10/100 Non-PCI Ethernet Single Chip MAC + PHY

Datasheet

 

 

Figure 15.2 128 Pin QFP Package Outline, 3.9 MM Footprint

 

 

 

Table 15.2 128 Pin QFP Package Parameters

 

 

 

 

 

 

 

 

MIN

 

NOMINAL

 

MAX

REMARKS

 

 

 

 

 

 

 

A

~

 

~

 

3.4

Overall Package Height

A1

0.05

 

~

 

0.5

Standoff

A2

2.55

 

~

 

3.05

Body Thickness

D

23.70

 

23.90

 

24.10

X Span

D/2

11.85

 

11.95

 

12.05

1/ X Span Measured from Centerline

 

 

 

 

 

 

2

D1

19.90

 

20.0

 

20.10

X body Size

E

17.70

 

17.90

 

18.10

Y Span

E/2

8.85

 

8.95

 

9.05

1/ Y Span Measured from Centerline

 

 

 

 

 

 

2

E1

13.90

 

14.00

 

14.10

Y body Size

H

~

 

~

 

~

Lead Frame Thickness

L

0.73

 

0.88

 

1.03

Lead Foot Length

L1

~

 

1.95

 

~

Lead Length

e

0.5 Basic

 

 

 

 

Lead Pitch

q

0o

 

~

 

7o

Lead Foot Angle

 

 

W

0.10

 

~

 

0.30

Lead Width

R1

0.13

 

~

 

~

Lead Shoulder Radius

R2

0.13

 

~

 

0.30

Lead Foot Radius

ccc

~

 

~

 

0.0762

Coplanarity (Assemblers)

ccc

~

 

~

 

0.08

Coplanarity (Test House)

Notes:

1.Controlling Unit: millimeter

2.Tolerance on the position of the leads is + 0.04 mm maximum.

3.Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm.

4.Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.

5.Details of pin 1 identifier are optional but must be located within the zone indicated.

SMSC LAN91C111 REV C

127

Revision 1.91 (08-18-08)

DATASHEET