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Intel BX80646I74770S manual System Memory Technology Supported, Processor DIMM Support by Product

Models: BX80633I74960X BX80646I34130 BX80646I54430 BX80646I74770K BX80646I74770 BX80646I54570S BX80646I74770S BXF80646I74770K CM8063701159502 CM8063701212200 BX80637I73770K CM8064601466003 CM8064601466200

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Interfaces—Processor

2.1.1System Memory Technology Supported

The Integrated Memory Controller (IMC) supports DDR3/DDR3L protocols with two independent, 64-bit wide channels each accessing one or two DIMMs. The type of memory supported by the processor is dependent on the PCH SKU in the target platform.

Note: The IMC supports a maximum of two DDR3/DDR3L DIMMs per channel; thus, allowing up to four device ranks per channel.

Note: The support of DDR3/DDR3L frequencies and number of DIMMs per channel is SKU dependent.

Table 3.	Processor DIMM Support by Product

	Processor Cores	Package	DIMM per Channel	DDR3 / DDR3L

	Dual Core	uLGA	1 DPC	1333/1600

			2 DPC	1333/1600
			2 DPC	1333/1600

	Quad Core	uLGA	1 DPC	1333/1600

			2 DPC	1333/1600
			2 DPC	1333/1600

DDR3/DDR3L Data Transfer Rates:

•1333 MT/s (PC3-10600)

•1600 MT/s (PC3-12800)

AIO platform DDR3/DDR3L SO-DIMM Modules:

•Raw Card B – Single Ranked x8 unbuffered non-ECC

•Raw Card F – Dual Ranked x8 (planar) unbuffered non-ECC

Desktop platform UDIMM Modules:

•Raw Card A – Single Ranked x8 unbuffered non-ECC

•Raw Card B – Dual Ranked x8 unbuffered non-ECC

•Standard 1Gb, 2Gb, and 4Gb technologies and addressing are supported for x8 devices. There is no support for memory modules with different technologies or capacities on opposite sides of the same memory module. If one side of a memory module is populated, the other side is either identical or empty.

Table 4.	Supported UDIMM Module Configurations

Raw	DIMM	DRAM	DRAM	# of		# of	# of	# of	Page Size
Card	Capacity	Device	Organization	DRAM		Physical	Row / Col	Banks
Version		Technology		Devices		Devices	Address	Inside
						Ranks	Bits	DRAM

			Desktop Platforms

		Unbuffered / Non-ECC Supported DIMM Module Configurations

A	1 GB	1 Gb	128 M X 8	8		1	14/10	8	8K

									continued...

Desktop 4th Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, and Desktop Intel® Celeron® Processor Family

December 2013	Datasheet – Volume 1 of 2
Order No.: 328897-004	19

Image 19

Intel BX80646I74770S, CM8064601466200, BX80637I73770K System Memory Technology Supported, Processor DIMM Support by Product

