Intel CM8064601466003 manual Desktop Processor Thermal Profiles, Processor-Thermal Management

December 2013 Order No.: 328897-004

Processor—Thermal Management

Table 21.	Desktop Processor Thermal Specifications
Product	PCG8	Max	Max	Min	Max	Max	Min	TTV	Min	Max
		Power	Power	Power	Power	Power	Power	Thermal	TCASE	TTV
		Packag	Packag	Package	Packag	Package	Package	Design	(°C)	TCASE
		e C1E	e C3	C3 (W)9	e C6	C7 (W) 1,	C6/C7	Power		(°C)
		(W) 1, 2,	(W) 1, 3,		(W) 1, 4,	4, 5, 9	(W)9	(W) 6, 7,
		5, 9	5, 9		5, 9			10
										Processo
Quad										r (PCG
Core										2013D)
Processor	2013D	26	20	1.0	3.5	3.4	0	84	5	Thermal
with										Profile
Graphics										on page
										67
										Processo
Quad										r (PCG
Core										2013C)
Processor	2013C	23	17	1.0	3.5	3.4	0	65	5	Thermal
with										Profile
Graphics										on page
										68
										Processo
Quad										r (PCG
Core										2013B)
Processor	2013B	18	11	1.0	3.5	3.4	0	45	5	Thermal
with										Profile
Graphics										on page
										69
Quad
Core										Processo
Processor		16	16	1.0	3.5	3.4	0	35	5
										r (PCG
with
										2013A)
Graphics
	2013A									Thermal
Dual Core										Profile
										on page
Processor		16	16	1.0	3.5	3.4	0	35	5
										70
with
Graphics
Notes: 1. The package C-state power is the worst case power in the system configured as follows:
a. Memory configured for DDR3 1333 and populated with two DIMMs per channel.
b. DMI and PCIe links are at L1.
2. Specification at DTS = 50 °C and minimum voltage loadline.
3. Specification at DTS = 50 °C and minimum voltage loadline.
4. Specification at DTS = 35 °C and minimum voltage loadline.
5. These DTS values in Notes 2 – 4 are based on the TCC Activation MSR having a value of 100, see Processor
Temperature on page 74.
6. These values are specified at VCC_MAX and VNOM for all other voltage rails for all processor frequencies. Systems
must be designed to ensure the processor is not to be subjected to any static VCC and ICC combination wherein VCCP
exceeds VCCP_MAX at specified ICCP. See the loadline specifications.
7. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at DTS = -1. TDP is achieved with the Memory
configured for DDR3 1333 and 2 DIMMs per channel.
8. Platform Compatibility Guide (PCG) (previously known as FMB) provides a design target for meeting all planned
processor frequency requirements.
9. Not 100% tested. Specified by design characterization.

5.1Desktop Processor Thermal Profiles

This section provides thermal profiles for the Desktop processor families.

Desktop 4th Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, and Desktop Intel® Celeron® Processor Family

Datasheet – Volume 1 of 2 66