Manuals / Intel / Computer Equipment / Computer Hardware

Intel BX80637I73770K, CM8064601466200 manual Electrical Specifications-Processor, continued

Models: BX80633I74960X BX80646I34130 BX80646I54430 BX80646I74770K BX80646I74770 BX80646I54570S BX80646I74770S BXF80646I74770K CM8063701159502 CM8063701212200 BX80637I73770K CM8064601466003 CM8064601466200

1 120

Download 120 pages 30.96 Kb

Page 93

Manual background

Electrical Specifications—Processor

B	B	B	B	B	B	B	B	Hex	VCC
i	i	i	i	i	i	i	i
t	t	t	t	t	t	t	t
7	6	5	4	3	2	1	0

1	0	0	0	0	1	1	0	86h	1.8300

1	0	0	0	0	1	1	1	87h	1.8400

1	0	0	0	1	0	0	0	88h	1.8500

1	0	0	0	1	0	0	1	89h	1.8600

1	0	0	0	1	0	1	0	8Ah	1.8700

1	0	0	0	1	0	1	1	8Bh	1.8800

1	0	0	0	1	1	0	0	8Ch	1.8900

1	0	0	0	1	1	0	1	8Dh	1.9000

1	0	0	0	1	1	1	0	8Eh	1.9100

1	0	0	0	1	1	1	1	8Fh	1.9200

1	0	0	1	0	0	0	0	90h	1.9300

1	0	0	1	0	0	0	1	91h	1.9400

1	0	0	1	0	0	1	0	92h	1.9500

1	0	0	1	0	0	1	1	93h	1.9600

1	0	0	1	0	1	0	0	94h	1.9700

1	0	0	1	0	1	0	1	95h	1.9800

1	0	0	1	0	1	1	0	96h	1.9900

1	0	0	1	0	1	1	1	97h	2.0000

1	0	0	1	1	0	0	0	98h	2.0100

1	0	0	1	1	0	0	1	99h	2.0200

1	0	0	1	1	0	1	0	9Ah	2.0300

1	0	0	1	1	0	1	1	9Bh	2.0400

1	0	0	1	1	1	0	0	9Ch	2.0500

1	0	0	1	1	1	0	1	9Dh	2.0600

1	0	0	1	1	1	1	0	9Eh	2.0700

1	0	0	1	1	1	1	1	9Fh	2.0800

1	0	1	0	0	0	0	0	A0h	2.0900

1	0	1	0	0	0	0	1	A1h	2.1000

1	0	1	0	0	0	1	0	A2h	2.1100

1	0	1	0	0	0	1	1	A3h	2.1200

1	0	1	0	0	1	0	0	A4h	2.1300

1	0	1	0	0	1	0	1	A5h	2.1400

1	0	1	0	0	1	1	0	A6h	2.1500

1	0	1	0	0	1	1	1	A7h	2.1600

continued...

B	B	B	B	B	B	B	B	Hex	VCC
i	i	i	i	i	i	i	i
t	t	t	t	t	t	t	t
7	6	5	4	3	2	1	0

1	0	1	0	1	0	0	0	A8h	2.1700

1	0	1	0	1	0	0	1	A9h	2.1800

1	0	1	0	1	0	1	0	AAh	2.1900

1	0	1	0	1	0	1	1	ABh	2.2000

1	0	1	0	1	1	0	0	ACh	2.2100

1	0	1	0	1	1	0	1	ADh	2.2200

1	0	1	0	1	1	1	0	AEh	2.2300

1	0	1	0	1	1	1	1	AFh	2.2400

1	0	1	1	0	0	0	0	B0h	2.2500

1	0	1	1	0	0	0	1	B1h	2.2600

1	0	1	1	0	0	1	0	B2h	2.2700

1	0	1	1	0	0	1	1	B3h	2.2800

1	0	1	1	0	1	0	0	B4h	2.2900

1	0	1	1	0	1	0	1	B5h	2.3000

1	0	1	1	0	1	1	0	B6h	2.3100

1	0	1	1	0	1	1	1	B7h	2.3200

1	0	1	1	1	0	0	0	B8h	2.3300

1	0	1	1	1	0	0	1	B9h	2.3400

1	0	1	1	1	0	1	0	BAh	2.3500

1	0	1	1	1	0	1	1	BBh	2.3600

1	0	1	1	1	1	0	0	BCh	2.3700

1	0	1	1	1	1	0	1	BDh	2.3800

1	0	1	1	1	1	1	0	BEh	2.3900

1	0	1	1	1	1	1	1	BFh	2.4000

1	1	0	0	0	0	0	0	C0h	2.4100

1	1	0	0	0	0	0	1	C1h	2.4200

1	1	0	0	0	0	1	0	C2h	2.4300

1	1	0	0	0	0	1	1	C3h	2.4400

1	1	0	0	0	1	0	0	C4h	2.4500

1	1	0	0	0	1	0	1	C5h	2.4600

1	1	0	0	0	1	1	0	C6h	2.4700

1	1	0	0	0	1	1	1	C7h	2.4800

1	1	0	0	1	0	0	0	C8h	2.4900

1	1	0	0	1	0	0	1	C9h	2.5000

continued...

