E |
Thermal Analysis
The preferred temperature measurement location for a component may be:
❏junction - refers to the temperature measured by an
❏case - refers to the temperature at the top, center surface of the component
❏air - refers to the ambient temperature near the component
Table
Board Computer
|
| Maximum |
|
|
| Allowable |
|
|
| Component |
|
Reference |
| Temperature | Measurement |
Designator? | Generic Description | (degrees C) 1 | Location |
U8 | Hawk ASIC | 105 | Junction |
|
|
|
|
U9 | ECC DRAM (NEC D4564841G5) | 70 | Ambient |
|
|
|
|
U4 | Intel 82559ER | 85 | Case |
|
|
|
|
U5 | Intel 82559ER | 85 | Case |
|
|
|
|
U3 | Universe 2 | 125 | Junction |
|
|
|
|
U29 | L2 cache 512K (MCM69P7377P) | 70 | Ambient |
|
|
|
|
U30 | L2 cache 512K (MCM69P7377P) | 70 | Ambient |
|
|
|
|
U31 | MPC952 | 125 | Junction |
|
|
|
|
U32 | MPC972 | 125 | Junction |
|
|
|
|
U21 | ECC DRAM (NEC D4564841G5) | 70 | Ambient |
|
|
|
|
U16 | ECC DRAM (NEC D4564841G5) | 70 | Ambient |
|
|
|
|
U19 | PPC7400@400 MHz (Max) | 105 | Junction |
|
|
|
|
U53 | Pulse H0009.2 | 85 | Ambient |
|
|
|
|
1 maximum temperature for reliable operation specified by the component manufacturer.
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