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Intel CM8063701212200, CM8064601466200 manual continued, Processor-Electrical Specifications

Models: BX80633I74960X BX80646I34130 BX80646I54430 BX80646I74770K BX80646I74770 BX80646I54570S BX80646I74770S BXF80646I74770K CM8063701159502 CM8063701212200 BX80637I73770K CM8064601466003 CM8064601466200

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Page 94

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December 2013 Order No.: 328897-004

B	B	B	B	B	B	B	B	Hex	VCC
i	i	i	i	i	i	i	i
t	t	t	t	t	t	t	t
7	6	5	4	3	2	1	0

1	1	0	0	1	0	1	0	CAh	2.5100

1	1	0	0	1	0	1	1	CBh	2.5200

1	1	0	0	1	1	0	0	CCh	2.5300

1	1	0	0	1	1	0	1	CDh	2.5400

1	1	0	0	1	1	1	0	CEh	2.5500

1	1	0	0	1	1	1	1	CFh	2.5600

1	1	0	1	0	0	0	0	D0h	2.5700

1	1	0	1	0	0	0	1	D1h	2.5800

1	1	0	1	0	0	1	0	D2h	2.5900

1	1	0	1	0	0	1	1	D3h	2.6000

1	1	0	1	0	1	0	0	D4h	2.6100

1	1	0	1	0	1	0	1	D5h	2.6200

1	1	0	1	0	1	1	0	D6h	2.6300

1	1	0	1	0	1	1	1	D7h	2.6400

1	1	0	1	1	0	0	0	D8h	2.6500

1	1	0	1	1	0	0	1	D9h	2.6600

1	1	0	1	1	0	1	0	DAh	2.6700

1	1	0	1	1	0	1	1	DBh	2.6800

1	1	0	1	1	1	0	0	DCh	2.6900

1	1	0	1	1	1	0	1	DDh	2.7000

1	1	0	1	1	1	1	0	DEh	2.7100

1	1	0	1	1	1	1	1	DFh	2.7200

1	1	1	0	0	0	0	0	E0h	2.7300

1	1	1	0	0	0	0	1	E1h	2.7400

1	1	1	0	0	0	1	0	E2h	2.7500

1	1	1	0	0	0	1	1	E3h	2.7600

1	1	1	0	0	1	0	0	E4h	2.7700

1	1	1	0	0	1	0	1	E5h	2.7800

1	1	1	0	0	1	1	0	E6h	2.7900

1	1	1	0	0	1	1	1	E7h	2.8000

1	1	1	0	1	0	0	0	E8h	2.8100

1	1	1	0	1	0	0	1	E9h	2.8200

1	1	1	0	1	0	1	0	EAh	2.8300

1	1	1	0	1	0	1	1	EBh	2.8400

continued...

Processor—Electrical Specifications

B	B	B	B	B	B	B	B	Hex	VCC
i	i	i	i	i	i	i	i
t	t	t	t	t	t	t	t
7	6	5	4	3	2	1	0

1	1	1	0	1	1	0	0	ECh	2.8500

1	1	1	0	1	1	0	1	EDh	2.8600

1	1	1	0	1	1	1	0	EEh	2.8700

1	1	1	0	1	1	1	1	EFh	2.8800

1	1	1	1	0	0	0	0	F0h	2.8900

1	1	1	1	0	0	0	1	F1h	2.9000

1	1	1	1	0	0	1	0	F2h	2.9100

1	1	1	1	0	0	1	1	F3h	2.9200

1	1	1	1	0	1	0	0	F4h	2.9300

1	1	1	1	0	1	0	1	F5h	2.9400

1	1	1	1	0	1	1	0	F6h	2.9500

1	1	1	1	0	1	1	1	F7h	2.9600

1	1	1	1	1	0	0	0	F8h	2.9700

1	1	1	1	1	0	0	1	F9h	2.9800

1	1	1	1	1	0	1	0	FAh	2.9900

1	1	1	1	1	0	1	1	FBh	3.0000

1	1	1	1	1	1	0	0	FCh	3.0100

1	1	1	1	1	1	0	1	FDh	3.0200

1	1	1	1	1	1	1	0	FEh	3.0300

1	1	1	1	1	1	1	1	FFh	3.0400

Desktop 4th Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, and Desktop Intel® Celeron® Processor Family

