Intel BX80646I74770, CM8064601466200, CM8064601466003 manual Electrical Specifications-Processor

Models: BX80633I74960X BX80646I34130 BX80646I54430 BX80646I74770K BX80646I74770 BX80646I54570S BX80646I74770S BXF80646I74770K CM8063701159502 CM8063701212200 BX80637I73770K CM8064601466003 CM8064601466200

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Electrical Specifications—Processor

Symbol

Parameter

Min

Typ

Max

Unit

Note1

ICC

2013A PCG

48

A

4, 8

ICC

 

 

 

 

 

 

 

 

 

 

 

 

 

PMAX

2013D PCG

153

W

9

PMAX

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PMAX

2013C PCG

121

W

9

PMAX

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PMAX

2013B PCG

99

W

9

PMAX

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PMAX

2013A PCG

83

W

9

PMAX

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Notes: 1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data.

2.Each processor is programmed with a maximum valid voltage identification value (VID) that is set at manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within the VID range. This differs from the VID employed by the processor during a power management event (Adaptive Thermal Monitor, Enhanced Intel SpeedStep Technology, or Low-Power States).

3.The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE lands at the socket with a 20-MHz bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1- MΩ minimum impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.

4.ICC_MAX specification is based on the VCC loadline at worst case (highest) tolerance and ripple.

5.The VCC specifications represent static and transient limits.

6.The loadlines specify voltage limits at the die measured at the VCC_SENSE and VSS_SENSE lands. Voltage regulation feedback for voltage regulator circuits must also be taken from processor VCC_SENSE and VSS_SENSE lands.

7.PSx refers to the voltage regulator power state as set by the SVID protocol.

8.PCG is Platform Compatibility Guide (previously known as FMB). These guidelines are for estimation purposes only.

9.PMAX is the maximum power the processor will dissipate as measured at VCC_SENSE and VSS_SENSE lands. The processor may draw this power for up to 10 ms before it regulates to PL2.

Table 48. Memory Controller (VDDQ) Supply DC Voltage and Current Specifications

Symbol

Parameter

Min

Typ

Max

Unit

Note

 

 

 

 

 

 

 

 

VDDQ (DC+AC)

Processor I/O supply

 

 

 

 

 

voltage for DDR3/DDR3L

Typ-5%

1.5

Typ+5%

V

2, 3, 5

DDR3/DDR3L

(DC + AC specification)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VDDQ (DC+AC)

Processor I/O supply

 

 

 

 

 

voltage for DDR3L (DC +

Typ-5%

1.35

Typ+5%

V

2, 3

DDR3/DDR3L

AC specification)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IccMAX_VDDQ (DDR3/

Max Current for VDDQ Rail

2.5

A

1

DDR3L)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ICCAVG_VDDQ (Standby)

Average Current for VDDQ

12

20

mA

4

Rail during Standby

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Notes: 1.

The current supplied to the SO-DIMM modules is not included in this specification.

 

2.

Includes AC and DC error, where the AC noise is bandwidth limited to under 20 MHz.

 

3.

No requirement on the breakdown of AC versus DC noise.

 

 

 

4.

Measured at 50 °C

 

 

 

 

 

5.

This specification applies to desktop processors

 

 

 

 

 

 

 

 

 

 

 

 

Desktop 4th Generation Intel® CoreProcessor Family, Desktop Intel® Pentium® Processor Family, and Desktop Intel® Celeron® Processor Family

December 2013

Datasheet – Volume 1 of 2

Order No.: 328897-004

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Intel BX80646I74770, CM8064601466200, CM8064601466003, BX80637I73770K, CM8063701212200 Electrical Specifications-Processor