Xilinx ML310 manual DDR Memory, Board Hardware

Page 21

Board Hardware

R

X8

IIPro FPGA I/O can be configured to use different IO standards such as SSTL2 as required on the DDR DIMM interface. Please review the ML310 Virtex-II Pro data sheet for more information regarding I/O standards.

Figure 2-3shows the top-level clocking for the ML310 board.

OSC 33MHz

X7

OSC 156.25 MHz

X9

OSC 125MHz

SYACE_FPGA_CLK

SYSACE

LCD

PM_CLK_TOP

J20

LVDS_CLK_LOC_P

LVDS_CLK_LOC_N

J17 USER_SMA_CLK

J21

 

 

7P

6S

5P

4S

 

PM IO

12

BANK 0

 

 

 

2.5V

 

2.5V

 

 

 

 

 

 

 

LVDS

(6 LVDS)

 

 

 

 

 

 

 

DCM

 

DCM

 

 

 

 

X0Y1

 

X1Y1

 

BANK 7

DDR Note: 2.5V DIMM All 3 DDR

64 bit Clock nets 256MB are length

matched

DDR_CLK

DDR_CLKB

BANK 6

 

 

 

2.5V

 

 

 

FB

DCM

 

DCM

CLK

 

X0Y0

 

X1Y0

DDR_

BANK 5

 

 

 

2.5V

 

7S

6P

5S

4P

LVDS CLK LOC N

LVDS CLK LOC P

USER CLKSYS

DDR_CLK_FB

(notused)

OSC

X6

SYACE_FPGA_CLK

LEDs

 

IIC

 

 

 

UART

 

PM IO

 

 

 

 

 

 

 

 

 

 

 

 

3V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

26

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SYS_CLK

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

LVDS_CLK_EXT_N

 

(user_clk_pci)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

LVDS_CLK_EXT_P

 

 

 

 

PCI_P_CLK5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Note:

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

All 5 PCI

3P

2S

 

 

 

1P

 

0S

PCI_P_CLK1

Clock nets

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

thru

are length

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

BANK 1

 

 

 

 

 

PCI_P_CLK4 matched

 

 

 

 

 

3.0V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DCM

 

 

 

DCM

 

 

 

 

 

 

 

 

 

 

 

X2Y1

 

 

X03Y1

 

 

 

 

 

 

 

PCI

 

 

 

 

 

 

 

 

 

 

 

 

 

BANK 2

 

BUS

 

 

 

 

 

 

 

 

 

 

 

 

 

3.0V

 

3.0V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

BANK 3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2.5V

72

 

PM IO

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(36 LVDS)

2.5V

 

 

 

 

 

DCM

 

 

 

 

DCM

 

 

 

 

 

 

 

LVDS

 

 

 

 

 

X2Y0

 

 

 

 

X3Y0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

BANK 4

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2.5V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

3S

 

2P

 

1S

 

0P

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

LVDS_CLK_EXT_P

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

LVDS_CLK_EXT_N

 

 

 

 

 

 

 

 

PM_CLK_BOT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

8

 

 

 

 

 

 

 

 

 

 

 

 

 

6

 

 

 

 

 

MGTs

 

 

 

 

 

 

 

 

 

 

 

 

(3 LVDS)

 

 

(to FPGA)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CPU

 

 

 

 

TRACE

 

 

SPI

 

PM IO

 

 

 

 

 

 

 

 

DEBUG

 

 

 

 

 

 

 

2.5V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

X10

OSC 100MHz

PM2

PM1

Figure 2-3:Top-Level Clocking

DDR Memory

DDR DIMM

The ML310 includes a registered 256MB PC3200 Double Data Rate (DDR) Dual Inline Memory Module (DIMM) with an industry standard 184-pin count. The DDR DIMM is commercially available from Wintec Industries as part number W4F232726HA-5Q. The associated datasheet is provided on the ML310 CDROM. The DDR DIMM is manufactured using nine Infineon HYB25D256800BT-5, 32Mx8 DDR SDRAM devices with 13-row address lines, 10-column address lines, and 4 bank select lines. Read and write access to the Infineon devices is programmable in burst lengths of 2, 4, or 8 column locations. The memory module inputs and outputs are compatible with SSTL2 signaling. Serial Presence Detect (SPD) using an SMBus interface to the DDR DIMM is also supported. Please refer to section “IIC/SMBus Interface” for more details on accessing the DIMM module’s SPD EEPROM.

