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Intel CM8063701212200 manual Processor Markings, Processor Land Coordinates, Processor Materials

Models: BX80633I74960X BX80646I34130 BX80646I54430 BX80646I74770K BX80646I74770 BX80646I54570S BX80646I74770S BXF80646I74770K CM8063701159502 CM8063701212200 BX80637I73770K CM8064601466003 CM8064601466200

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Package Mechanical Specifications—Processor

Table 59.	Processor Materials

	Component	Material

	Integrated Heat Spreader (IHS)	Nickel Plated Copper

	Substrate	Fiber Reinforced Resin

	Substrate Lands	Gold Plated Copper

8.7 Processor Markings

The following figure shows the top-side markings on the processor. This diagram aids in the identification of the processor.

Figure 25. Processor Top-Side Markings

8.8Processor Land Coordinates

The following figure shows the bottom view of the processor package.

Desktop 4th Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, and Desktop Intel® Celeron® Processor Family

December 2013	Datasheet – Volume 1 of 2
Order No.: 328897-004	107

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Intel CM8063701212200 Processor Markings, Processor Land Coordinates, Processor Materials, Processor Top-Side Markings

BX80633I74960X, BX80646I34130, BX80646I54430, BX80646I74770K, BX80646I74770 specifications

The Intel CM8063701159502, or BX80637I53470, is a powerful CPU designed for modern computing needs. This processor belongs to Intel's 4th generation of Core i5 processors, commonly known as "Haswell". It showcases Intel's commitment to enhancing performance, increasing energy efficiency, and delivering an enriching user experience.

One of the main features of the Intel Core i5-3470 is its quad-core architecture. This allows the processor to handle multiple threads simultaneously, making it adept at multitasking and running demanding applications efficiently. With a base clock speed of 3.2 GHz, it can boost up to 3.6 GHz using Intel’s Turbo Boost technology, providing additional power when needed for intensive tasks like gaming or video editing.

The Intel i5-3470 features Intel's HD Graphics 2500, which offers decent graphics performance for everyday tasks and casual gaming. This integrated graphics solution is capable of delivering high-definition visuals and supports DirectX 11, making it suitable for lightweight gaming experiences without the need for an additional dedicated graphics card.

Another standout characteristic of the BX80637I53470 is its support for Intel Smart Cache, which is an advanced caching technology. It provides a shared cache pool that enhances performance by reducing the time it takes to access frequently used data. This feature, coupled with Intel's instruction set architecture, allows for improved processing agility and efficiency across applications.

The processor is built on a 22nm manufacturing process, which results in reduced power consumption and heat generation compared to its predecessors. It has a thermal design power (TDP) of 77 watts, making it energy efficient while still delivering robust performance. Additionally, the Core i5-3470 supports DDR3 memory, with speeds up to 1600 MHz, enabling quick data retrieval and improved system responsiveness.

Security is another important aspect of the Intel i5-3470, featuring Intel Secure Key and Intel AES New Instructions (AES-NI), which protect sensitive data and enhance encryption performance.

In conclusion, the Intel CM8063701159502, or BX80637I53470, encapsulates modern computing technology with its powerful quad-core performance, integrated graphics, energy efficiency, and robust security features, making it a versatile choice for a wide range of computing tasks. Whether users are engaging in casual gaming, productivity tasks, or multimedia consumption, this processor demonstrates a solid balance of performance and efficiency, providing an excellent computing experience overall.