Contents

December Datasheet - Volume 1 ofDatasheet - Volume 1 of 2 1.0 Introduction Contents4.0 Power Management Revision HistoryProcessor-Contents 6.0 Signal Description5.0 Thermal Management 7.8.1 Platform Environment Control Interface PECI DC Characteristics 7.0 Electrical Specifications8.0 Package Mechanical Specifications 9.0 Processor Ball and Signal InformationFigures Tables-Processor TablesProcessor-Tables Revision History-Processor Revision HistoryProcessor-Introduction 1.0 IntroductionPlatform Controller Hub PCH Figure 1. Platform Block Diagram1.1 Supported Technologies ProcessorSystem 1.3 Power Management Support1.2 Interfaces Processor CoreTerminology 1.4 Thermal Management Support1.5 Package Support 1.6 TerminologyProcessor-Introduction with Virtual Machine Monitor software, enables multiple, robust independent softwarecontinued continued Introduction-ProcessorTerm DescriptionDocument 1.7 Related DocumentsRelated Documents Processor-IntroductionDocument specificationsIntroduction-Processor Document2.1 System Memory Interface 2.0 Interfaces2.1.1 System Memory Technology Supported Supported UDIMM Module ConfigurationsProcessor DIMM Support by Product 2.1.2 System Memory Timing Support Supported SO-DIMM Module Configurations AIO OnlyDDR3 / DDR3L System Memory Timing Support 2.1.3 System Memory Organization Modes Single-Channel ModeDual-Channel Mode - Intel Flex Memory Technology Mode Dual-Channel Symmetric Mode2.1.3.1 System Memory Frequency 2.1.3.2 Intel Fast Memory Access Intel FMA Technology EnhancementsJust-in-Time Command Scheduling Command Overlap2.1.3.3 Data Scrambling Table 7. PCI Express* Supported Configurations in Desktop Products2.2 PCI Express* Interface 2.2.1 PCI Express* Support2.2.2 PCI Express* Architecture 2.2.3 PCI Express* Configuration MechanismPCI Express* Port PCI Express* Related Register Structures in the ProcessorPCI Express* Lanes Connection 1 X 8 Controller 2.3 Direct Media Interface DMIFigure 4. PCI Express* Typical Operation 16 Lanes Mapping 1 X 4 ControllerDMI Link Down DMI Error Flow2.5 Processor Graphics Controller GT 2.4 Processor Graphics3D Engine Execution Units Figure 5. Processor Graphics Controller Unit Block Diagram2.5.1 3D and Video Engines for Graphics Processing 3D PipelineStrips and Fans SF Stage Vertex Shader VS StageGeometry Shader GS Stage Clip Stage2.5.2 Multi Graphics Controllers Multi-Monitor Support 2.6 Digital Display Interface DDILogical 128-Bit Fixed BLT and 256 Fill Engine Figure 6. Processor Display Architecture Figure 7. DisplayPort* Overview Source DeviceSink Device DisplayPortHDMI Tx HDMI SourceHDMI Sink Figure 8. HDMI* OverviewTable 8. Processor Supported Audio Formats over HDMI*and DisplayPort Multiple Display Configurationsembedded DisplayPort Integrated AudioHigh-bandwidth Digital Content Protection HDCP Valid Three Display Configurations through the Processor2.8 Platform Environmental Control Interface PECI 2.7 Intel Flexible Display Interface Intel FDI2.8.1 PECI Bus Architecture PECI Client Figure 9. PECI Host-Clients Connection ExamplePECI Host / Originatoring=VT 3.0 Technologies3.1 Intel Virtualization Technology Intel VT Intel VT-x ObjectivesIntel VT-x Features Intel VT-d Objectives Figure 10. Device to Domain Mapping Structures Intel VT-d Features3.2 Intel Trusted Execution Technology Intel TXT 3.3 Intel Hyper-Threading Technology Intel HT Technology 3.5 Intel Advanced Vector Extensions 2.0 Intel AVX2 3.4 Intel Turbo Boost TechnologyIntel Turbo Boost Technology 2.0 Frequency PCLMULQDQ Instruction 3.6 Intel Advanced Encryption Standard New Instructions Intel AES-NIIntel Secure Key 3.8 Intel 64 Architecture x2APIC 3.10 Execute Disable Bit 3.9 Power Aware Interrupt Routing PAIR3.11 Supervisor Mode Execution Protection SMEP S0 - Processor Fully powered on full on mode / connected standby mode 4.0 Power ManagementFigure 11. Processor Power States Note Power states availability may vary between the different SKUsIntegrated Memory Controller States 4.1 Advanced Configuration and Power Interface ACPI States SupportedSystem States Processor Core / Package State SupportG, S, and C Interface State Combinations 4.2 Processor Core Power Management4.2.1 Enhanced Intel SpeedStep Technology Key Features Direct Media Interface DMI StatesThread 4.2.2 Low-Power Idle StatesFigure 12. Idle Power Management Breakdown of the Processor Cores ThreadCoordination of Thread Power States at the Core Level 4.2.3 Requesting Low-Power Idle StatesFigure 13. Thread and Core C-State Entry and Exit Core C3 State 4.2.4 Core C-State RulesCore C0 State Core C1/C1E StateC-State Auto-Demotion 4.2.5 Package C-StatesCore C6 State Core C7 StateCoordination of Core Power States at the Package Level Package C0 State Figure 14. Package C-State Entry and ExitPackage C1/C1E State Package C7 State Package C2 StatePackage C3 State Package C6 StateDeepest Package C-State Available 4.2.6 Package C-States and Display Resolutions4.3.1 Disabling Unused System Memory Outputs 4.3 Integrated Memory Controller IMC Power ManagementNo power-down CKE disable 4.3.2 DRAM Power Management and Initialization4.3.2.1 Initialization Role of CKE 4.3.2.3 Dynamic Power-Down4.3.2.2 Conditional Self-Refresh 4.3.4 DDR Electrical Power Gating EPG 4.4 PCI Express* Power Management4.5 Direct