Intel IXP43X manual Signal Interface, DDRII/I Sdram Interface Pin Description Sheet 1, Type

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Hardware Design Guidelines—Intel®IXP43X Product Line of Network Processors

The memory controller only corrects single bit ECC errors on read cycles. The ECC is stored into the DDRII/DDRI SDRAM array along with the data and is checked when the data is read. If the code is incorrect, the MCU corrects the data before reaching the initiator of the read. ECC error scrubbing is done with software. User-defined fault correction software is responsible for The value written back into the memory location contains the 32-bit word with the modified byte and the new ECC value.

Refer to the Intel® IXP43X Product Line of Network Processors Datasheet for a detailed list of features.

General DDRII/I SDRAM routing guidelines can be found in Section 7.3.3, “Routing Guidelines” on page 82. For more detailed information, see the PC266 and PC400 DDR SDRAM specification.

3.2.1Signal Interface

Table 4.

DDRII/I SDRAM Interface Pin Description (Sheet 1 of 2)

 

 

 

 

 

 

 

 

Type

 

VTT

 

Name

 

Device-Pin Connection

Terminatio

Description

 

Field

 

 

 

n

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Connect a pair of differential clock

 

 

D_CK[2:0] /

 

O

signals to every device; When

 

DDRII/I SDRAM Clock Out — Provides the

 

using both banks, daisy chain

No

positive differential clocks to the external

DDR_CK[2:0]

 

 

 

devices with same data bit

 

SDRAM memory subsystem.

 

 

 

 

 

 

 

sequence.

 

 

 

 

 

 

 

 

D_CK_N[2:0] /

 

 

 

 

DDRII/I SDRAM Clock Out — Provides the

 

O

Same as above

No

negative differential clocks to the external

DDR_CK_N[2:0]

 

 

 

 

 

SDRAM memory subsystem.

 

 

 

 

 

 

 

 

 

 

 

D_CS_N[1:0] /

 

 

Use the same CS to control 32-bit

 

Chip Select — Must be asserted for all

 

O

Yes

transactions to the DDRII/I SDRAM device.

C_CS_N[1:0]

 

data + 8-bit ECC, per bank

 

 

 

One per bank.

 

 

 

 

 

 

 

 

 

 

 

D_RAS_N /

 

 

The RAS signal must be connected

 

Row Address Strobe — Indicates that the

 

O

to each device in a daisy chain

Yes

current address on D_MA[13:0] /

DDR_RAS_N

 

 

 

manner

 

DDR_MA[13:0] is the row.

 

 

 

 

 

 

 

 

 

 

D_CAS_N /

 

 

The CAS signal must be connected

 

Column Address Strobe — Indicates that the

 

O

to each device in a daisy chain

Yes

current address on D_MA[13:0] /

DDR_CAS_N

 

 

 

manner

 

DDR_MA[13:0] is the column.

 

 

 

 

 

 

 

 

 

 

 

 

 

The WE signal must be connected

 

Write Strobe — Defines whether or not the

D_WE_N / DDR_WE_N

O

to each device in a daisy chain

Yes

current operation by the DDRII/I SDRAM is to

 

 

 

manner

 

be a read or a write.

 

 

 

 

 

 

 

 

 

 

 

Data Bus Mask — Controls the DDRII/I SDRAM

 

 

 

Connect to each DM device pin.

 

data input buffers. Asserting D_WE_N/

 

 

 

 

DDR_WE_N causes the data on D_DQ[31:0]/

 

 

 

For the 8-bit devices connect one

 

DDR_DQ[31:0] and D_CB[7:0]/DDR_CB[7:0]

D_DM[4:0] /

 

 

DM signal per device.

 

to be written into the DDRII/I SDRAM devices.

 

O

For the 16-bit devices connect two

Yes

D_DM[4:0]/DDR_DM[4:0] controls this

DDR_DM[4:0]

 

 

 

DM signal per device (depending

 

operation on a per-byte basis. D_DM[3:0]/

 

 

 

 

 

 

 

on how many data bits are being

 

DDR_DM[3:0] are intended to correspond to

 

 

 

used).

 

each byte of a word of data. D/DM[4]/

 

 

 

 

 

DDR_DM[4] is intended to be utilized for the

 

 

 

 

 

ECC byte of data.

 

 

 

 

 

 

D_BA[1:0] /

 

 

The BA signals must be connected

 

DDRII/I SDRAM Bank Selects — Controls which

 

 

 

of the internal DDRII/I SDRAM banks to read

 

O

to each device in a daisy chain

Yes

DDR_BA[1:0]

 

or write. D_BA[1:0]/DDR_BA[1:0] are used for

 

 

manner.

 

 

 

 

 

all technology types supported.

 

 

 

 

 

 

 

 

 

 

 

D_MA[13:0] /

 

 

All address signals must be

 

Address bits 13 through 0 — Indicates the row

 

 

 

or column to access depending on the state of

 

O

connected to each device in a

Yes

DDR_MA[13:0]

 

D_RAS_N/DDR_RAS_N and D_CAS_N/

 

 

daisy chain manner.

 

 

 

 

 

DDR_CAS_N.

 

 

 

 

 

 

 

 

 

 

 

D_DQ[31:0] /

 

I/O

Must be connected in parallel to

Yes

Data Bus — 32-bit wide data bus.