Contents

December Datasheet - Volume 1 of Datasheet - Volume 1 of 2 1.0 Introduction Contents4.0 Power Management Revision History 5.0 Thermal Management 6.0 Signal DescriptionProcessor-Contents 7.8.1 Platform Environment Control Interface PECI DC Characteristics 7.0 Electrical Specifications8.0 Package Mechanical Specifications 9.0 Processor Ball and Signal Information Figures Tables-Processor Tables Processor-Tables Revision History-Processor Revision History Processor-Introduction 1.0 Introduction Platform Controller Hub PCH Figure 1. Platform Block Diagram1.1 Supported Technologies Processor System 1.3 Power Management Support1.2 Interfaces Processor Core Terminology 1.4 Thermal Management Support1.5 Package Support 1.6 Terminology with Virtual Machine Monitor software, enables multiple, robust independent software continued Number / Location 1.7 Related DocumentsRelated Documents Document manuals/index.htm specificationshttp products/processor 2.1 System Memory Interface 2.0 Interfaces Processor DIMM Support by Product Supported UDIMM Module Configurations2.1.1 System Memory Technology Supported DDR3 / DDR3L System Memory Timing Support Supported SO-DIMM Module Configurations AIO Only2.1.2 System Memory Timing Support Figure 2. Intel Flex Memory Technology Operations 2.1.3 System Memory Organization ModesSingle-Channel Mode Dual-Channel Mode - Intel Flex Memory Technology Mode 2.1.3.1 System Memory Frequency 2.1.3.2 Intel Fast Memory Access Intel FMA Technology EnhancementsJust-in-Time Command Scheduling Command Overlap 2.1.3.3 Data Scrambling Table 7. PCI Express* Supported Configurations in Desktop Products2.2 PCI Express* Interface 2.2.1 PCI Express* Support 2.2.2 PCI Express* Architecture 2.2.3 PCI Express* Configuration Mechanism PCI Express* Lanes Connection PCI Express* Related Register Structures in the ProcessorPCI Express* Port 1 X 8 Controller 2.3 Direct Media Interface DMIFigure 4. PCI Express* Typical Operation 16 Lanes Mapping 1 X 4 Controller DMI Link Down DMI Error Flow 2.5 Processor Graphics Controller GT 2.4 Processor Graphics 3D Engine Execution Units Figure 5. Processor Graphics Controller Unit Block Diagram2.5.1 3D and Video Engines for Graphics Processing 3D Pipeline Strips and Fans SF Stage Vertex Shader VS StageGeometry Shader GS Stage Clip Stage Logical 128-Bit Fixed BLT and 256 Fill Engine 2.6 Digital Display Interface DDI2.5.2 Multi Graphics Controllers Multi-Monitor Support Figure 6. Processor Display Architecture Figure 7. DisplayPort* Overview Source DeviceSink Device DisplayPort HDMI Tx HDMI SourceHDMI Sink Figure 8. HDMI* Overview Table 8. Processor Supported Audio Formats over HDMI*and DisplayPort Multiple Display Configurationsembedded DisplayPort Integrated Audio High-bandwidth Digital Content Protection HDCP Valid Three Display Configurations through the Processor 2.8.1 PECI Bus Architecture 2.7 Intel Flexible Display Interface Intel FDI2.8 Platform Environmental Control Interface PECI PECI Client Figure 9. PECI Host-Clients Connection ExamplePECI Host / Originator ing=VT 3.0 Technologies3.1 Intel Virtualization Technology Intel VT Intel VT-x Objectives Intel VT-x Features Intel VT-d Objectives Figure 10. Device to Domain Mapping Structures Intel VT-d Features 3.2 Intel Trusted Execution Technology Intel TXT 3.3 Intel Hyper-Threading Technology Intel HT Technology Intel Turbo Boost Technology 2.0 Frequency 3.4 Intel Turbo Boost Technology3.5 Intel Advanced Vector Extensions 2.0 Intel AVX2 Intel Secure Key 3.6 Intel Advanced Encryption Standard New Instructions Intel AES-NIPCLMULQDQ Instruction 3.8 Intel 64 Architecture x2APIC 3.11 Supervisor Mode Execution Protection SMEP 3.9 Power Aware Interrupt Routing PAIR3.10 Execute Disable Bit S0 - Processor Fully powered on full on mode / connected standby mode 4.0 Power ManagementFigure 11. Processor Power States Note Power states availability may vary between the different SKUs Integrated Memory Controller States 4.1 Advanced Configuration and Power Interface ACPI States SupportedSystem States Processor Core / Package State Support G, S, and C Interface State Combinations 4.2 Processor Core Power Management4.2.1 Enhanced Intel SpeedStep Technology Key Features Direct Media Interface DMI States Core 0 State 4.2.2 Low-Power Idle StatesFigure 12. Idle Power Management Breakdown of the Processor Cores Thread Figure 13. Thread and Core C-State Entry and Exit 4.2.3 Requesting Low-Power Idle StatesCoordination of Thread Power States at the Core Level Core C3 State 4.2.4 Core C-State RulesCore C0 State Core C1/C1E State C-State Auto-Demotion 4.2.5 Package C-StatesCore C6 State Core C7 State Coordination of Core Power States at the Package Level Package C1/C1E State Figure 14. Package C-State Entry and ExitPackage C0 State Package C7 State Package C2 StatePackage C3 State Package C6 State Deepest Package C-State Available 4.2.6 Package C-States and Display Resolutions 4.3.1 Disabling Unused System