Intel IXP43X manual SSP Interface, HSS Interface Example

Page 43

Hardware Design Guidelines—Intel®IXP43X Product Line of Network Processors

Figure 11. HSS Interface Example

Intel® IXP 43X

 

Vccp (3.3 V)

Product Line of

External Oscillator

 

10 KΩ

Network Processors

 

 

GPIO_0

 

 

 

GPIO_1

Clock derived internally

 

 

 

 

from 3.6864 MHz

 

SSP _EXTCLK

or external oscilator

 

33 MHz

 

 

 

RESET_N

INT_ N

 

 

SSP _SCLK

 

 

 

 

 

 

 

 

 

CLK

 

 

 

 

 

 

 

 

SSP _SFRM

 

 

 

 

 

 

 

 

 

CS_N

 

 

 

 

 

 

 

 

SSP_ TXD

 

 

 

 

 

 

 

 

 

D I

 

 

 

 

 

 

 

 

SSP_RXD

 

 

 

 

 

 

 

 

DO

 

 

 

 

 

 

 

 

SSP Interface

Vccp (3.3 V)

 

 

 

10 KΩ

HSS_TX_ FRAME0

 

 

 

 

 

 

 

 

 

 

 

HSS_TXDATA0

 

 

 

 

 

 

 

 

 

 

DTX

 

 

 

 

 

 

 

 

 

HSS_ TXCLK0

 

 

 

 

 

 

 

 

 

 

 

HSS_RXFRAME0

 

 

 

 

 

 

 

 

 

 

FSYNC

 

 

 

 

 

 

 

 

 

HSS_RXDATA0

 

 

 

 

 

 

 

 

 

 

RXD

 

 

 

 

 

 

 

 

 

 

HSS_ RXCLK0

 

 

 

 

 

 

 

 

 

 

 

PCLK

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Clock derived from

 

 

 

 

 

 

 

 

 

 

SLIC/CODEC

HSS Interface

 

 

 

or external oscilator SLIC CODEC

512 KHz to

8.192 MHz

AFE

RJ11

B4108 -005

3.10SSP Interface

The IXP43X network processors have a Synchronous Serial Peripheral Interface (SSP) module. Its primary function is to provide connectivity between the Intel XScale® Processor and an external SSP interface.

The SSP module supports Texas Instruments synchronous serial protocol (SSP)*, Motorola serial peripheral interface (SPI)* and National Microwire*.

The clock rate can be selected from an internal, 3.6864-MHz source or external source fed at input pin SSP_EXTCLK. The clock can then be divided down anywhere from

7.2KHz to 1.84 MHz by setting bits 15:08 in SSP Control Register 0 (SSCR0). For

instructions on the SSP configuration register, refer to the Serial Clock Register (SCR) subsection in the Memory Controller chapter of the Intel® IXP43X Product Line of Network Processors Datasheet.

 

