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Intel BX80646I74770S Processor Ball and Signal Information, Processor Ball List by Signal Name

Models: BX80633I74960X BX80646I34130 BX80646I54430 BX80646I74770K BX80646I74770 BX80646I54570S BX80646I74770S BXF80646I74770K CM8063701159502 CM8063701212200 BX80637I73770K CM8064601466003 CM8064601466200

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9.0Processor Ball and Signal Information

December 2013 Order No.: 328897-004

Processor—Processor Ball and Signal Information

9.0Processor Ball and Signal Information

This chapter provides processor ball information. The following table provides the ball list by signal name.

Note: References to SA_ECC_CB[7:0] and SB_ECC_CB[7:0] are for processor SKUs that support ECC. These signals are reserved on the Desktop 4th Generation Intel® Core™ processor family.

Table 61.	Processor Ball List by Signal Name

	Signal Name	Ball #		Signal Name	Ball #		Signal Name	Ball #

	BCLKN	V4		CFG3	W38		DDID_TXDN1	B16

	BCLKP	V5		CFG4	V39		DDID_TXDN2	C17

	BPM#0	G39		CFG5	U39		DDID_TXDN3	B18

	BPM#1	J39		CFG6	U40		DDID_TXDP0	B15

	BPM#2	G38		CFG7	V38		DDID_TXDP1	A16

	BPM#3	H37		CFG8	T40		DDID_TXDP2	B17

	BPM#4	H38		CFG9	Y35		DDID_TXDP3	A18

	BPM#5	J38		DBR#	G40		DISP_INT	D18

	BPM#6	K39		DDIB_TXBN0	F17		DMI_RXN0	T3

	BPM#7	K37		DDIB_TXBN1	G18		DMI_RXN1	V1

	CATERR#	M36		DDIB_TXBN2	H19		DMI_RXN2	V2

	CFG_RCOMP	H40		DDIB_TXBN3	G20		DMI_RXN3	W3

	CFG0	AA37		DDIB_TXBP0	E17		DMI_RXP0	U3

	CFG1	Y38		DDIB_TXBP1	F18		DMI_RXP1	U1

	CFG10	AA34		DDIB_TXBP2	G19		DMI_RXP2	W2

	CFG11	V37		DDIB_TXBP3	F20		DMI_RXP3	Y3

	CFG12	Y34		DDIC_TXCN0	E19		DMI_TXN0	AA5

	CFG13	U38		DDIC_TXCN1	D20		DMI_TXN1	AB4

	CFG14	W34		DDIC_TXCN2	E21		DMI_TXN2	AC4

	CFG15	V35		DDIC_TXCN3	D22		DMI_TXN3	AC2

	CFG16	Y37		DDIC_TXCP0	D19		DMI_TXP0	AA4

	CFG17	Y36		DDIC_TXCP1	C20		DMI_TXP1	AB3

	CFG18	W36		DDIC_TXCP2	D21		DMI_TXP2	AC5

	CFG19	V36		DDIC_TXCP3	C22		DMI_TXP3	AC1

	CFG2	AA36		DDID_TXDN0	C15		DP_RCOMP	R4

		continued...			continued...			continued...

Desktop 4th Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, and Desktop Intel® Celeron® Processor Family

Datasheet – Volume 1 of 2 110

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Intel BX80646I74770S, CM8064601466200 manual Processor Ball and Signal Information, Processor Ball List by Signal Name