Desktop 4th Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, and Desktop Intel® Celeron® Processor Family

December 2013	Datasheet – Volume 1 of 2
Order No.: 328897-004	93

Image 93

Intel BX80637I73770K, CM8064601466200, CM8064601466003, CM8063701212200 manual Electrical Specifications-Processor, continued

BX80633I74960X, BX80646I34130, BX80646I54430, BX80646I74770K, BX80646I74770 specifications

The Intel CM8063701159502, or BX80637I53470, is a powerful CPU designed for modern computing needs. This processor belongs to Intel's 4th generation of Core i5 processors, commonly known as "Haswell". It showcases Intel's commitment to enhancing performance, increasing energy efficiency, and delivering an enriching user experience.

One of the main features of the Intel Core i5-3470 is its quad-core architecture. This allows the processor to handle multiple threads simultaneously, making it adept at multitasking and running demanding applications efficiently. With a base clock speed of 3.2 GHz, it can boost up to 3.6 GHz using Intel’s Turbo Boost technology, providing additional power when needed for intensive tasks like gaming or video editing.

The Intel i5-3470 features Intel's HD Graphics 2500, which offers decent graphics performance for everyday tasks and casual gaming. This integrated graphics solution is capable of delivering high-definition visuals and supports DirectX 11, making it suitable for lightweight gaming experiences without the need for an additional dedicated graphics card.

Another standout characteristic of the BX80637I53470 is its support for Intel Smart Cache, which is an advanced caching technology. It provides a shared cache pool that enhances performance by reducing the time it takes to access frequently used data. This feature, coupled with Intel's instruction set architecture, allows for improved processing agility and efficiency across applications.

The processor is built on a 22nm manufacturing process, which results in reduced power consumption and heat generation compared to its predecessors. It has a thermal design power (TDP) of 77 watts, making it energy efficient while still delivering robust performance. Additionally, the Core i5-3470 supports DDR3 memory, with speeds up to 1600 MHz, enabling quick data retrieval and improved system responsiveness.

Security is another important aspect of the Intel i5-3470, featuring Intel Secure Key and Intel AES New Instructions (AES-NI), which protect sensitive data and enhance encryption performance.

In conclusion, the Intel CM8063701159502, or BX80637I53470, encapsulates modern computing technology with its powerful quad-core performance, integrated graphics, energy efficiency, and robust security features, making it a versatile choice for a wide range of computing tasks. Whether users are engaging in casual gaming, productivity tasks, or multimedia consumption, this processor demonstrates a solid balance of performance and efficiency, providing an excellent computing experience overall.

