Processor—Thermal Management
December 2013 Order No.: 328897-004

Processor—Thermal Management

Table 21.

Desktop Processor Thermal Specifications

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Product

 

PCG8

Max

Max

 

Min

Max

Max

Min

TTV

Min

 

Max

 

 

 

Power

Power

 

Power

Power

Power

Power

Thermal

TCASE

 

TTV

 

 

 

Packag

Packag

 

Package

Packag

Package

Package

Design

(°C)

 

TCASE

 

 

 

e C1E

e C3

 

C3 (W)9

e C6

C7 (W) 1,

C6/C7

Power

 

 

(°C)

 

 

 

(W) 1, 2,

(W) 1, 3,

 

 

(W) 1, 4,

4, 5, 9

(W)9

(W) 6, 7,

 

 

 

 

 

 

5, 9

5, 9

 

 

5, 9

 

 

10

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Processo

Quad

 

 

 

 

 

 

 

 

 

 

 

 

r (PCG

Core

 

 

 

 

 

 

 

 

 

 

 

 

2013D)

Processor

 

2013D

26

20

 

1.0

3.5

3.4

0

84

5

 

Thermal

with

 

 

 

 

 

 

 

 

 

 

 

 

Profile

Graphics

 

 

 

 

 

 

 

 

 

 

 

 

on page

 

 

 

 

 

 

 

 

 

 

 

 

 

67

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Processo

Quad

 

 

 

 

 

 

 

 

 

 

 

 

r (PCG

Core

 

 

 

 

 

 

 

 

 

 

 

 

2013C)

Processor

 

2013C

23

17

 

1.0

3.5

3.4

0

65

5

 

Thermal

with

 

 

 

 

 

 

 

 

 

 

 

 

Profile

Graphics

 

 

 

 

 

 

 

 

 

 

 

 

on page

 

 

 

 

 

 

 

 

 

 

 

 

 

68

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Processo

Quad

 

 

 

 

 

 

 

 

 

 

 

 

r (PCG

Core

 

 

 

 

 

 

 

 

 

 

 

 

2013B)

Processor

 

2013B

18

11

 

1.0

3.5

3.4

0

45

5

 

Thermal

with

 

 

 

 

 

 

 

 

 

 

 

 

Profile

Graphics

 

 

 

 

 

 

 

 

 

 

 

 

on page

 

 

 

 

 

 

 

 

 

 

 

 

 

69

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Quad

 

 

 

 

 

 

 

 

 

 

 

 

 

Core

 

 

 

 

 

 

 

 

 

 

 

 

Processo

Processor

 

 

16

16

 

1.0

3.5

3.4

0

35

5

 

 

 

 

 

r (PCG

with

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2013A)

Graphics

 

 

 

 

 

 

 

 

 

 

 

 

 

2013A

 

 

 

 

 

 

 

 

 

 

Thermal

 

 

 

 

 

 

 

 

 

 

 

 

Dual Core

 

 

 

 

 

 

 

 

 

 

 

 

Profile

 

 

 

 

 

 

 

 

 

 

 

 

on page

Processor

 

 

16

16

 

1.0

3.5

3.4

0

35

5

 

 

 

 

 

70

with

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Graphics

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Notes: 1. The package C-state power is the worst case power in the system configured as follows:

 

 

 

a. Memory configured for DDR3 1333 and populated with two DIMMs per channel.

 

 

 

 

b. DMI and PCIe links are at L1.

 

 

 

 

 

 

 

 

2. Specification at DTS = 50 °C and minimum voltage loadline.

 

 

 

 

 

3. Specification at DTS = 50 °C and minimum voltage loadline.

 

 

 

 

 

4. Specification at DTS = 35 °C and minimum voltage loadline.

 

 

 

 

 

5. These DTS values in Notes 2 – 4 are based on the TCC Activation MSR having a value of 100, see Processor

 

Temperature on page 74.

 

 

 

 

 

 

 

 

6. These values are specified at VCC_MAX and VNOM for all other voltage rails for all processor frequencies. Systems

must be designed to ensure the processor is not to be subjected to any static VCC and ICC combination wherein VCCP

exceeds VCCP_MAX at specified ICCP. See the loadline specifications.

 

 

 

 

 

7. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the

 

maximum power that the processor can dissipate. TDP is measured at DTS = -1. TDP is achieved with the Memory

configured for DDR3 1333 and 2 DIMMs per channel.

 

 

 

 

 

 

8. Platform Compatibility Guide (PCG) (previously known as FMB) provides a design target for meeting all planned

processor frequency requirements.

 

 

 

 

 

 

 

 

9. Not 100% tested. Specified by design characterization.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

5.1Desktop Processor Thermal Profiles

This section provides thermal profiles for the Desktop processor families.

Desktop 4th Generation Intel® CoreProcessor Family, Desktop Intel® Pentium® Processor Family, and Desktop Intel® Celeron® Processor Family

Datasheet – Volume 1 of 2 66

Page 66
Image 66
Intel CM8064601466003 Desktop Processor Thermal Profiles, Desktop Processor Thermal Specifications, Temperature on page

BX80633I74960X, BX80646I34130, BX80646I54430, BX80646I74770K, BX80646I74770 specifications

The Intel CM8063701159502, or BX80637I53470, is a powerful CPU designed for modern computing needs. This processor belongs to Intel's 4th generation of Core i5 processors, commonly known as "Haswell". It showcases Intel's commitment to enhancing performance, increasing energy efficiency, and delivering an enriching user experience.

One of the main features of the Intel Core i5-3470 is its quad-core architecture. This allows the processor to handle multiple threads simultaneously, making it adept at multitasking and running demanding applications efficiently. With a base clock speed of 3.2 GHz, it can boost up to 3.6 GHz using Intel’s Turbo Boost technology, providing additional power when needed for intensive tasks like gaming or video editing.

The Intel i5-3470 features Intel's HD Graphics 2500, which offers decent graphics performance for everyday tasks and casual gaming. This integrated graphics solution is capable of delivering high-definition visuals and supports DirectX 11, making it suitable for lightweight gaming experiences without the need for an additional dedicated graphics card.

Another standout characteristic of the BX80637I53470 is its support for Intel Smart Cache, which is an advanced caching technology. It provides a shared cache pool that enhances performance by reducing the time it takes to access frequently used data. This feature, coupled with Intel's instruction set architecture, allows for improved processing agility and efficiency across applications.

The processor is built on a 22nm manufacturing process, which results in reduced power consumption and heat generation compared to its predecessors. It has a thermal design power (TDP) of 77 watts, making it energy efficient while still delivering robust performance. Additionally, the Core i5-3470 supports DDR3 memory, with speeds up to 1600 MHz, enabling quick data retrieval and improved system responsiveness.

Security is another important aspect of the Intel i5-3470, featuring Intel Secure Key and Intel AES New Instructions (AES-NI), which protect sensitive data and enhance encryption performance.

In conclusion, the Intel CM8063701159502, or BX80637I53470, encapsulates modern computing technology with its powerful quad-core performance, integrated graphics, energy efficiency, and robust security features, making it a versatile choice for a wide range of computing tasks. Whether users are engaging in casual gaming, productivity tasks, or multimedia consumption, this processor demonstrates a solid balance of performance and efficiency, providing an excellent computing experience overall.