Contents

Datasheet - Volume 1 of DecemberDatasheet - Volume 1 of 2 Revision History Contents4.0 Power Management 1.0 Introduction5.0 Thermal Management 6.0 Signal DescriptionProcessor-Contents 9.0 Processor Ball and Signal Information 7.0 Electrical Specifications8.0 Package Mechanical Specifications 7.8.1 Platform Environment Control Interface PECI DC CharacteristicsFigures Tables Tables-ProcessorProcessor-Tables Revision History Revision History-Processor1.0 Introduction Processor-IntroductionProcessor Figure 1. Platform Block Diagram1.1 Supported Technologies Platform Controller Hub PCHProcessor Core 1.3 Power Management Support1.2 Interfaces System1.6 Terminology 1.4 Thermal Management Support1.5 Package Support Terminologycontinued with Virtual Machine Monitor software, enables multiple, robust independent softwareProcessor-Introduction Description Introduction-ProcessorTerm continuedProcessor-Introduction 1.7 Related DocumentsRelated Documents DocumentDocument specificationsIntroduction-Processor Document2.0 Interfaces 2.1 System Memory InterfaceProcessor DIMM Support by Product Supported UDIMM Module Configurations2.1.1 System Memory Technology Supported DDR3 / DDR3L System Memory Timing Support Supported SO-DIMM Module Configurations AIO Only2.1.2 System Memory Timing Support Dual-Channel Symmetric Mode Single-Channel ModeDual-Channel Mode - Intel Flex Memory Technology Mode 2.1.3 System Memory Organization ModesCommand Overlap 2.1.3.2 Intel Fast Memory Access Intel FMA Technology EnhancementsJust-in-Time Command Scheduling 2.1.3.1 System Memory Frequency2.2.1 PCI Express* Support Table 7. PCI Express* Supported Configurations in Desktop Products2.2 PCI Express* Interface 2.1.3.3 Data Scrambling2.2.3 PCI Express* Configuration Mechanism 2.2.2 PCI Express* ArchitecturePCI Express* Lanes Connection PCI Express* Related Register Structures in the ProcessorPCI Express* Port 1 X 4 Controller 2.3 Direct Media Interface DMIFigure 4. PCI Express* Typical Operation 16 Lanes Mapping 1 X 8 ControllerDMI Error Flow DMI Link Down2.4 Processor Graphics 2.5 Processor Graphics Controller GT3D Pipeline Figure 5. Processor Graphics Controller Unit Block Diagram2.5.1 3D and Video Engines for Graphics Processing 3D Engine Execution UnitsClip Stage Vertex Shader VS StageGeometry Shader GS Stage Strips and Fans SF StageLogical 128-Bit Fixed BLT and 256 Fill Engine 2.6 Digital Display Interface DDI2.5.2 Multi Graphics Controllers Multi-Monitor Support Figure 6. Processor Display Architecture DisplayPort Source DeviceSink Device Figure 7. DisplayPort* OverviewFigure 8. HDMI* Overview HDMI SourceHDMI Sink HDMI TxIntegrated Audio Multiple Display Configurationsembedded DisplayPort Table 8. Processor Supported Audio Formats over HDMI*and DisplayPortValid Three Display Configurations through the Processor High-bandwidth Digital Content Protection HDCP2.8.1 PECI Bus Architecture 2.7 Intel Flexible Display Interface Intel FDI2.8 Platform Environmental Control Interface PECI Host / Originator Figure 9. PECI Host-Clients Connection ExamplePECI PECI ClientIntel VT-x Objectives 3.0 Technologies3.1 Intel Virtualization Technology Intel VT ing=VTIntel VT-x Features Intel VT-d Objectives Intel VT-d Features Figure 10. Device to Domain Mapping Structures3.2 Intel Trusted Execution Technology Intel TXT 3.3 Intel Hyper-Threading Technology Intel HT Technology Intel Turbo Boost Technology 2.0 Frequency 3.4 Intel Turbo Boost Technology3.5 Intel Advanced Vector Extensions 2.0 Intel AVX2 Intel Secure Key 3.6 Intel Advanced Encryption Standard New Instructions Intel AES-NIPCLMULQDQ Instruction 3.8 Intel 64 Architecture x2APIC 3.11 Supervisor Mode Execution Protection SMEP 3.9 Power Aware Interrupt Routing PAIR3.10 Execute Disable Bit Note Power states availability may vary between the different SKUs 4.0 Power ManagementFigure 11. Processor Power States S0 - Processor Fully powered on full on mode / connected standby modeProcessor Core / Package State Support 4.1 Advanced Configuration and Power Interface ACPI States SupportedSystem States Integrated Memory Controller StatesDirect Media Interface DMI States 4.2 Processor Core Power Management4.2.1 Enhanced Intel SpeedStep Technology Key Features G, S, and C Interface State CombinationsThread 4.2.2 Low-Power Idle StatesFigure 12. Idle Power Management Breakdown of the Processor Cores ThreadFigure 13. Thread and Core C-State Entry and Exit 4.2.3 Requesting Low-Power Idle StatesCoordination of Thread Power States at the Core Level Core C1/C1E State 4.2.4 Core C-State RulesCore C0 State Core C3 StateCore C7 State 4.2.5 Package C-StatesCore C6 State C-State Auto-DemotionCoordination of Core Power States at the Package Level Package C1/C1E State Figure 14. Package C-State Entry and ExitPackage C0 State Package C6 State Package C2 StatePackage C3 State Package C7 State4.2.6 Package C-States and Display Resolutions Deepest Package C-State Available4.3 Integrated Memory Controller IMC Power Management 4.3.1 Disabling Unused System Memory Outputs4.3.2 DRAM Power Management and Initialization No power-down CKE disable4.3.2.2 Conditional Self-Refresh 4.3.2.3 Dynamic Power-Down4.3.2.1 Initialization Role of