Advance | Texas Instruments TMS320 instruction

TMS320C25

TMS320C25-50

SPRS010B Ð MAY 1987 Ð REVISED NOVEMBER 1990

68-lead plastic leaded chip carrier package (TMS320C25 and TMS320C25-50)

						Seating
						Plane	1,27 (0.050) T.P.
							1,27 (0.050) T.P.
					0,25 (0.010) R Max		(see Note B)
					0,25 (0.010) R Max
					3 Places
	24,33 (0.956)
	24,13 (0.950)						23,62 (0.930)
	(see Note A)						23,62 (0.930)
	(see Note A)						23,11 (0.910)
							23,11 (0.910)
							(At Seating Plane)
	25,27 (0.995)
	25,02 (0.985)
ADVANCE							0,94 (0.037)
				1,22 (0.048)			0,69 (0.027) R
				1,22 (0.048)	⋅ 45°
				1,07 (0.042)	⋅ 45°		1,35 (0.053)	⋅ 45°
			24,33 (0.956)				1,19 (0.047)	⋅ 45°
			24,33 (0.956)				1,19 (0.047)
INFORMATION			24,13 (0.950)				2,79 (0.110)
			(see Note A)				2,79 (0.110)
			(see Note A)				2,41 (0.095)
							2,41 (0.095)
			25,27 (0.995)				4,50 (0.177)
			25,02 (0.985)				4,50 (0.177)
			25,02 (0.985)				4,24 (0.167)
							4,24 (0.167)
	Thermal Resistance Characteristics				0,81 (0.032)	1,52 (0.060)
	Thermal Resistance Characteristics				0,66 (0.026)	Min
					0,66 (0.026)	Min
		PARAMETER	MAX	UNIT
	RθJA	Junction-to-free-air	46	°C/W		0,64 (0.025)
		Junction-to-free-air
		thermal resistance
						Min
	RθJC	Junction-to-case	11	°C/W
	RθJC	thermal resistance	11	°C/W
					0,51 (0.020)
					0,36 (0.014)
					Lead Detail
		ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES

NOTES: A. Centerline of center pin, each side, is within 0,10 (0.004) of package centerline as determined by this dimension. B. Location of each pin is within 0,127 (0.005) of true position with respect to center pin on each side.

WARNING

When reflow soldering is required, refer to page 54 for special handling instructions.

56	POST OFFICE BOX 1443 • HOUSTON, TEXAS 77001

Image 56

Texas Instruments TMS320 specifications Advance

Contents

TMS320 SECOND-GENERATION Digital Signal Processors Description Function PIN Signals DefinitionPGA and PLCC/CER-QUAD PIN Assignments Introduction Key Features TMS32020 Bit-Reversed Indexed-Addressing Mode forMemory Space Wait States for Communication to Slower Off-Chip Architecture TMS320 Second-Generation Device OverviewPackage Type Functional block diagram TMS320C2x SECOND-GENERATION Devices Timer Scaling shifter16 ⋅ 16-bit parallel multiplier Memory control TMS320 SECOND-GENERATION Devices Memory Maps Multiprocessing Interrupts and subroutinesExternal interface Addressing modes Repeat featureInstruction set Instruction set summary Instruction SymbolsSymbol Definition TMS320C25 Instruction Set Summary SUBT² XORXORK² ZAC Apac LPH ²LTA LTP ² Data Memory Operations Mnemonic Description Words TMS320C25 Instruction Set Summary concluded TMS32020 TMS32020 Product Notification Development support Hardware Tools Part Number TMS320 Second-Generation Software and Hardware SupportSoftware Tools Part Number Specification overview Documentation support Parameter Test Conditions MIN TYP§ MAX Unit Recommended operating conditionsMIN NOM MAX Unit External clock option Clock Characteristics and TimingInternal clock option Test Load Circuit Memory and Peripheral Interface Timing Parameter MIN TYP MAX Unit Hold Holda RS, INT, BIO, and XF TimingHold Timing Serial Port Timing TMS320C25GBA INT Clkin / Clkx / ClkrMP/MC IOH Parameter Test Conditions MIN TYP MAX Unit External Clock Option Clkin VOH Min TdC1L-AL Low after CLKOUT1 low Serial Port Timing Eprom Programming See Notes 14VPP IPP1 MP/MC VIL INT0 INT2 VIHCLKIN, CLKX, Clkr Internal Clock Option External clock option CLKOUT1, CLKOUT2 Fcrystal TdC1-S From Clkout if Is present TsuIN Setup before CLKOUT1 high Contrast Summary of Electrical Specifications Clock characteristics and timingParameter MIN TYP MAX Memory and peripheral interface timing RS, INT, BIO, and XF timingHold timing Serial port timing Timing Diagrams Clock timing Ready Memory read timingBR, PS, D S Memory write timing CLKOUT1 CLKOUT2 Strb One wait-state memory access timing MSC Reset timing Iack Interrupt timing TMS32020 Interrupt timing TMS320C25 Serial port receive timing Serial port transmit timing BIO timing External flag timing PC = N PC = N + Hold timing part a HoldHolda Execute Holda Fetch Hold timing part BCLKOUT1 CLKOUT2 Fetch Execute Or is D15-D0 TdHH-AH Typical Supply Current Characteristics for TMS320C25 TMS320C25FNL Plcc reflow soldering precautions Parameter MAX Unit Mechanical DataPin GB grid array ceramic package TMS32020, TMS320C25 Advance Jedec NO. Outline Terminals MIN MAX Programming the TMS320E25 Eprom cell Fast programming and verification Pin Nomenclature TMS320E25 VCCEPT EPT VPP TMS320E25 Programming Mode Levels SignalProgram Read Output Name ² PIN Verify Inhibit Disable Erasure Fast Programming Flowchart Program verify ROM protection and verification Output disableRead TMS320E25 Protect and Verify Eprom Mode Levels Eprom protectVIH VIL PGM VPP VCC VSS Clkin EPT VPP Eprom Rbit VIH VIL VPP VCC VCC VIH VIL PGM VIH/VOH HI-Z VIL/VOL VPP EPT VSS TMS320 SECOND-GENERATION NIL Packaging Information Other Qualified Versions of TMS320C25 Important Notice