Intel BX80637I73770K, BX80646I74770 Package Handling Guidelines, Package Insertion Specifications

December 2013 Order No.: 328897-004

Processor—Package Mechanical Specifications

mechanical system or component testing should not exceed the maximum limits. The processor package substrate should not be used as a mechanical reference or load- bearing surface for thermal and mechanical solution.

Table 57.	Processor Loading Specifications
	Parameter	Minimum	Maximum	Notes
	Static Compressive Load	—	600 N [135 lbf]	1, 2, 3
	Dynamic Compressive	—	712 N [160 lbf]	1, 3, 4
	Load

Notes: 1. These specifications apply to uniform compressive loading in a direction normal to the processor, IHS.

2.This is the maximum static force that can be applied by the heatsink and retention solution to maintain the heatsink and processor interface.

3.These specifications are based on limited testing for design characterization. Loading limits are for the package only and do not include the limits of the processor socket.

4.Dynamic loading is defined as an 50g shock load, 2X Dynamic Acceleration Factor with a 500g maximum thermal solution.

8.3Package Handling Guidelines

The following table includes a list of guidelines on package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal.

Table 58.	Package Handling Guidelines
		Parameter	Maximum Recommended	Notes
		Shear	311 N [70 lbf]	1, 4
		Tensile	111 N [25 lbf]	2, 4
		Torque	3.95 N-m [35 lbf-in]	3, 4
	Notes: 1.	A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
	2.	A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS
		surface.
	3.	A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the
		IHS top surface.
	4.	These guidelines are based on limited testing for design characterization.

8.4Package Insertion Specifications

The processor can be inserted into and removed from an LGA1150 socket 15 times. The socket should meet the LGA1150 socket requirements detailed in the LGA1150 Socket Application Guide.

8.5Processor Mass Specification

The typical mass of the processor is 27.0 g (0.95 oz). This mass [weight] includes all the components that are included in the package.

8.6Processor Materials

The following table lists some of the package components and associated materials.

Desktop 4th Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, and Desktop Intel® Celeron® Processor Family

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