Media Interface DMI Power Management 4.3.3 DRAM Running Average Power Limitation RAPL4.6.3 Intel Graphics Dynamic Frequency 4.6 Graphics Power Management4.6.1 Intel Rapid Memory Power Management Intel RMPM 4.6.2 Graphics Render C-StateThermal Management-Processor 5.0 Thermal ManagementProcessor-Thermal Management Desktop Processor Thermal Specifications5.1 Desktop Processor Thermal Profiles Temperature on pageCase 5.1.1 Processor PCG 2013D Thermal ProfileTCASE = 0.33 * Power + TTV Power Wcontinued 5.1.2 Processor PCG 2013C Thermal ProfileProcessor-Thermal Management continuedThermal Management-Processor 5.1.3 Processor PCG 2013B Thermal Profilecontinued Processor-Thermal Management 5.1.4 Processor PCG 2013A Thermal Profile37.5 37.5 5.2 Thermal Metrology5.3 Fan Speed Control Scheme with Digital Thermal Sensor DTS Measure TCASE at the geometric center of the packageΨCA = TCASE-MAX - TAMBIENT-TARGET / TDP Figure 20. Digital Thermal Sensor DTS 1.1 Definition Points5.4 Fan Speed Control Scheme with Digital Thermal Sensor DTS Figure 21. Digital Thermal Sensor DTS Thermal Profile Definition 5.5 Processor TemperatureThermal Margin Slope Frequency Control 5.6 Adaptive Thermal MonitorClock Modulation Critical Temperature FlagImmediate Transition to Combined TM1 and TM2 PROCHOT# Signal 5.8 Digital Thermal Sensor 5.7 THERMTRIP# Signal5.9 Intel Turbo Boost Technology Thermal Considerations 5.9.1 Intel Turbo Boost Technology Power Control and Reporting5.8.1 Digital Thermal Sensor Accuracy Taccuracy Intel Turbo Boost Technology 2.0 Package Power Control Settings 5.9.2 Package Power Control5.9.3 Turbo Time Parameter Figure 22. Package Power ControlMemory Channel A Signals 6.0 Signal Description6.1 System Memory Interface Signals Signal Description Buffer Typescontinued Memory Channel B SignalsSignal Description-Processor Write Enable Control Signal This signal is used withDDR3/DDR3L Reference Voltage This signal is used as 6.2 Memory Reference and Compensation SignalsMemory Reference and Compensation Signals Processor-Signal DescriptionCFG3 MSR Privacy Bit Feature 6.3 Reset and Miscellaneous SignalsReset and Miscellaneous Signals Signal Description-ProcessorDisplay Interface Signals 6.4 PCI Express*-Based Interface Signals6.5 Display Interface Signals PCI Express* Graphics Interface SignalsTestability Signals 6.7 Phase Locked Loop PLL Signals6.8 Testability Signals Phase Locked Loop PLL SignalsPower Sequencing Signals 6.9 Error and Thermal Protection Signals6.10 Power Sequencing Signals Error and Thermal Protection SignalsProcessor Power Signals 6.11 Processor Power Signals6.12 Sense Signals 6.13 Ground and Non-Critical to Function NCTF Signals7.3 VCC Voltage Identification VID 7.0 Electrical Specifications7.2 Power and Ground Lands 7.1 Integrated Voltage Regulatorcontinued Table 45. Voltage Regulator VR 12.5 Voltage IdentificationElectrical Specifications-Processor continuedcontinued Processor-Electrical Specificationscontinued continued Electrical Specifications-Processorcontinued continued Processor-Electrical Specifications7.5 Signal Groups 7.4 Reserved or Unused SignalsSignal Groups DDR3 / DDR3L Compensation DDR3 / DDR3L Data SignalsDDR3 / DDR3L Reference Voltage Signals Power / Ground / OtherDigital Media Interface DMI 7.6 Test Access Port TAP Connection7.7 DC Specifications PCI Express* GraphicsProcessor-Electrical Specifications 7.8 Voltage and Current Specificationscontinued Electrical Specifications-Processor continued DDR3 / DDR3L Signal Group DC SpecificationsVCCIOOUT, VCOMPOUT, and VCCIOTERM Processor-Electrical SpecificationsElectrical Specifications-Processor Digital Display Interface Group DC SpecificationsProcessor-Electrical Specifications embedded DisplayPort* eDP* Group DC SpecificationsCMOS Signal Group DC Specifications GTL Signal Group and Open Drain Signal Group DC Specificationscontinued 7.8.1 Platform Environment Control Interface PECI DC CharacteristicsPCI Express* DC Specifications Electrical Specifications-ProcessorFigure 23. Input Device Hysteresis 7.8.2 Input Device HysteresisProcessor-Electrical Specifications 8.1 Processor Component Keep-Out Zone 8.0 Package Mechanical Specifications8.2 Package Loading Specifications Figure 24. Processor Package Assembly Sketch8.3 Package Handling Guidelines 8.4 Package Insertion Specifications8.5 Processor Mass Specification Processor Loading SpecificationsFigure 25. Processor Top-Side Markings 8.7 Processor Markings8.8 Processor Land Coordinates Processor MaterialsProcessor-Package Mechanical Specifications 8.9 Processor Storage SpecificationsProcessor Storage Specifications Figure 26. Processor Package Land CoordinatesRHsustained storage Package Mechanical Specifications-ProcessorTIMEsustained storage Processor Ball List by Signal Name 9.0 Processor Ball and Signal Informationcontinued Processor Ball and Signal Information-Processorcontinued continuedcontinued Processor-Processor Ball and Signal Informationcontinued continuedBall # Signal NameSignal Name Signal NameBall # Signal NameSignal Name Signal NameBall # Signal NameSignal Name Signal NameAU20 continuedcontinued continuedBall # Signal NameSignal Name Signal NameBall # Signal NameSignal Name Signal NameBall # Signal NameSignal Name Signal NameBall # Signal NameSignal Name Signal Name