Intel IXP43X manual Reset Configuration Straps, Expansion Bus Signal Recommendations Sheet 2

Page 22

Intel® IXP43X Product Line of Network Processors—Hardware Design Guidelines

Table 5.

Expansion Bus Signal Recommendations (Sheet 2 of 2)

 

 

 

 

 

Name

 

Type

Pull

 

 

Up

Recommendations

 

Field

 

 

Down

 

 

 

 

 

 

 

 

 

 

EX_CS_N[3:0]

 

I/O

Yes

Use series termination resistor, 10Ω to 33Ω at the source.

 

Use 10KΩ resistors pull-ups to ensure that the signal remains de-asserted.

 

 

 

 

 

 

 

 

 

EX_DATA[15:0]

 

I/O

No

Expansion-bus, bidirectional data.

 

 

 

 

 

EX_IOWAIT_N

 

I

Yes

Should be pulled high through a 10-KΩresistor when not being utilized in the system.

 

 

 

 

 

3.3.2Reset Configuration Straps

At power up or whenever RESET_IN_N is asserted, the Expansion-bus address outputs are switched to inputs and the state of the inputs are captured and stored in Configuration Register 0, bits 23 through 0. This occurs when PLL_LOCKED is de- asserted.

The strapping of Expansion-bus address pins can be done by placing external pull-down resistors at the required address pin. It is not required to use external pull-up resistors, by default upon reset all bits on Configuration Register 0 are set High, unless an external pull down is used to set them Low. For example to register a bit low or high in the Configuration Register 0, do the following:

Place an external 470Ω pull-down resistor to register a bit LOW in the Configuration Register 0.

No external pull-up is required; upon reset, bits are set high by default.

The state of the boot-strapping resistor is registered on the first cycle after the synchronous de-assertion of the reset signal. These bits can be read or written as needed for desired configurations. It is recommended that only Bit 31, Memory Map, be changed from 1 to 0 after execution of boot code from external flash.

Refer to the Intel® IXP43X Product Line of Network Processors Developer’s Manual for a complete bit description of Configuration Register 0.

Table 6.

Boot/Reset Strapping Configuration (Sheet 1 of 2)

 

 

 

 

Name

 

Function

Description

 

 

 

 

 

 

Intel XScale®

Allow a slower Intel XScale® Processor clock speed to override device fuse settings.

EX_ADDR[23:21]

Processor

But cannot be used to over clock core speed. Refer to Table 7 for additional

 

 

Clock Set[2:0]

information.

 

 

 

EX_ADDR[20:17]

Customer

Customer-defined bits. (Might be used for board revision.)

 

 

 

EX_ADDR[16:12]

(Reserved)

(Reserved)

 

 

 

 

 

 

 

DDRI or DDRII mode selection:

 

 

 

0 - DDRII mode (400MHz)

EX_ADDR[11]

 

DDR_MODE

1 - DDRI mode (266MHz)

 

 

 

DDR_mode or DDR clock speed selection bit is read only and strapped in from exp

 

 

 

address bit 11 upon activation of reset_early_n and reset_cold_n.

 

 

 

 

Intel® IXP43X Product Line of Network Processors

 