Memory Outputs 4.3 Integrated Memory Controller IMC Power Management No power-down CKE disable 4.3.2 DRAM Power Management and Initialization 4.3.2.2 Conditional Self-Refresh 4.3.2.3 Dynamic Power-Down4.3.2.1 Initialization Role of CKE 4.3.4 DDR Electrical Power Gating EPG 4.4 PCI Express* Power Management4.5 Direct Media Interface DMI Power Management 4.3.3 DRAM Running Average Power Limitation RAPL 4.6.3 Intel Graphics Dynamic Frequency 4.6 Graphics Power Management4.6.1 Intel Rapid Memory Power Management Intel RMPM 4.6.2 Graphics Render C-State Thermal Management-Processor 5.0 Thermal Management Profile Desktop Processor Thermal Specifications5.1 Desktop Processor Thermal Profiles Processor-Thermal Management Case 5.1.1 Processor PCG 2013D Thermal ProfileTCASE = 0.33 * Power + TTV Power W 5.1.2 Processor PCG 2013C Thermal Profile 5.1.3 Processor PCG 2013B Thermal Profile 5.1.4 Processor PCG 2013A Thermal Profile 37.5 37.5 5.2 Thermal Metrology5.3 Fan Speed Control Scheme with Digital Thermal Sensor DTS Measure TCASE at the geometric center of the package ΨCA = TCASE-MAX - TAMBIENT-TARGET / TDP Figure 20. Digital Thermal Sensor DTS 1.1 Definition Points 5.4 Fan Speed Control Scheme with Digital Thermal Sensor DTS Thermal Margin Slope 5.5 Processor TemperatureFigure 21. Digital Thermal Sensor DTS Thermal Profile Definition Frequency Control 5.6 Adaptive Thermal Monitor Critical Temperature Flag Clock ModulationImmediate Transition to Combined TM1 and TM2 PROCHOT# Signal 5.8 Digital Thermal Sensor 5.7 THERMTRIP# Signal 5.8.1 Digital Thermal Sensor Accuracy Taccuracy 5.9.1 Intel Turbo Boost Technology Power Control and Reporting5.9 Intel Turbo Boost Technology Thermal Considerations Intel Turbo Boost Technology 2.0 Package Power Control Settings 5.9.2 Package Power Control 5.9.3 Turbo Time Parameter Figure 22. Package Power Control Memory Channel A Signals 6.0 Signal Description6.1 System Memory Interface Signals Signal Description Buffer Types Signal Description-Processor Memory Channel B Signals System Memory Impedance Compensation 6.2 Memory Reference and Compensation SignalsMemory Reference and Compensation Signals DDR3/DDR3L Reference Voltage This signal is used as CFG65 PCI Express* Bifurcation 6.3 Reset and Miscellaneous SignalsReset and Miscellaneous Signals CFG3 MSR Privacy Bit Feature Display Interface Signals 6.4 PCI Express*-Based Interface Signals6.5 Display Interface Signals PCI Express* Graphics Interface Signals Testability Signals 6.7 Phase Locked Loop PLL Signals6.8 Testability Signals Phase Locked Loop PLL Signals Power Sequencing Signals 6.9 Error and Thermal Protection Signals6.10 Power Sequencing Signals Error and Thermal Protection Signals Processor Power Signals 6.11 Processor Power Signals6.12 Sense Signals 6.13 Ground and Non-Critical to Function NCTF Signals 7.3 VCC Voltage Identification VID 7.0 Electrical Specifications7.2 Power and Ground Lands 7.1 Integrated Voltage Regulator Electrical Specifications-Processor Table 45. Voltage Regulator VR 12.5 Voltage Identification continued Processor-Electrical Specificationscontinued continued Electrical Specifications-Processorcontinued continued Signal Groups 7.4 Reserved or Unused Signals7.5 Signal Groups DDR3 / DDR3L Compensation DDR3 / DDR3L Data SignalsDDR3 / DDR3L Reference Voltage Signals Power / Ground / Other Digital Media Interface DMI 7.6 Test Access Port TAP Connection7.7 DC Specifications PCI Express* Graphics 7.8 Voltage and Current Specifications Electrical Specifications-Processor VCCIOOUT, VCOMPOUT, and VCCIOTERM DDR3 / DDR3L Signal Group DC Specifications Digital Display Interface Group DC Specifications GTL Signal Group and Open Drain Signal Group DC Specifications embedded DisplayPort* eDP* Group DC SpecificationsCMOS Signal Group DC Specifications PCI Express* DC Specifications 7.8.1 Platform Environment Control Interface PECI DC Characteristics Figure 23. Input Device Hysteresis 7.8.2 Input Device Hysteresis 8.1 Processor Component Keep-Out Zone 8.0 Package Mechanical Specifications8.2 Package Loading Specifications Figure 24. Processor Package Assembly Sketch 8.3 Package Handling Guidelines 8.4 Package Insertion Specifications8.5 Processor Mass Specification Processor Loading Specifications Figure 25. Processor Top-Side Markings 8.7 Processor Markings8.8 Processor Land Coordinates Processor Materials Figure 26. Processor Package Land Coordinates 8.9 Processor Storage SpecificationsProcessor Storage Specifications TIMEsustained storage RHsustained storage Processor Ball List by Signal Name 9.0 Processor Ball and Signal Information Processor Ball and Signal Information-Processor Processor-Processor Ball and Signal Information Ball # Signal NameSignal Name Signal Name Ball # Signal NameSignal Name Signal Name Ball # AU20 Ball # Signal NameSignal Name Signal Name Ball # Signal NameSignal Name Signal Name Ball # Signal NameSignal Name Signal Name Ball # Signal NameSignal Name Signal Name