bit Sdram Configurations Supported Ddri 32-bit Sdram ConfigurationsSupported Ddri 16-bit Sdram Configurations SizeaDDRII/DDRI Rcomp and Slew Resistances Pin Requirements Supported Ddrii 16-bit Sdram ConfigurationsAddress Size Leaf Select Total Technology Arrangement BanksDDR-II Symbol Parameter Units Min Max Ddrii OCD Pin RequirementsDDR Clock Timings DDR Sdram Write Timings Symbol Parameter Minimum Nominal Maximum Units DDRII-400 MHz Interface -- Signal TimingsSymbol Parameter Minimum Nom Maximum Units DDR II/I Sdram Interface -- Signal TimingsTiming Relationships Printed Circuit Board Layer StackupSignal Package Lengths Sheet 1 Group Signal Name Length milTiming Relationships Signal Package Lengths Sheet 2 Clock Group Signal Package Lengths Sheet 3Parameter Definition Data and Control GroupsDCB70/DDRCB70, DDQ310 / DDRDQ310 Ddrii Data and Control Signal Group Routing GuidelinesSignal Group Members Ddrii Command Signal Group Routing Guidelines§ §