HDG

April 2007

22

Document Number: 316844; Revision: 001US

Image 22
Contents Intel IXP43X Product Line of Network Processors Hardware Design GuidelinesHDG Intel IXP43X Product Line of Network ProcessorsApril Contents Figures Tables Document Number 316844 Revision 001US Date Revision Description § §001 Initial release HDG Content Overview Chapter Name DescriptionList of Acronyms and Abbreviations Sheet 1 Related DocumentationAcronyms Term ExplanationOverview List of Acronyms and Abbreviations Sheet 2HDG Intel IXP435 Network Processor Block Diagram Typical Applications System Architecture Description System Memory MapIntel IXP43X Product Soft Fusible Features Sheet 1 Soft Fusible FeaturesSignal Type Definitions Symbol DescriptionDDRII/I Sdram Interface Soft Fusible Features Sheet 2USB Host Each USB can be Enable separately EthernetType Signal InterfaceDDRII/I Sdram Interface Pin Description Sheet 1 Name Device-Pin Connection Terminatio Description FieldDDRII/I Sdram Initialization DDRII/I Sdram Interface Pin Description Sheet 2Expansion Bus Expansion Bus Signal Recommendations Sheet 1Type Pull Name Recommendations Field Down Boot/Reset Strapping Configuration Sheet 1 Reset Configuration StrapsExpansion Bus Signal Recommendations Sheet 2 Name Type Pull Recommendations Field DownBoot/Reset Strapping Configuration Sheet 2 Intel XScale Processor Cfg0 Cfg1 Cfgenn Actual Core Speed Setting Intel XScale Processor Operation Speed3 8-Bit Device Interface MHz4 16-Bit Device Interface Flash Interface 16-Bit Device InterfaceUart Interface Flash Interface ExampleUart Signal Recommendations MII Interface Uart Interface ExampleMII NPE a Signal Recommendations Signal Interface MIIMII NPE C Signal Recommendations Sheet 1 MAC Management Signal Recommendations NPE a and NPE C MII NPE C Signal Recommendations Sheet 2Device Connection, MII Gpio Interface MII Interface ExampleUSB Interface Gpio Signal RecommendationsDesign Notes USB Host Signal Recommendations Name Type Pull Description Field DownCommon Mode Choke Host Device Utopia Level 2/MIIA Utopia Level 2 InterfaceType Pull Name Description Field Down UTPOPADDR40 UTPOPDATA4UTPOPDATA75 UtpopfciUtpipsoc ClavUtpipfci ETHARXDATA30 EtharxclkUTPIPDATA7 UTPIPDATA5UTPIPDATA6 UTPIPADDR40HSS Interface Device ConnectionHSSTXCLK0 High-Speed, Serial InterfaceHSSTXDATA0 HSSRXDATA0SSP Interface HSS Interface ExampleSynchronous Serial Peripheral Port Interface PCI Interface Serial Flash and SSP Port SPI Interface ExamplePCI Controller Sheet 1 Pciintan PCI Interface Block DiagramPCI Controller Sheet 2 PciclkinPCI Host/Option Interface Pin Description Sheet 1 Connect signal to same pin between PCI Parity Two devicesPCI Option Interface Type Option Description Name Device-Pin Connection FieldPCI Host/Option Interface Pin Description Sheet 2 On the Option device, these signals are notSignal PCIREQN0 to one PCIREQN30 inputs to the Host Type Option Name Device-Pin Connection Description FieldJtag Interface PCI Host/Option Interface Pin Description Sheet 3Input System Clock Clock SignalsClock Signals Clock OscillatorRecommendations for Crystal Selection Power Supply PowerNominal Name Voltage Description Decoupling Capacitance Recommendations Power SequenceReset Timing VCC Decoupling§ § General Recommendations Component PlacementPCB Overview Component SelectionComponent Placement on a PCB Stack-Up SelectionControlled-impedance traces Low-impedance power distribution Layer Stackup General Layout and Routing Guide General Layout GuidelinesSignal Changing Reference Planes General Component SpacingGood Design Practice for VIA Hole Placement Clock Signal Considerations Pad-to-Pad Clearance of Passive Components to a PGA or BGAUSB V2.0 Considerations MII Signal ConsiderationsCrosstalk EMI Design Considerations Power and Ground PlaneTrace Impedance § § @33 MHz Electrical InterfaceTopology Tcyc = 30 nSec Tval = 11 nSec Tprop = 10 nSecPCI Address/Data Routing Guidelines Clock DistributionParameter Routing Guidelines Trace Length Limits PCI Clock Routing GuidelinesSignal Loading Routing GuidelinesDdrii / Ddri Sdram IntroductionDrasn / Ddrrasn DDRII/I Signal GroupsGroup Signal Name Description Dcasn / DdrcasnDDR Sdram Supported Ddri 16-bit Sdram Configurations Supported Ddri 32-bit Sdram ConfigurationsSupported Ddrii 32-bit Sdram Configurations SizeaAddress Size Leaf Select Total Supported Ddrii 16-bit Sdram ConfigurationsDDRII/DDRI Rcomp and Slew Resistances Pin Requirements Technology Arrangement BanksDdrii OCD Pin Requirements DDR-II Symbol Parameter Units Min MaxDDR Clock Timings DDR Sdram Write Timings DDRII-400 MHz Interface -- Signal Timings Symbol Parameter Minimum Nominal Maximum UnitsTiming Relationships DDR II/I Sdram Interface -- Signal TimingsSymbol Parameter Minimum Nom Maximum Units Printed Circuit Board Layer StackupGroup Signal Name Length mil Signal Package Lengths Sheet 1Timing Relationships Signal Package Lengths Sheet 2 Signal Package Lengths Sheet 3 Clock GroupData and Control Groups Parameter DefinitionDdrii Data and Control Signal Group Routing Guidelines DCB70/DDRCB70, DDQ310 / DDRDQ310Ddrii Command Signal Group Routing Guidelines Signal Group Members§ §