Datasheet – Volume 1 of 2 94

Image 94

Intel CM8063701212200, CM8064601466200, CM8064601466003, BX80637I73770K manual continued, Processor-Electrical Specifications

Contents

Datasheet - Volume 1 of DecemberDatasheet - Volume 1 of 2 Revision History Contents4.0 Power Management 1.0 IntroductionProcessor-Contents 6.0 Signal Description5.0 Thermal Management 9.0 Processor Ball and Signal Information 7.0 Electrical Specifications8.0 Package Mechanical Specifications 7.8.1 Platform Environment Control Interface PECI DC CharacteristicsFigures Tables Tables-ProcessorProcessor-Tables Revision History Revision History-Processor1.0 Introduction Processor-IntroductionProcessor Figure 1. Platform Block Diagram1.1 Supported Technologies Platform Controller Hub PCHProcessor Core 1.3 Power Management Support1.2 Interfaces System1.6 Terminology 1.4 Thermal Management Support1.5 Package Support TerminologyProcessor-Introduction with Virtual Machine Monitor software, enables multiple, robust independent softwarecontinued Description Introduction-ProcessorTerm continuedProcessor-Introduction 1.7 Related DocumentsRelated Documents DocumentDocument specificationsIntroduction-Processor Document2.0 Interfaces 2.1 System Memory Interface2.1.1 System Memory Technology Supported Supported UDIMM Module ConfigurationsProcessor DIMM Support by Product 2.1.2 System Memory Timing Support Supported SO-DIMM Module Configurations AIO OnlyDDR3 / DDR3L System Memory Timing Support Dual-Channel Symmetric Mode Single-Channel ModeDual-Channel Mode - Intel Flex Memory Technology Mode 2.1.3 System Memory Organization ModesCommand Overlap 2.1.3.2 Intel Fast Memory Access Intel FMA Technology EnhancementsJust-in-Time Command Scheduling 2.1.3.1 System Memory Frequency2.2.1 PCI Express* Support Table 7. PCI Express* Supported Configurations in Desktop Products2.2 PCI Express* Interface 2.1.3.3 Data Scrambling2.2.3 PCI Express* Configuration Mechanism 2.2.2 PCI Express* ArchitecturePCI Express* Port PCI Express* Related Register Structures in the ProcessorPCI Express* Lanes Connection 1 X 4 Controller 2.3 Direct Media Interface DMIFigure 4. PCI Express* Typical Operation 16 Lanes Mapping 1 X 8 ControllerDMI Error Flow DMI Link Down2.4 Processor Graphics 2.5 Processor Graphics Controller GT3D Pipeline Figure 5. Processor Graphics Controller Unit Block Diagram2.5.1 3D and Video Engines for Graphics Processing 3D Engine Execution UnitsClip Stage Vertex Shader VS StageGeometry Shader GS Stage Strips and Fans SF Stage2.5.2 Multi Graphics Controllers Multi-Monitor Support 2.6 Digital Display Interface DDILogical 128-Bit Fixed BLT and 256 Fill Engine Figure 6. Processor Display Architecture DisplayPort Source DeviceSink Device Figure 7. DisplayPort* OverviewFigure 8. HDMI* Overview HDMI SourceHDMI Sink HDMI TxIntegrated Audio Multiple Display Configurationsembedded DisplayPort Table 8. Processor Supported Audio Formats over HDMI*and DisplayPortValid Three Display Configurations through the Processor High-bandwidth Digital Content Protection HDCP2.8 Platform Environmental Control Interface PECI 2.7 Intel Flexible Display Interface Intel FDI2.8.1 PECI Bus Architecture Host / Originator Figure 9. PECI Host-Clients Connection ExamplePECI PECI ClientIntel VT-x Objectives 3.0 Technologies3.1 Intel Virtualization Technology Intel VT ing=VTIntel VT-x Features Intel VT-d Objectives Intel VT-d Features Figure 10. Device to Domain Mapping Structures3.2 Intel Trusted Execution Technology Intel TXT 3.3 Intel Hyper-Threading