ML310 User Guide

www.xilinx.com

21

UG068 (v1.01) August 25, 2004

1-800-255-7778

 

Image 21
Contents UG068 v1.01 August 25 ML310 User GuideML310 User Guide Version Revision ML310 User Guide UG068 v1.01 August 25UG068 v1.01 August 25 Table of Contents UG068 v1.01 August 25 Additional Resources Manual ContentsTypographical ConventionsHandbook Online DocumentChapter Virtex-II Pro Summary of Virtex-II Pro FeaturesRocketIO 3.125 Gb/s Transceivers PowerPC 405 CoreVirtex-II Pro Virtex-II Fpga FabricFoundation ISE Foundation FeaturesDesign Entry Introduction to Virtex-II Pro, ISE, and EDKImplementation and Configuration SynthesisFoundation ISE Board Level Integration Embedded Development KitOverview ML310 Embedded Development PlatformML310 Board ML310 Embedded Development PlatformOverview FeaturesClock Generation Board HardwareBoard Hardware DDR MemoryDDR Signaling DDR Memory ExpansionU37 DDRA2 DDRDQS02 DDRDQ31 Serial Port Fpga Uart Signaling Standards of RS-232Introduction to Serial Ports RS-232 on the ML310Board Bring-Up System ACE CF ControllerXC2VP30 Connectivity Non-Volatile Storage6JTAG Connections to the XC2VP30 and System ACE Jtag Connection to XC2VP30System ACE Jtag Configuration Interface Gpio LEDs and LCDParallel Cable IV Interface 8LEDs and LCD Connectivity Gpio LED Interface UCF Signal Name Translator U37 J13 U35Gpio LCD Interface U37 Name U36CPU Debug and CPU Trace CPU Debug DescriptionBuffer U33 J13 9Combined Trace/Debug Connector Pinout CPU Debug Connector Pinout PCI BusCPU Debug Connection to XC2VP30 ML310 Embedded Development Platform 11 PCI Bus and Device Connectivity Pciinta Pciintb Pciintc Pcipar Pcippar Pcirstn Pciprstn 113.3V Primary PCI Bus Information Device Vendor ALi South Bridge Interface, M1535D+, U15Device Name Bus 125.0V Secondary PCI Bus Information Device Name Vendor12ALi South Bridge Interface, M1535D+, U15 Parallel Port Interface, connector assembly P1Serial Port Interface, connector assembly P1 USB, connector assembly J3 IDE, connectors J15 and J16 GPIO, connector J5 System Management Bus SMBus17Type of Gpio Available on Header J5 ALi Gpio Types Number AC97 Audio 19Audio Jacks, J1 and J2 Signal name DescriptionFlash ROM, U4 PS/2 Keyboard/Mouse Interface, connector P2Intel GD82559 Ethernet Controller Intel GD82559, U11, 10/100 Ethernet ControllerIIC/SMBus Interface IIC/SMBus SignalingIntroduction to IIC/SMBus IIC/SMBus on ML310 Board22shows the Fpga connections to all SMBus and IIC devices 14SMBus and IIC Block Diagram Serial Peripheral Interface SPI SPI SignalingPush Buttons, Switches, Front Panel Interface and Jumpers SPI AddressingPush Buttons CPU Reset, SW2 System ACE Configuration Dipswitch, SW316SW3 SysACE CFG Switch Detail Front Panel Interface Connector, J23SYACECFGA0 Jumpers Voltage JumperJ10 J11 Coupling MGT Bref Clock Selection Jumpers, J20 and J21 ATX Power Distribution and Voltage Regulation17ATX Power Distribution and Voltage Regulation 18Voltage Monitor High-Speed I/O High-Speed I/O19Personality Module Connected to ML310 Board ML310 PM ConnectorsPM2 Connector PM1 ConnectorML310 PM Utility Pins Adapter Board PM ConnectorsContact Order PM1 Power and Ground ML310 PM User I/O PinsPM2 Power and Ground PM1 User I/ORXPPAD4 RXPPAD4A25 31 PM1 Pinout RXPPAD21 RXPPAD21AK25 ML310 PM2 User I/O32 PM2 Pinout AA5