Contents

December Datasheet - Volume 1 of Datasheet - Volume 1 of 2 4.0 Power Management ContentsRevision History 1.0 Introduction 6.0 Signal Description Processor-Contents5.0 Thermal Management 8.0 Package Mechanical Specifications 7.0 Electrical Specifications9.0 Processor Ball and Signal Information 7.8.1 Platform Environment Control Interface PECI DC Characteristics Figures Tables-Processor Tables Processor-Tables Revision History-Processor Revision History Processor-Introduction 1.0 Introduction 1.1 Supported Technologies Figure 1. Platform Block DiagramProcessor Platform Controller Hub PCH 1.2 Interfaces 1.3 Power Management SupportProcessor Core System 1.5 Package Support 1.4 Thermal Management Support1.6 Terminology Terminology with Virtual Machine Monitor software, enables multiple, robust independent software Term Related Documents 1.7 Related DocumentsDocument Number / Location http specificationsproducts/processor manuals/index.htm 2.1 System Memory Interface 2.0 Interfaces Supported UDIMM Module Configurations 2.1.1 System Memory Technology SupportedProcessor DIMM Support by Product Supported SO-DIMM Module Configurations AIO Only 2.1.2 System Memory Timing SupportDDR3 / DDR3L System Memory Timing Support Single-Channel Mode 2.1.3 System Memory Organization ModesDual-Channel Mode - Intel Flex Memory Technology Mode Figure 2. Intel Flex Memory Technology Operations Just-in-Time Command Scheduling 2.1.3.2 Intel Fast Memory Access Intel FMA Technology EnhancementsCommand Overlap 2.1.3.1 System Memory Frequency 2.2 PCI Express* Interface Table 7. PCI Express* Supported Configurations in Desktop Products2.2.1 PCI Express* Support 2.1.3.3 Data Scrambling 2.2.2 PCI Express* Architecture 2.2.3 PCI Express* Configuration Mechanism PCI Express* Related Register Structures in the Processor PCI Express* PortPCI Express* Lanes Connection Figure 4. PCI Express* Typical Operation 16 Lanes Mapping 2.3 Direct Media Interface DMI1 X 4 Controller 1 X 8 Controller DMI Link Down DMI Error Flow 2.5 Processor Graphics Controller GT 2.4 Processor Graphics 2.5.1 3D and Video Engines for Graphics Processing Figure 5. Processor Graphics Controller Unit Block Diagram3D Pipeline 3D Engine Execution Units Geometry Shader GS Stage Vertex Shader VS StageClip Stage Strips and Fans SF Stage 2.6 Digital Display Interface DDI 2.5.2 Multi Graphics Controllers Multi-Monitor SupportLogical 128-Bit Fixed BLT and 256 Fill Engine Figure 6. Processor Display Architecture Sink Device Source DeviceDisplayPort Figure 7. DisplayPort* Overview HDMI Sink HDMI SourceFigure 8. HDMI* Overview HDMI Tx embedded DisplayPort Multiple Display ConfigurationsIntegrated Audio Table 8. Processor Supported Audio Formats over HDMI*and DisplayPort High-bandwidth Digital Content Protection HDCP Valid Three Display Configurations through the Processor 2.7 Intel Flexible Display Interface Intel FDI 2.8 Platform Environmental Control Interface PECI2.8.1 PECI Bus Architecture PECI Figure 9. PECI Host-Clients Connection ExampleHost / Originator PECI Client 3.1 Intel Virtualization Technology Intel VT 3.0 TechnologiesIntel VT-x Objectives ing=VT Intel VT-x Features Intel VT-d Objectives Figure 10. Device to Domain Mapping Structures Intel VT-d Features 3.2 Intel Trusted Execution Technology Intel TXT 3.3 Intel Hyper-Threading Technology Intel HT Technology 3.4 Intel Turbo Boost Technology 3.5 Intel Advanced Vector Extensions 2.0 Intel AVX2Intel Turbo Boost Technology 2.0 Frequency 3.6 Intel Advanced Encryption Standard New Instructions Intel AES-NI PCLMULQDQ InstructionIntel Secure Key 3.8 Intel 64 Architecture x2APIC 3.9 Power Aware Interrupt Routing PAIR 3.10 Execute Disable Bit3.11 Supervisor Mode Execution Protection SMEP Figure 11. Processor Power States 4.0 Power ManagementNote Power states availability may vary between the different SKUs S0 - Processor Fully powered on full on mode / connected standby mode System States 4.1 Advanced Configuration and Power Interface ACPI States SupportedProcessor Core / Package State Support Integrated Memory Controller States 4.2.1 Enhanced Intel SpeedStep Technology Key Features 4.2 Processor Core Power ManagementDirect Media Interface DMI States G, S, and C Interface State Combinations Figure 12. Idle Power Management Breakdown of the Processor Cores 4.2.2 Low-Power Idle StatesThread Core 0 State 4.2.3 Requesting Low-Power Idle States Coordination of Thread Power States at the Core LevelFigure 13. Thread and Core C-State Entry and Exit Core C0 State 4.2.4 Core C-State RulesCore C1/C1E State Core C3 State Core C6 State 4.2.5 Package C-StatesCore C7 State C-State Auto-Demotion Coordination of Core Power States at the Package Level Figure 14. Package C-State Entry and Exit Package C0 StatePackage C1/C1E State Package C3 State Package C2 StatePackage C6 State Package C7 State Deepest Package C-State Available 4.2.6 Package C-States and Display Resolutions 4.3.1 Disabling Unused System Memory Outputs 4.3 Integrated Memory Controller IMC Power Management No power-down CKE disable 4.3.2 DRAM Power Management and Initialization 4.3.2.3 Dynamic Power-Down 4.3.2.1 Initialization Role of CKE4.3.2.2 Conditional Self-Refresh 4.5 Direct Media Interface DMI Power Management 4.4 PCI Express* Power Management4.3.3 DRAM Running Average Power Limitation RAPL 4.3.4 DDR Electrical Power Gating EPG 4.6.1 Intel Rapid Memory Power Management Intel RMPM 4.6 Graphics Power Management4.6.2 Graphics Render C-State 4.6.3 Intel Graphics Dynamic Frequency Thermal Management-Processor 5.0 Thermal Management 5.1 Desktop Processor Thermal Profiles Desktop Processor Thermal SpecificationsProcessor-Thermal Management Profile TCASE = 0.33 * Power + 5.1.1 Processor PCG 2013D Thermal ProfileTTV Power W Case 5.1.2 Processor PCG 2013C Thermal Profile 5.1.3 Processor PCG 2013B Thermal Profile 5.1.4 Processor PCG 2013A Thermal Profile 5.3 Fan Speed Control Scheme with Digital Thermal Sensor DTS 5.2 Thermal MetrologyMeasure TCASE at the geometric center of the package 37.5 37.5 ΨCA = TCASE-MAX - TAMBIENT-TARGET / TDP Figure 20. Digital Thermal Sensor DTS 1.1 Definition Points 5.4 Fan Speed Control Scheme with Digital Thermal Sensor DTS 5.5 Processor Temperature Figure 21. Digital Thermal Sensor DTS Thermal Profile DefinitionThermal Margin Slope Frequency Control 5.6 Adaptive Thermal Monitor Clock Modulation Immediate Transition to Combined TM1 and TM2Critical Temperature Flag PROCHOT# Signal 5.8 Digital Thermal Sensor 5.7 THERMTRIP# Signal 5.9.1 Intel Turbo Boost Technology Power Control and Reporting 5.9 Intel Turbo Boost Technology Thermal Considerations5.8.1 Digital Thermal Sensor Accuracy Taccuracy Intel Turbo Boost Technology 2.0 Package Power Control Settings 5.9.2 Package Power Control 5.9.3 Turbo Time Parameter Figure 22. Package Power Control 6.1 System Memory Interface Signals 6.0 Signal DescriptionSignal Description Buffer Types Memory Channel A Signals Signal Description-Processor Memory Channel B Signals Memory Reference and Compensation Signals 6.2 Memory Reference and Compensation SignalsDDR3/DDR3L Reference Voltage This signal is used as System Memory Impedance Compensation Reset and Miscellaneous Signals 6.3 Reset and Miscellaneous SignalsCFG3 MSR Privacy Bit Feature CFG65 PCI Express* Bifurcation 6.5 Display Interface Signals 6.4 PCI Express*-Based Interface SignalsPCI Express* Graphics Interface Signals Display Interface Signals 6.8 Testability Signals 6.7 Phase Locked Loop PLL SignalsPhase Locked Loop PLL Signals Testability Signals 6.10 Power Sequencing Signals 6.9 Error and Thermal Protection SignalsError and Thermal Protection Signals Power Sequencing Signals 6.12 Sense Signals 6.11 Processor Power Signals6.13 Ground and Non-Critical to Function NCTF Signals Processor Power Signals 7.2 Power and Ground Lands 7.0 Electrical Specifications7.1 Integrated Voltage Regulator 7.3 VCC Voltage Identification VID Electrical Specifications-Processor Table 45. Voltage Regulator VR 12.5 Voltage Identification Processor-Electrical Specifications continuedcontinued Electrical Specifications-Processor continuedcontinued continued 7.4 Reserved or Unused Signals 7.5 Signal GroupsSignal Groups DDR3 / DDR3L Reference Voltage Signals DDR3 / DDR3L Data SignalsPower / Ground / Other DDR3 / DDR3L Compensation 7.7 DC Specifications 7.6 Test Access Port TAP ConnectionPCI Express* Graphics Digital Media Interface DMI 7.8 Voltage and Current Specifications Electrical Specifications-Processor VCCIOOUT, VCOMPOUT, and VCCIOTERM DDR3 / DDR3L Signal Group DC Specifications Digital Display Interface Group DC Specifications embedded DisplayPort* eDP* Group DC Specifications CMOS Signal Group DC SpecificationsGTL Signal Group and Open Drain Signal Group DC Specifications PCI Express* DC Specifications 7.8.1 Platform Environment Control Interface PECI DC Characteristics Figure 23. Input Device Hysteresis 7.8.2 Input Device Hysteresis 8.2 Package Loading Specifications 8.0 Package Mechanical SpecificationsFigure 24. Processor Package Assembly Sketch 8.1 Processor Component Keep-Out Zone 8.5 Processor Mass Specification 8.4 Package Insertion SpecificationsProcessor Loading Specifications 8.3 Package Handling Guidelines 8.8 Processor Land Coordinates 8.7 Processor MarkingsProcessor Materials Figure 25. Processor Top-Side Markings 8.9 Processor Storage Specifications Processor Storage SpecificationsFigure 26. Processor Package Land Coordinates TIMEsustained storage RHsustained storage Processor Ball List by Signal Name 9.0 Processor Ball and Signal Information Processor Ball and Signal Information-Processor Processor-Processor Ball and Signal Information Signal Name Signal NameSignal Name Ball # Signal Name Signal NameSignal Name Ball # Signal Name AU20 Signal Name Signal NameSignal Name Ball # Signal Name Signal NameSignal Name Ball # Signal Name Signal NameSignal Name Ball # Signal Name Signal NameSignal Name Ball #