DDR_DQ[31:0]

 

achieve a 32-bit bus width.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Intel® IXP43X Product Line of Network Processors

April 2007

 

 

 

 

HDG

Document Number: 316844; Revision: 001US

 

19

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Contents Hardware Design Guidelines Intel IXP43X Product Line of Network ProcessorsHDG Intel IXP43X Product Line of Network ProcessorsApril Contents Figures Tables Document Number 316844 Revision 001US Date Revision Description § §001 Initial release HDG Chapter Name Description Content OverviewTerm Explanation Related DocumentationAcronyms List of Acronyms and Abbreviations Sheet 1List of Acronyms and Abbreviations Sheet 2 OverviewHDG Intel IXP435 Network Processor Block Diagram Typical Applications System Memory Map System Architecture DescriptionIntel IXP43X Product Symbol Description Soft Fusible FeaturesSignal Type Definitions Soft Fusible Features Sheet 1Ethernet Soft Fusible Features Sheet 2USB Host Each USB can be Enable separately DDRII/I Sdram InterfaceName Device-Pin Connection Terminatio Description Field Signal InterfaceDDRII/I Sdram Interface Pin Description Sheet 1 TypeDDRII/I Sdram Interface Pin Description Sheet 2 DDRII/I Sdram InitializationExpansion Bus Expansion Bus Signal Recommendations Sheet 1Type Pull Name Recommendations Field Down Name Type Pull Recommendations Field Down Reset Configuration StrapsExpansion Bus Signal Recommendations Sheet 2 Boot/Reset Strapping Configuration Sheet 1Boot/Reset Strapping Configuration Sheet 2 MHz Setting Intel XScale Processor Operation Speed3 8-Bit Device Interface Intel XScale Processor Cfg0 Cfg1 Cfgenn Actual Core Speed4 16-Bit Device Interface 16-Bit Device Interface Flash InterfaceFlash Interface Example Uart InterfaceUart Signal Recommendations Uart Interface Example MII InterfaceMII NPE a Signal Recommendations Signal Interface MIIMII NPE C Signal Recommendations Sheet 1 MAC Management Signal Recommendations NPE a and NPE C MII NPE C Signal Recommendations Sheet 2Device Connection, MII MII Interface Example Gpio InterfaceUSB Interface Gpio Signal RecommendationsDesign Notes Name Type Pull Description Field Down USB Host Signal RecommendationsCommon Mode Choke Host Device Utopia Level 2/MIIA Utopia Level 2 InterfaceType Pull Name Description Field Down Utpopfci UTPOPDATA4UTPOPDATA75 UTPOPADDR40ETHARXDATA30 Etharxclk ClavUtpipfci UtpipsocUTPIPADDR40 UTPIPDATA5UTPIPDATA6 UTPIPDATA7Device Connection HSS InterfaceHSSRXDATA0 High-Speed, Serial InterfaceHSSTXDATA0 HSSTXCLK0HSS Interface Example SSP InterfaceSynchronous Serial Peripheral Port Interface Serial Flash and SSP Port SPI Interface Example PCI InterfacePCI Controller Sheet 1 Pciclkin PCI Interface Block DiagramPCI Controller Sheet 2 PciintanType Option Description Name Device-Pin Connection Field Connect signal to same pin between PCI Parity Two devicesPCI Option Interface PCI Host/Option Interface Pin Description Sheet 1Type Option Name Device-Pin Connection Description Field On the Option device, these signals are notSignal PCIREQN0 to one PCIREQN30 inputs to the Host PCI Host/Option Interface Pin Description Sheet 2PCI Host/Option Interface Pin Description Sheet 3 Jtag InterfaceClock Oscillator Clock SignalsClock Signals Input System ClockRecommendations for Crystal Selection Power Supply PowerNominal Name Voltage Description VCC Decoupling Power SequenceReset Timing Decoupling Capacitance Recommendations§ § Component Selection Component PlacementPCB Overview General RecommendationsStack-Up Selection Component Placement on a PCBControlled-impedance traces Low-impedance power distribution Layer Stackup General Layout Guidelines General Layout and Routing GuideGeneral Component Spacing Signal Changing Reference PlanesGood Design Practice for VIA Hole Placement Pad-to-Pad Clearance of Passive Components to a PGA or BGA Clock Signal ConsiderationsUSB V2.0 Considerations MII Signal ConsiderationsCrosstalk EMI Design Considerations Power and Ground PlaneTrace Impedance § § Tcyc = 30 nSec Tval = 11 nSec Tprop = 10 nSec Electrical InterfaceTopology @33 MHzPCI Address/Data Routing Guidelines Clock DistributionParameter Routing Guidelines PCI Clock Routing Guidelines Trace Length LimitsRouting Guidelines Signal LoadingIntroduction Ddrii / Ddri SdramDcasn / Ddrcasn DDRII/I Signal GroupsGroup Signal Name Description Drasn / DdrrasnDDR Sdram Sizea Supported Ddri 32-bit Sdram ConfigurationsSupported Ddrii 32-bit Sdram Configurations Supported Ddri 16-bit Sdram ConfigurationsTechnology Arrangement Banks Supported Ddrii 16-bit Sdram ConfigurationsDDRII/DDRI Rcomp and Slew Resistances Pin Requirements Address Size Leaf Select TotalDdrii OCD Pin Requirements DDR-II Symbol Parameter Units Min MaxDDR Clock Timings DDR Sdram Write Timings Symbol Parameter Minimum Nominal Maximum Units DDRII-400 MHz Interface -- Signal TimingsPrinted Circuit Board Layer Stackup DDR II/I Sdram Interface -- Signal TimingsSymbol Parameter Minimum Nom Maximum Units Timing RelationshipsGroup Signal Name Length mil Signal Package Lengths Sheet 1Timing Relationships Signal Package Lengths Sheet 2 Clock Group Signal Package Lengths Sheet 3Parameter Definition Data and Control GroupsDCB70/DDRCB70, DDQ310 / DDRDQ310 Ddrii Data and Control Signal Group Routing GuidelinesSignal Group Members Ddrii Command Signal Group Routing Guidelines§ §