CKE 4.3.3 DRAM Running Average Power Limitation RAPL 4.4 PCI Express* Power Management4.5 Direct Media Interface DMI Power Management 4.3.4 DDR Electrical Power Gating EPG4.6.2 Graphics Render C-State 4.6 Graphics Power Management4.6.1 Intel Rapid Memory Power Management Intel RMPM 4.6.3 Intel Graphics Dynamic Frequency5.0 Thermal Management Thermal Management-ProcessorTemperature on page Desktop Processor Thermal Specifications5.1 Desktop Processor Thermal Profiles Processor-Thermal ManagementTTV Power W 5.1.1 Processor PCG 2013D Thermal ProfileTCASE = 0.33 * Power + Casecontinued 5.1.2 Processor PCG 2013C Thermal ProfileProcessor-Thermal Management continuedcontinued 5.1.3 Processor PCG 2013B Thermal ProfileThermal Management-Processor 5.1.4 Processor PCG 2013A Thermal Profile Processor-Thermal ManagementMeasure TCASE at the geometric center of the package 5.2 Thermal Metrology5.3 Fan Speed Control Scheme with Digital Thermal Sensor DTS 37.5 37.5Figure 20. Digital Thermal Sensor DTS 1.1 Definition Points ΨCA = TCASE-MAX - TAMBIENT-TARGET / TDP5.4 Fan Speed Control Scheme with Digital Thermal Sensor DTS Thermal Margin Slope 5.5 Processor TemperatureFigure 21. Digital Thermal Sensor DTS Thermal Profile Definition 5.6 Adaptive Thermal Monitor Frequency ControlImmediate Transition to Combined TM1 and TM2 Critical Temperature FlagClock Modulation PROCHOT# Signal 5.7 THERMTRIP# Signal 5.8 Digital Thermal Sensor5.8.1 Digital Thermal Sensor Accuracy Taccuracy 5.9.1 Intel Turbo Boost Technology Power Control and Reporting5.9 Intel Turbo Boost Technology Thermal Considerations 5.9.2 Package Power Control Intel Turbo Boost Technology 2.0 Package Power Control SettingsFigure 22. Package Power Control 5.9.3 Turbo Time ParameterSignal Description Buffer Types 6.0 Signal Description6.1 System Memory Interface Signals Memory Channel A SignalsWrite Enable Control Signal This signal is used with Memory Channel B SignalsSignal Description-Processor continuedProcessor-Signal Description 6.2 Memory Reference and Compensation SignalsMemory Reference and Compensation Signals DDR3/DDR3L Reference Voltage This signal is used asSignal Description-Processor 6.3 Reset and Miscellaneous SignalsReset and Miscellaneous Signals CFG3 MSR Privacy Bit FeaturePCI Express* Graphics Interface Signals 6.4 PCI Express*-Based Interface Signals6.5 Display Interface Signals Display Interface SignalsPhase Locked Loop PLL Signals 6.7 Phase Locked Loop PLL Signals6.8 Testability Signals Testability SignalsError and Thermal Protection Signals 6.9 Error and Thermal Protection Signals6.10 Power Sequencing Signals Power Sequencing Signals6.13 Ground and Non-Critical to Function NCTF Signals 6.11 Processor Power Signals6.12 Sense Signals Processor Power Signals7.1 Integrated Voltage Regulator 7.0 Electrical Specifications7.2 Power and Ground Lands 7.3 VCC Voltage Identification VIDcontinued Table 45. Voltage Regulator VR 12.5 Voltage IdentificationElectrical Specifications-Processor continuedcontinued Processor-Electrical Specificationscontinued continued Electrical Specifications-Processorcontinued Processor-Electrical Specifications continuedSignal Groups 7.4 Reserved or Unused Signals7.5 Signal Groups Power / Ground / Other DDR3 / DDR3L Data SignalsDDR3 / DDR3L Reference Voltage Signals DDR3 / DDR3L CompensationPCI Express* Graphics 7.6 Test Access Port TAP Connection7.7 DC Specifications Digital Media Interface DMIcontinued 7.8 Voltage and Current SpecificationsProcessor-Electrical Specifications Electrical Specifications-Processor Processor-Electrical Specifications DDR3 / DDR3L Signal Group DC SpecificationsVCCIOOUT, VCOMPOUT, and VCCIOTERM continuedDigital Display Interface Group DC Specifications Electrical Specifications-ProcessorGTL Signal Group and Open Drain Signal Group DC Specifications embedded DisplayPort* eDP* Group DC SpecificationsCMOS Signal Group DC Specifications Processor-Electrical SpecificationsElectrical Specifications-Processor 7.8.1 Platform Environment Control Interface PECI DC CharacteristicsPCI Express* DC Specifications continuedProcessor-Electrical Specifications 7.8.2 Input Device HysteresisFigure 23. Input Device Hysteresis Figure 24. Processor Package Assembly Sketch 8.0 Package Mechanical Specifications8.2 Package Loading Specifications 8.1 Processor Component Keep-Out ZoneProcessor Loading Specifications 8.4 Package Insertion Specifications8.5 Processor Mass Specification 8.3 Package Handling GuidelinesProcessor Materials 8.7 Processor Markings8.8 Processor Land Coordinates Figure 25. Processor Top-Side MarkingsFigure 26. Processor Package Land Coordinates 8.9 Processor Storage SpecificationsProcessor Storage Specifications Processor-Package Mechanical SpecificationsTIMEsustained storage Package Mechanical Specifications-ProcessorRHsustained storage 9.0 Processor Ball and Signal Information Processor Ball List by Signal Namecontinued Processor Ball and Signal Information-Processorcontinued continuedcontinued Processor-Processor Ball and Signal Informationcontinued continuedSignal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #continued continuedcontinued AU20Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #