PACKAGING INFORMATION

OrderableDevice Status(1) Package
Type Package
Drawing Pins Package
Qty EcoPlan (2) Lead/Ball Finish MSLPeak Temp (3)
TMS320C25FNA NRND PLCC FN 68 18 Green(RoHS &
noSb/Br) CUNIPDAU Level-3-260C-168 HR
TMS320C25FNAR NRND PLCC FN 68 TBD CallTI CallTI
TMS320C25FNL NRND PLCC FN 68 18 Green (RoHS &
noSb/Br) CUNIPDAU Level-3-260C-168 HR
TMS320C25FNL33 OBSOLETE PLCC FN 68 TBD Call TI CallTI
TMS320C25FNLR NRND PLCC FN 68 250 Green(RoHS &
noSb/Br) CUNIPDAU Level-3-260C-168 HR
TMS320C25FNLW OBSOLETE PLCC FN 68 Green(RoHS &
noSb/Br) CUNIPDAU Level-3-260C-168 HR
TMS320C25GBA NRND CPGA GB 68 21 TBD AU N / A for Pkg Type
TMS320C25GBL NRND CPGA GB 68 21 TBD AU N/ A for Pkg Type
TMS320C25PHL NRND QFP PH 80 66 Green (RoHS &
noSb/Br) CUNIPDAU Level-4-260C-72 HR
(1)The marketing status values are defined as follows:
ACTIVE:Product device recommended for new designs.
LIFEBUY:TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
anew design.
PREVIEW:Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontentfor the latest availability information and additional product content details.
TBD:The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
forall 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
athigh temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible)as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants(Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
informationmay not be available for release.
Inno event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
toCustomer on an annual basis.
OTHERQUALIFIED VERSIONS OF TMS320C25 :
•Military:SMJ320C25
NOTE:Qualified Version Definitions:
•Military- QML certified for Military and Defense Applications
PACKAGE OPTION ADDENDUM
www.ti.com 4-May-2009
Addendum-Page1