Electrical
Symbol | Parameter | Min | Typ | Max | Unit | Note1 | |
ICC | 2013A PCG | — | — | 48 | A | 4, 8 | |
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PMAX | 2013D PCG | — | — | 153 | W | 9 | |
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PMAX | 2013C PCG | — | — | 121 | W | 9 | |
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PMAX | 2013B PCG | — | — | 99 | W | 9 | |
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PMAX | 2013A PCG | — | — | 83 | W | 9 | |
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Notes: 1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data.
2.Each processor is programmed with a maximum valid voltage identification value (VID) that is set at manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within the VID range. This differs from the VID employed by the processor during a power management event (Adaptive Thermal Monitor, Enhanced Intel SpeedStep Technology, or
3.The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE lands at the socket with a
4.ICC_MAX specification is based on the VCC loadline at worst case (highest) tolerance and ripple.
5.The VCC specifications represent static and transient limits.
6.The loadlines specify voltage limits at the die measured at the VCC_SENSE and VSS_SENSE lands. Voltage regulation feedback for voltage regulator circuits must also be taken from processor VCC_SENSE and VSS_SENSE lands.
7.PSx refers to the voltage regulator power state as set by the SVID protocol.
8.PCG is Platform Compatibility Guide (previously known as FMB). These guidelines are for estimation purposes only.
9.PMAX is the maximum power the processor will dissipate as measured at VCC_SENSE and VSS_SENSE lands. The processor may draw this power for up to 10 ms before it regulates to PL2.
Table 48. Memory Controller (VDDQ) Supply DC Voltage and Current Specifications
Symbol | Parameter | Min | Typ | Max | Unit | Note | ||
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VDDQ (DC+AC) | Processor I/O supply |
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voltage for DDR3/DDR3L | 1.5 | Typ+5% | V | 2, 3, 5 | ||||
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VDDQ (DC+AC) | Processor I/O supply |
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voltage for DDR3L (DC + | 1.35 | Typ+5% | V | 2, 3 | ||||
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AC specification) |
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IccMAX_VDDQ (DDR3/ | Max Current for VDDQ Rail | — | — | 2.5 | A | 1 | ||
DDR3L) |
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ICCAVG_VDDQ (Standby) | Average Current for VDDQ | — | 12 | 20 | mA | 4 | ||
Rail during Standby |
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Notes: 1. | The current supplied to the |
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2. | Includes AC and DC error, where the AC noise is bandwidth limited to under 20 MHz. |
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3. | No requirement on the breakdown of AC versus DC noise. |
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4. | Measured at 50 °C |
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5. | This specification applies to desktop processors |
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Desktop 4th Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, and Desktop Intel® Celeron® Processor Family
December 2013 | Datasheet – Volume 1 of 2 |
Order No.: | 99 |