Intel CM8064601466200, CM8064601466003 Thermal Management Support, Package Support, Terminology

Introduction—Processor

1.4Thermal Management Support

•Digital Thermal Sensor

•Adaptive Thermal Monitor

•THERMTRIP# and PROCHOT# support

•On-Demand Mode

•Memory Open and Closed Loop Throttling

•Memory Thermal Throttling

•External Thermal Sensor (TS-on-DIMM and TS-on-Board)

•Render Thermal Throttling

•Fan speed control with DTS

1.5Package Support

The processor socket type is noted as LGA1150. The package is a 37.5 x 37.5 mm Flip Chip Land Grid Array (FCLGA 1150). See the appropriate Processor Thermal Mechanical Design Guidelines and LGA1150 Socket Application Guide for complete details on the package.

1.6Terminology

Table 1.	Terminology
	Term	Description
	APD	Active Power-down
	B/D/F	Bus/Device/Function
	BGA	Ball Grid Array
	BLC	Backlight Compensation
	BLT	Block Level Transfer
	BPP	Bits per pixel
	CKE	Clock Enable
	CLTM	Closed Loop Thermal Management
	DDI	Digital Display Interface
	DDR3	Third-generation Double Data Rate SDRAM memory technology
	DLL	Delay-Locked Loop
	DMA	Direct Memory Access
	DMI	Direct Media Interface
	DP	DisplayPort*
	DTS	Digital Thermal Sensor
	DVI*	Digital Visual Interface. DVI* is the interface specified by the DDWG (Digital Display
		Working Group)
	EC	Embedded Controller

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Desktop 4th Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, and Desktop Intel® Celeron® Processor Family

December 2013	Datasheet – Volume 1 of 2
Order No.: 328897-004	13