Technology Intel HT Technology 3.5 Intel Advanced Vector Extensions 2.0 Intel AVX2 3.4 Intel Turbo Boost TechnologyIntel Turbo Boost Technology 2.0 Frequency PCLMULQDQ Instruction 3.6 Intel Advanced Encryption Standard New Instructions Intel AES-NIIntel Secure Key 3.8 Intel 64 Architecture x2APIC 3.10 Execute Disable Bit 3.9 Power Aware Interrupt Routing PAIR3.11 Supervisor Mode Execution Protection SMEP Note Power states availability may vary between the different SKUs 4.0 Power ManagementFigure 11. Processor Power States S0 - Processor Fully powered on full on mode / connected standby modeProcessor Core / Package State Support 4.1 Advanced Configuration and Power Interface ACPI States SupportedSystem States Integrated Memory Controller StatesDirect Media Interface DMI States 4.2 Processor Core Power Management4.2.1 Enhanced Intel SpeedStep Technology Key Features G, S, and C Interface State CombinationsThread 4.2.2 Low-Power Idle StatesFigure 12. Idle Power Management Breakdown of the Processor Cores ThreadCoordination of Thread Power States at the Core Level 4.2.3 Requesting Low-Power Idle StatesFigure 13. Thread and Core C-State Entry and Exit Core C1/C1E State 4.2.4 Core C-State RulesCore C0 State Core C3 StateCore C7 State 4.2.5 Package C-StatesCore C6 State C-State Auto-DemotionCoordination of Core Power States at the Package Level Package C0 State Figure 14. Package C-State Entry and ExitPackage C1/C1E State Package C6 State Package C2 StatePackage C3 State Package C7 State4.2.6 Package C-States and Display Resolutions Deepest Package C-State Available4.3 Integrated Memory Controller IMC Power Management 4.3.1 Disabling Unused System Memory Outputs4.3.2 DRAM Power Management and Initialization No power-down CKE disable4.3.2.1 Initialization Role of CKE 4.3.2.3 Dynamic Power-Down4.3.2.2 Conditional Self-Refresh 4.3.3 DRAM Running Average Power Limitation RAPL 4.4 PCI Express* Power Management4.5 Direct Media Interface DMI Power Management 4.3.4 DDR Electrical Power Gating EPG4.6.2 Graphics Render C-State 4.6 Graphics Power Management4.6.1 Intel Rapid Memory Power Management Intel RMPM 4.6.3 Intel Graphics Dynamic Frequency5.0 Thermal Management Thermal Management-ProcessorTemperature on page Desktop Processor Thermal Specifications5.1 Desktop Processor Thermal Profiles Processor-Thermal ManagementTTV Power W 5.1.1 Processor PCG 2013D Thermal ProfileTCASE = 0.33 * Power + Casecontinued 5.1.2 Processor PCG 2013C Thermal ProfileProcessor-Thermal Management continuedThermal Management-Processor 5.1.3 Processor PCG 2013B Thermal Profilecontinued 5.1.4 Processor PCG 2013A Thermal Profile Processor-Thermal ManagementMeasure TCASE at the geometric center of the package 5.2 Thermal Metrology5.3 Fan Speed Control Scheme with Digital Thermal Sensor DTS 37.5 37.5Figure 20. Digital Thermal Sensor DTS 1.1 Definition Points ΨCA = TCASE-MAX - TAMBIENT-TARGET / TDP5.4 Fan Speed Control Scheme with Digital Thermal Sensor DTS Figure 21. Digital Thermal Sensor DTS Thermal Profile Definition 5.5 Processor TemperatureThermal Margin Slope 5.6 Adaptive Thermal Monitor Frequency ControlClock Modulation Critical Temperature FlagImmediate Transition to Combined TM1 and TM2 PROCHOT# Signal 5.7 THERMTRIP# Signal 5.8 Digital Thermal Sensor5.9 Intel Turbo Boost Technology Thermal Considerations 5.9.1 Intel Turbo Boost Technology Power Control and Reporting5.8.1 Digital Thermal Sensor Accuracy Taccuracy 5.9.2 Package Power Control Intel Turbo Boost Technology 2.0 Package Power Control