Intel® IXP43X Product Line of Network Processors

April 2007

HDG

Document Number: 316844; Revision: 001US

43

Image 43
Contents Hardware Design Guidelines Intel IXP43X Product Line of Network ProcessorsHDG Intel IXP43X Product Line of Network ProcessorsApril Contents Figures Tables Document Number 316844 Revision 001US Date Revision Description § §001 Initial release HDG Chapter Name Description Content OverviewTerm Explanation Related DocumentationAcronyms List of Acronyms and Abbreviations Sheet 1List of Acronyms and Abbreviations Sheet 2 OverviewHDG Intel IXP435 Network Processor Block Diagram Typical Applications System Memory Map System Architecture DescriptionIntel IXP43X Product Symbol Description Soft Fusible FeaturesSignal Type Definitions Soft Fusible Features Sheet 1Ethernet Soft Fusible Features Sheet 2USB Host Each USB can be Enable separately DDRII/I Sdram InterfaceName Device-Pin Connection Terminatio Description Field Signal InterfaceDDRII/I Sdram Interface Pin Description Sheet 1 TypeDDRII/I Sdram Interface Pin Description Sheet 2 DDRII/I Sdram InitializationExpansion Bus Expansion Bus Signal Recommendations Sheet 1Type Pull Name Recommendations Field Down Name Type Pull Recommendations Field Down Reset Configuration StrapsExpansion Bus Signal Recommendations Sheet 2 Boot/Reset Strapping Configuration Sheet 1Boot/Reset Strapping Configuration Sheet 2 MHz Setting Intel XScale Processor Operation Speed3 8-Bit Device Interface Intel XScale Processor Cfg0 Cfg1 Cfgenn Actual Core Speed4 16-Bit Device Interface 16-Bit Device Interface Flash InterfaceFlash Interface Example Uart InterfaceUart Signal Recommendations Uart Interface Example MII InterfaceMII NPE a Signal Recommendations Signal Interface MIIMII NPE C Signal Recommendations Sheet 1 MAC Management Signal Recommendations NPE a and NPE C MII NPE C Signal Recommendations Sheet 2Device Connection, MII MII Interface Example Gpio InterfaceUSB Interface Gpio Signal RecommendationsDesign Notes Name Type Pull Description Field Down USB Host Signal RecommendationsCommon Mode Choke Host Device Utopia Level 2/MIIA Utopia Level 2 InterfaceType Pull Name Description Field Down Utpopfci UTPOPDATA4UTPOPDATA75 UTPOPADDR40ETHARXDATA30 Etharxclk ClavUtpipfci UtpipsocUTPIPADDR40 UTPIPDATA5UTPIPDATA6 UTPIPDATA7Device Connection HSS InterfaceHSSRXDATA0 High-Speed, Serial InterfaceHSSTXDATA0 HSSTXCLK0HSS Interface Example SSP InterfaceSynchronous Serial Peripheral Port Interface Serial Flash and SSP Port SPI Interface Example PCI InterfacePCI Controller Sheet 1 Pciclkin PCI Interface Block DiagramPCI Controller Sheet 2 PciintanType Option Description Name Device-Pin Connection Field Connect signal to same pin between PCI Parity Two devicesPCI Option Interface PCI Host/Option Interface Pin Description Sheet 1Type Option Name Device-Pin Connection Description Field On the Option device, these signals are notSignal PCIREQN0 to one PCIREQN30 inputs to the Host PCI Host/Option Interface Pin Description Sheet 2PCI Host/Option Interface Pin Description Sheet 3 Jtag InterfaceClock Oscillator Clock SignalsClock Signals Input System ClockRecommendations for Crystal Selection Power Supply PowerNominal Name Voltage Description VCC Decoupling Power SequenceReset Timing Decoupling Capacitance Recommendations§ § Component Selection Component PlacementPCB Overview General RecommendationsStack-Up Selection Component Placement on a PCBControlled-impedance traces Low-impedance power distribution Layer Stackup General Layout Guidelines General Layout and Routing GuideGeneral Component Spacing Signal Changing Reference PlanesGood Design Practice for VIA Hole Placement Pad-to-Pad Clearance of Passive Components to a PGA or BGA Clock Signal ConsiderationsUSB V2.0 Considerations MII Signal ConsiderationsCrosstalk EMI Design Considerations Power and Ground PlaneTrace Impedance § § Tcyc = 30 nSec Tval = 11 nSec Tprop = 10 nSec Electrical InterfaceTopology @33 MHzPCI Address/Data Routing Guidelines Clock DistributionParameter Routing Guidelines PCI Clock Routing Guidelines Trace Length LimitsRouting Guidelines Signal LoadingIntroduction Ddrii / Ddri SdramDcasn / Ddrcasn DDRII/I Signal GroupsGroup Signal Name Description Drasn / DdrrasnDDR Sdram Sizea Supported Ddri 32-bit Sdram ConfigurationsSupported Ddrii 32-bit Sdram Configurations Supported Ddri 16-bit Sdram ConfigurationsTechnology Arrangement Banks Supported Ddrii 16-bit Sdram ConfigurationsDDRII/DDRI Rcomp and Slew Resistances Pin Requirements Address Size Leaf Select TotalDdrii OCD Pin Requirements DDR-II Symbol Parameter Units Min MaxDDR Clock Timings DDR Sdram Write Timings Symbol Parameter Minimum Nominal Maximum Units DDRII-400 MHz Interface -- Signal TimingsPrinted Circuit Board Layer Stackup DDR II/I Sdram Interface -- Signal TimingsSymbol Parameter Minimum Nom Maximum Units Timing RelationshipsGroup Signal Name Length mil Signal Package Lengths Sheet 1Timing Relationships Signal Package Lengths Sheet 2 Clock Group Signal Package Lengths Sheet 3Parameter Definition Data and Control GroupsDCB70/DDRCB70, DDQ310 / DDRDQ310 Ddrii Data and Control Signal Group Routing GuidelinesSignal Group Members Ddrii Command Signal Group Routing Guidelines§ §