10/100 Non-PCI Ethernet Single Chip MAC + PHY

Datasheet

Chapter 15 Package Outlines

 

 

Figure 15.1 128 Pin TQFP Package Outline, 14X14X1.0 Body

 

 

 

Table 15.1 128 Pin TQFP Package Parameters

 

 

 

 

 

 

 

 

MIN

 

NOMINAL

 

MAX

REMARK

 

 

 

 

 

 

 

A

~

 

~

 

1.20

Overall Package Height

A1

0.05

 

~

 

0.15

Standoff

A2

0.95

 

1.00

 

1.05

Body Thickness

D

15.80

 

16.00

 

16.20

X Span

D/2

7.90

 

8.00

 

8.10

1/ X Span Measure from Centerline

 

 

 

 

 

 

2

D1

13.80

 

14.00

 

14.20

X body Size

E

15.80

 

16.00

 

16.20

Y Span

E/2

7.90

 

8.00

 

8.10

1/ Y Span Measure from Centerline

 

 

 

 

 

 

2

E1

13.80

 

14.00

 

14.20

Y body Size

H

0.09

 

~

 

0.20

Lead Frame Thickness

L

0.45

 

0.60

 

0.75

Lead Foot Length from Centerline

L1

~

 

1.00

 

~

Lead Length

e

0.40 Basic

 

 

 

 

Lead Pitch

q

0o

 

~

 

7o

Lead Foot Angle

 

 

W

0.13

 

0.18

 

0.23

Lead Width

R1

0.08

 

~

 

~

Lead Shoulder Radius

R2

0.08

 

~

 

0.20

Lead Foot Radius

ccc

~

 

~

 

0.0762

Coplanarity (Assemblers)

ccc

~

 

~

 

0.08

Coplanarity (Test House)

Notes:

1.Controlling Unit: millimeter

2.Tolerance on the position of the leads is ± 0.035 mm maximum

3.Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm

4.Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane is 0.78-1.08 mm.

5.Details of pin 1 identifier are optional but must be located within the zone indicated.

6.Shoulder widths must conform to JEDEC MS-026 dimension 'S' of a minimum of 0.20mm.

Revision 1.91 (08-18-08)

126

SMSC LAN91C111 REV C

DATASHEET