SettingsFigure 22. Package Power Control 5.9.3 Turbo Time ParameterSignal Description Buffer Types 6.0 Signal Description6.1 System Memory Interface Signals Memory Channel A SignalsWrite Enable Control Signal This signal is used with Memory Channel B SignalsSignal Description-Processor continuedProcessor-Signal Description 6.2 Memory Reference and Compensation SignalsMemory Reference and Compensation Signals DDR3/DDR3L Reference Voltage This signal is used asSignal Description-Processor 6.3 Reset and Miscellaneous SignalsReset and Miscellaneous Signals CFG3 MSR Privacy Bit FeaturePCI Express* Graphics Interface Signals 6.4 PCI Express*-Based Interface Signals6.5 Display Interface Signals Display Interface SignalsPhase Locked Loop PLL Signals 6.7 Phase Locked Loop PLL Signals6.8 Testability Signals Testability SignalsError and Thermal Protection Signals 6.9 Error and Thermal Protection Signals6.10 Power Sequencing Signals Power Sequencing Signals6.13 Ground and Non-Critical to Function NCTF Signals 6.11 Processor Power Signals6.12 Sense Signals Processor Power Signals7.1 Integrated Voltage Regulator 7.0 Electrical Specifications7.2 Power and Ground Lands 7.3 VCC Voltage Identification VIDcontinued Table 45. Voltage Regulator VR 12.5 Voltage IdentificationElectrical Specifications-Processor continuedcontinued Processor-Electrical Specificationscontinued continued Electrical Specifications-Processorcontinued Processor-Electrical Specifications continued7.5 Signal Groups 7.4 Reserved or Unused SignalsSignal Groups Power / Ground / Other DDR3 / DDR3L Data SignalsDDR3 / DDR3L Reference Voltage Signals DDR3 / DDR3L CompensationPCI Express* Graphics 7.6 Test Access Port TAP Connection7.7 DC Specifications Digital Media Interface DMIProcessor-Electrical Specifications 7.8 Voltage and Current Specificationscontinued Electrical Specifications-Processor Processor-Electrical Specifications DDR3 / DDR3L Signal Group DC SpecificationsVCCIOOUT, VCOMPOUT, and VCCIOTERM continuedDigital Display Interface Group DC Specifications Electrical Specifications-ProcessorGTL Signal Group and Open Drain Signal Group DC Specifications embedded DisplayPort* eDP* Group DC SpecificationsCMOS Signal Group DC Specifications Processor-Electrical SpecificationsElectrical Specifications-Processor 7.8.1 Platform Environment Control Interface PECI DC CharacteristicsPCI Express* DC Specifications continuedFigure 23. Input Device Hysteresis 7.8.2 Input Device HysteresisProcessor-Electrical Specifications Figure 24. Processor Package Assembly Sketch 8.0 Package Mechanical Specifications8.2 Package Loading Specifications 8.1 Processor Component Keep-Out ZoneProcessor Loading Specifications 8.4 Package Insertion Specifications8.5 Processor Mass Specification 8.3 Package Handling GuidelinesProcessor Materials 8.7 Processor Markings8.8 Processor Land Coordinates Figure 25. Processor Top-Side MarkingsFigure 26. Processor Package Land Coordinates 8.9 Processor Storage SpecificationsProcessor Storage Specifications Processor-Package Mechanical SpecificationsRHsustained storage Package Mechanical Specifications-ProcessorTIMEsustained storage 9.0 Processor Ball and Signal Information Processor Ball List by Signal Namecontinued Processor Ball and Signal Information-Processorcontinued continuedcontinued Processor-Processor Ball and Signal Informationcontinued continuedSignal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #continued continuedcontinued AU20Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #